Works about DIRECT currents
1
- International Journal of High Speed Electronics & Systems, 2025, v. 34, n. 2, p. 1, doi. 10.1142/S0129156424400093
- Article
2
- School Science & Mathematics, 2007, v. 107, n. 1, p. 371, doi. 10.1111/j.1949-8594.2007.tb17760.x
- Jabot, Michael;
- Henry, David
- Article
3
- 2019
- Pérez-López, Faustino R.;
- Bueno-Notivol, Juan;
- Hernandez, Adrian V.;
- Vieira-Baptista, Pedro;
- Preti, Mario;
- Bornstein, Jacob
- journal article
4
- Surface Engineering, 2017, v. 33, n. 3, p. 231, doi. 10.1080/02670844.2016.1216264
- Yuan, X.;
- Xu, W.;
- Huang, F.;
- Chen, D.;
- Wei, Q.
- Article
5
- Surface Engineering, 2016, v. 32, n. 7, p. 501, doi. 10.1080/02670844.2016.1148323
- Reddy, R. Mohan;
- Praveen, B. M.;
- Chandrappa, K. G.;
- Nayana, K. O.
- Article
6
- Surface Engineering, 2015, v. 31, n. 8, p. 612, doi. 10.1179/1743294415Y.0000000076
- Article
7
- Surface Engineering, 2014, v. 30, n. 2, p. 102, doi. 10.1179/1743294413Y.0000000225
- Khan, R. H. U.;
- Yerokhin, A. L.;
- Li, X.;
- Dong, H.;
- Matthews, A.
- Article
8
- Surface Engineering, 2012, v. 28, n. 7, p. 498, doi. 10.1179/1743294412Y.0000000002
- Gu, Y H;
- Chen, C-f;
- Bandopadhyay, S;
- Ning, C Y;
- Guo, Y J
- Article
9
- Surface Engineering, 2011, v. 27, n. 10, p. 775, doi. 10.1179/174329408X326335
- Mohan, S;
- Saravanan, G;
- Renganathan, N G
- Article
10
- Surface Engineering, 2011, v. 27, n. 5, p. 393, doi. 10.1179/026708408X339064
- Rahman, A;
- Jayaganthan, R;
- Prakash, S;
- Chawla, V;
- Chandra, R
- Article
11
- Surface Engineering, 2011, v. 27, n. 2, p. 134, doi. 10.1179/026708410X12593178265625
- Xie, F;
- Hu, J;
- Zhou, Z‐H;
- Hu, H‐B;
- Li, J‐H;
- Pan, J‐W
- Article
12
- Surface Engineering, 2006, v. 22, n. 2, p. 147, doi. 10.1179/174329406X98485
- Đurišić, Ž.;
- Kunosić, A.;
- Trifunović, J.
- Article
13
- International Journal of Wavelets, Multiresolution & Information Processing, 2020, v. 18, n. 1, p. N.PAG, doi. 10.1142/S0219691319410042
- Balamurugan, K.;
- Mahalakshmi, R.
- Article
14
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 19, p. 18135, doi. 10.1007/s10854-019-02166-3
- Yu, Shihu;
- Wang, Shihang;
- Tariq Nazir, M.;
- Wang, Weiwang;
- Li, Shengtao;
- Phung, Toan;
- Takada, Tatsuo
- Article
15
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 13321, doi. 10.1007/s10854-019-01699-x
- Chi, Qingguo;
- Yang, Meng;
- Zhang, Tiandong;
- Zhang, Changhai
- Article
16
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11676, doi. 10.1007/s10854-019-01526-3
- Wang, Jingze;
- Mao, Dongxin;
- Shi, Lei;
- Chen, Hongtao;
- Li, Feng;
- Li, Manning;
- Xia, Ruihan
- Article
17
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 18, p. 15671, doi. 10.1007/s10854-018-9165-2
- Nwakanma, O.;
- Reyes, P.;
- Velumani, S.
- Article
18
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 12, p. 10170, doi. 10.1007/s10854-018-9066-4
- Sun, Nana;
- Zhou, Dayu;
- Zhao, Peng;
- Li, Shuaidong;
- Wang, Jingjing;
- Chu, Shichao;
- Ali, Faizan;
- Xu, Jin
- Article
19
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 11, p. 9052, doi. 10.1007/s10854-018-8931-5
- Lu, Linlin;
- Luo, Fa;
- Qing, Yuchang;
- Zhou, Wancheng;
- Zhu, Dongmei
- Article
20
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 18, p. 13336, doi. 10.1007/s10854-017-7170-5
- Batra, Ashok;
- Bohara, Bir;
- Mills, Jonathan;
- Wright, Rojae;
- Kenney, Brianna
- Article
21
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 18, p. 13797, doi. 10.1007/s10854-017-7225-7
- Suhailath, K.;
- Ramesan, M.
- Article
22
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 13, p. 9338, doi. 10.1007/s10854-017-6672-5
- Nguyen, Tien;
- Kim, Eui-Tae;
- Kim, Jun;
- Lee, Sang;
- Hoang, Van;
- Dao, Khac
- Article
23
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 6, p. 4695, doi. 10.1007/s10854-016-6110-0
- Boonlakhorn, Jakkree;
- Kidkhunthod, Pinit;
- Chanlek, Narong;
- Thongbai, Prasit
- Article
24
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 2, p. 1715, doi. 10.1007/s10854-016-5717-5
- Kumar, Vipin;
- Agarwal, Sonalika;
- Dwivedi, D.
