Works matching DE "DIFFUSION bonding (Metals)"
1
- Iranian Journal of Materials Science & Engineering, 2025, v. 22, n. 2, p. 1, doi. 10.22068/ijmse.3776
- Vatnalmath, Manjunath;
- Auradi, Virupaxi;
- Murthy, Bharath Vedashantha;
- Nagaral, Madeva;
- Shetty, Suresh;
- Kumar, G. B. Veeresh
- Article
3
- Surface Engineering, 2016, v. 32, n. 12, p. 908, doi. 10.1080/02670844.2015.1104099
- Mola, Renata;
- Dziadoń, Andrzej;
- Jagielska-Wiaderek, Karina
- Article
4
- Surface Engineering, 2007, v. 23, n. 1, p. 52, doi. 10.1179/174329407X161591
- Matijević, B.;
- Stupnišek, M.
- Article
5
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 21, p. 18852, doi. 10.1007/s10854-018-0010-4
- Zhang, Gang;
- Xing, Guoliang;
- Li, Juntong;
- Zhang, Xinyu;
- Lang, Jihui;
- Zhao, Lina;
- Wang, Jin;
- Jiang, Wenlong
- Article
6
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 12, p. 10246, doi. 10.1007/s10854-018-9076-2
- Bao, Yudian;
- Shao, Huakai;
- Zhao, Yue;
- Zou, Guisheng;
- Wu, Aiping
- Article
7
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 10, p. 8279, doi. 10.1007/s10854-018-8836-3
- Zeng, Ziqing;
- Wu, Qiuchen;
- Hao, Mengmeng;
- Lu, Wenzhong;
- Fan, Guifen;
- Yuchi, Ming;
- Ding, Mingyue
- Article
8
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 18, p. 13283, doi. 10.1007/s10854-017-7163-4
- Yao, Guo-Guang;
- Pei, Cui-Jin;
- Liu, Peng;
- Xing, Hui-Yu;
- Fu, Long-Xi;
- Liang, Bai-Cheng
- Article
9
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 18, p. 13806, doi. 10.1007/s10854-017-7226-6
- Djemal, Amal;
- Louati, Bassem;
- Guidara, Kamel
- Article
10
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 18, p. 14049, doi. 10.1007/s10854-017-7256-0
- Wu, Bo;
- Ma, Jian;
- Wu, Wenjuan;
- Chen, Min
- Article
11
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 18, p. 13970, doi. 10.1007/s10854-017-7246-2
- Xia, C.;
- Chen, G.;
- Yuan, C.;
- Zhou, C.
- Article
12
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3347, doi. 10.1007/s10854-015-4164-z
- Wu, Yuan-Yun;
- Chen, Yi-Ling;
- Lee, Chin
- Article
13
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 3, p. 1512, doi. 10.1007/s10854-014-2569-8
- Qing, Zhenjun;
- Li, Bo;
- Li, Yingxiang;
- Li, Hao;
- Zhang, Shuren
- Article
14
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 8, p. 2833, doi. 10.1007/s10854-013-1179-1
- Baheti, Varun;
- Ravi, Raju;
- Paul, Aloke
- Article
15
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 9, p. 1673, doi. 10.1007/s10854-012-0645-5
- Li, Chundong;
- Lv, Jinpeng;
- Liang, Zhiqiang
- Article
16
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 10, p. 965, doi. 10.1007/s10854-007-9428-9
- Shaw, Derek;
- Capper, Peter
- Article
17
- Journal of Materials Science Letters, 2003, v. 22, n. 10, p. 759, doi. 10.1023/A:1023768414427
- Junqin Li;
- Guangming Zhu;
- Ping Xiao
- Article
18
- Strength of Materials, 2017, v. 49, n. 3, p. 422, doi. 10.1007/s11223-017-9882-4
- Ermolaev, G.;
- Martynenko, V.;
- Olekseenko, S.;
- Labartkava, A.;
- Matvienko, M.
- Article
19
- Crystallography Reports, 2004, v. 49, n. 4, p. 579, doi. 10.1134/1.1780620
- Zanin, I. E.;
- Ale&icaron;nikova, K. B.;
- Antipin, M. Yu.;
- Afanas'ev, M. M.
- Article
20
- Technical Transactions / Czasopismo Techniczne, 2017, v. 6, p. 179, doi. 10.4467/2353737XCT.17.098.6574
- Article
21
- Composite Interfaces, 2003, v. 10, n. 6, p. 505, doi. 10.1163/156855403322667241
- Liming Liu;
- Gouli Liang, D.;
- Zhao Jie, D.;
- Yugang Miao, D.
- Article
22
- Journal of Mining & Metallurgy. Section B: Metallurgy, 2013, v. 49, n. 3, p. 339, doi. 10.2298/JMMB130624037P
- Peltekov, A. B.;
- Boyanov, B. S.
- Article
23
- International Review of Aerospace Engineering, 2019, v. 12, n. 6, p. 280
- Tynchenko, Vadim S.;
- Milov, Anton V.;
- Tynchenko, Valeriya V.;
- Bukhtoyarov, Vladimir V.;
- Kukartsev, Vladislav V.
- Article
24
- Archaeological & Anthropological Sciences, 2021, v. 13, n. 5, p. 1, doi. 10.1007/s12520-021-01321-4
- Mozgai, Viktória;
- Bajnóczi, Bernadett;
- May, Zoltán;
- Mráv, Zsolt
- Article
25
- Paton Welding Journal, 2016, n. 12, p. 29, doi. 10.15407/tpwj2016.12.05
- Gusarova, I. A.;
- Parko, M.;
- Potapov, A. M.;
- Falchenko, Yu. V.;
- Petrushinets, L. V.;
- Melnichenko, T. V.;
- Fedorchuk, V. E.