- Article
25
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 7, p. 7420, doi. 10.1007/s10854-016-4717-9
- Ma, L.;
- Zhou, L.;
- Liu, T.;
- Zhao, S.;
- Li, L.;
- Wu, X.;
- Zhang, Y.;
- Cheng, G.
- Article
26
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 3, p. 3026, doi. 10.1007/s10854-015-4125-6
- Wang, J.;
- Zhang, Q.;
- Yang, G.;
- Yao, C.;
- Li, Y.;
- Sun, R.;
- Zhao, J.;
- Gao, S.
- Article
27
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 8, p. 5703, doi. 10.1007/s10854-015-3125-x
- Zhu, S.;
- Ban, C.;
- Jiang, L.
- Article
28
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 5, p. 3275, doi. 10.1007/s10854-015-2827-4
- Huan, Li;
- Tang, Xiaoli;
- Su, Hua;
- Zhang, Huaiwu;
- Jing, Yulan
- Article
29
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 3, p. 1763, doi. 10.1007/s10854-014-2605-8
- Amara, Saad;
- Bouafia, Mohamed
- Article
30
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 11, p. 4992, doi. 10.1007/s10854-014-2262-y
- Senol, S.;
- Senol, A.;
- Ozturk, O.;
- Erdem, M.
- Article
31
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 10, p. 4538, doi. 10.1007/s10854-014-2201-y
- Zhou, Peng;
- Kang, Huijun;
- Cao, Fei;
- Fu, Yanan;
- Xiao, Tiqiao;
- Wang, Tongmin
- Article
32
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 2, p. 770, doi. 10.1007/s10854-012-0808-4
- Wang, Yiliang;
- Chen, Xiuli;
- Zhou, Huanfu;
- Fang, Liang;
- Liu, Laijun;
- Zhang, Hui
- Article
33
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 2, p. 618, doi. 10.1007/s10854-012-0877-4
- Article
34
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 12, p. 2117, doi. 10.1007/s10854-012-0712-y
- Elimat, Z.;
- Hussain, W.;
- Zihlif, A.
- Article
35
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 12, p. 2221, doi. 10.1007/s10854-012-0766-x
- Zhao, Jin;
- Gao, Yulai;
- Zhang, Weipeng;
- Song, Tingting;
- Zhai, Qijie
- Article
36
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 290, doi. 10.1007/s10854-011-0407-9
- Cen, Jiabao;
- Jin, Hao;
- Wang, Demiao
- Article
37
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 3, p. 217, doi. 10.1007/s10854-010-0116-9
- Gu, X.;
- Yung, K.;
- Chan, Y.;
- Yang, D.
- Article
38
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 12, p. 1203, doi. 10.1007/s10854-007-9314-5
- Saq'an, S.;
- Zihlif, A. M.;
- Al-Ani, R. S.;
- Ragosta, G.
- Article
39
- Microbial Ecology, 2020, v. 79, n. 1, p. 38, doi. 10.1007/s00248-019-01381-z
- Pillot, Guillaume;
- Davidson, Sylvain;
- Auria, Richard;
- Combet-Blanc, Yannick;
- Godfroy, Anne;
- Liebgott, Pierre-Pol
- Article
40
- International Journal of Advanced Manufacturing Technology, 2021, v. 113, n. 11/12, p. 3189, doi. 10.1007/s00170-021-06787-z
- Igizianova, Nadezhda Alexandrowna;
- Sokolova, Elena Vladimirovna
- Article
41
- International Journal of Advanced Manufacturing Technology, 2019, v. 105, n. 7/8, p. 3261, doi. 10.1007/s00170-019-04529-w
- Fang, Ming;
- Chen, Yuanlong;
- Jiang, Lijun;
- Su, Yongsheng;
- Liang, Yi
- Article
42
- International Journal of Advanced Manufacturing Technology, 2019, v. 105, n. 1-4, p. 579, doi. 10.1007/s00170-019-04209-9
- Article
43
- International Journal of Advanced Manufacturing Technology, 2019, v. 104, n. 5-8, p. 2899, doi. 10.1007/s00170-019-04175-2
- Assunção, P. D. C.;
- Ribeiro, R. A.;
- Dos Santos, E. B. F.;
- Braga, E. M.;
- Gerlich, A. P.
- Article
44
- International Journal of Advanced Manufacturing Technology, 2019, v. 102, n. 5-8, p. 2183, doi. 10.1007/s00170-018-03225-5
- Li, Hao;
- Wang, Qiang;
- He, Fang;
- Zheng, Yayun;
- Sun, Yaqian
- Article
45
- Hydrogeology Journal, 2014, v. 22, n. 5, p. 1163, doi. 10.1007/s10040-014-1107-3
- Attwa, M.;
- Basokur, A.;
- Akca, I.
- Article
46
- Granular Matter, 2010, v. 12, n. 4, p. 375, doi. 10.1007/s10035-010-0185-8
- Article
47
- Electrical Engineering, 2018, v. 100, n. 3, p. 1913, doi. 10.1007/s00202-017-0673-5
- Sri Revathi, B.;
- Mahalingam, Prabhakar
- Article
48
- Electrical Engineering, 2018, v. 100, n. 3, p. 1901, doi. 10.1007/s00202-017-0670-8
- Alam, Mohammad Tawhidul;
- Ahsan, Q.
- Article
49
- Electrical Engineering, 2018, v. 100, n. 3, p. 1785, doi. 10.1007/s00202-017-0655-7
- Sahin, Yakup;
- Ting, Naim Suleyman
- Article
50
- Electrical Engineering, 2018, v. 100, n. 3, p. 1565, doi. 10.1007/s00202-017-0635-y
- Fuengwarodsakul, Nisai H.;
- De Doncker, Rik W.
- Article