- Article
26
- Paton Welding Journal, 2016, n. 5/6/, p. 124, doi. 10.15407/tpwj2016.06.21
- SENCHENKOV, I. K.;
- RYABTSEV, I. A.;
- TURYK, E.;
- CHERVINKO, O. P.
- Article
27
- Paton Welding Journal, 2015, n. 11, p. 17, doi. 10.15407/tpwj2015.11.02
- KVASNITSKY, V. V.;
- ERMOLAEV, G. V.;
- MATVIENKO, M. V.
- Article
28
- Paton Welding Journal, 2015, n. 9, p. 13, doi. 10.15407/tpwj2015.09.02
- USTINOV, A. I.;
- FALCHENKO, Yu. V.;
- MELNICHENKO, T. V.;
- PETRUSHINETS, L. V.;
- LYAPINA, K. V.;
- SHISHKIN, A. E.;
- GURIENKO, V. P.
- Article
29
- Paton Welding Journal, 2015, n. 7, p. 3, doi. 10.15407/tpwj2015.07.01
- USTINOV, A. I.;
- FALCHENKO, Yu. V.;
- MELNICHENKO, T. V.;
- PETRUSHINETS, L. V.;
- LYAPINA, K. V.;
- SHISHKIN, A. E.
- Article
30
- Paton Welding Journal, 2014, n. 6/7, p. 66, doi. 10.15407/tpwj2014.06.13
- Article
31
- 2016
- Chart/Diagram/Graph
32
- Indian Welding Journal, 2015, v. 48, n. 3, p. 33, doi. 10.22486/iwj/2015/v48/i3/126048
- Murugan, A.;
- Senthilvelan, T.;
- Balasubramanian, V.
- Article
33
- Indian Welding Journal, 2015, v. 48, n. 3, p. 15, doi. 10.22486/iwj.v48i3.125990
- Article
34
- Indian Welding Journal, 2014, v. 47, n. 1, p. 43, doi. 10.22486/iwj/2014/v47/i1/141186
- Murugan, A.;
- Senthilvelan, T.;
- Balasubramanian, V.
- Article
35
- Indian Welding Journal, 2014, v. 47, n. 1, p. 13, doi. 10.22486/iwj.v47i1.141174
- Article
36
- Fracture & Structural Integrity, 2025, v. 19, n. 71, p. 37, doi. 10.3221/IGF-ESIS.71.04
- Vatnalmath, Manjunath;
- Auradi, V.;
- V., Bharath;
- Bharadwaj, Anirudh;
- Gowda, Chethan;
- Nagaral, Madeva
- Article
37
- BioResources, 2010, v. 5, n. 4, p. 2447, doi. 10.15376/biores.5.4.2447-2456
- Article
38
- Journal of Superconductivity & Novel Magnetism, 2009, v. 22, n. 6, p. 529, doi. 10.1007/s10948-009-0474-9
- Innocenti, D.;
- Ricci, A.;
- Poccia, N.;
- Campi, G.;
- Fratini, M.;
- Bianconi, Antonio
- Article
39
- Engineering Letters, 2008, v. 16, n. 3, p. 308
- Sudiarso, A.;
- Atkinson, J.
- Article
40
- Lasers in Engineering (Old City Publishing), 2009, v. 19, n. 3/4, p. 195
- Linjing Qin;
- Jiandong Hu;
- Chengyun Cui;
- Hongying Wang;
- Zuoxing Guo
- Article
42
- Materials Science & Technology, 2018, v. 34, n. 16, p. 2030, doi. 10.1080/02670836.2018.1510070
- Abu-Okail, Mohamed;
- Ata, Moataz H.;
- Abu-oqail, Ahmed;
- Essa, Ghada M. F.;
- Mahmoud, T. S.;
- Hassab-Allah, Ibrahim
- Article
43
- Materials Science & Technology, 2014, v. 30, n. 14, p. 1801, doi. 10.1179/1743284713Y.0000000486
- Wu, M.;
- Zhao, P.;
- Wang, F.;
- Hu, Q.
- Article
44
- Materials Science & Technology, 2014, v. 30, n. 4, p. 476, doi. 10.1179/1743284713Y.0000000383
- Yang, Y. H.;
- Lin, G. Y.;
- Chen, D. D.;
- Wang, X. Y.;
- Wang, D. Z.;
- Yu, H. C.
- Article
45
- Materials Science & Technology, 2014, v. 30, n. 2, p. 248, doi. 10.1179/1743284713Y.0000000352
- Kundu, S.;
- Bhola, S. M.;
- Mishra, B.;
- Chatterjee, S.
- Article
46
- Materials Science & Technology, 2011, v. 27, n. 5, p. 951, doi. 10.1179/026708310X12712410311893
- Barman, S C;
- Pal, T K;
- Maity, J
- Article
47
- Materials Science & Technology, 2010, v. 26, n. 4, p. 457, doi. 10.1179/026708309X12468927349217
- Cheng, D. H.;
- Huang, J. H.;
- Zhang, H.;
- Zhao, X. K.
- Article
48
- Materials Science & Technology, 2008, v. 24, n. 12, p. 1411, doi. 10.1179/174328408X317048
- Khan, I. N.;
- Starink, M. J.;
- Sinclair, I.;
- Wang, S. C.
- Article
49
- Materials Science & Technology, 2008, v. 24, n. 7, p. 798, doi. 10.1179/174328406X148688
- Jindal, V.;
- Srivastava, V. C.;
- Ghosh, R. N.
- Article
50
- Materials Science & Technology, 2008, v. 24, n. 6, p. 739, doi. 10.1179/174328408X281958
- Ojo, O. A.;
- Abdelfatah, M. M.
- Article