Solvation models in the reaction between phenacyl bromide and 2-mercaptobenzimidazole.
- Published in:
- Journal of Sulfur Chemistry, 2010, v. 31, n. 2, p. 103, doi. 10.1080/17415991003664755
- By:
- Publication type:
- Article
Works matching DE "DIELECTRICS"
Results: 5000
1
2
Spin-on stacked films for low-k[sub eff] dielectrics.
- Published in:
- Solid State Technology, 2001, v. 44, n. 7, p. 105
- By:
- Publication type:
- Article
3
Solutions for the 100nm node with ultrathin silicon nitride gates.
- Published in:
- Solid State Technology, 2001, v. 44, n. 4, p. 75
- By:
- Publication type:
- Article
4
Meeting ITRS Roadmap challenges with low-kappa dielectric etching.
- Published in:
- Solid State Technology, 2001, v. 44, n. 3, p. 107
- By:
- Publication type:
- Article
5
The search continues for high-k gate dielectrics.
- Published in:
- Solid State Technology, 2001, v. 44, n. 2, p. 46
- By:
- Publication type:
- Article
6
SEMICON Japan 2000: Technology updates amid upbeat forecast.
- Published in:
- Solid State Technology, 2001, v. 44, n. 2, p. 36
- Publication type:
- Article
7
Low-k integration issues.
- Published in:
- Solid State Technology, 2001, v. 44, n. 1, p. 78
- By:
- Publication type:
- Article
8
Equipment and process considerations for ALD.
- Published in:
- Solid State Technology, 2001, v. 44, n. 1, p. 70
- By:
- Publication type:
- Article
9
Process technology update: Progress on all fronts.
- Published in:
- Solid State Technology, 2001, v. 44, n. 1, p. 68
- By:
- Publication type:
- Article
10
Efficient, high-throughput post-STI CMP cleaning.
- Published in:
- Solid State Technology, 2000, v. 43, n. 12, p. 96
- By:
- Publication type:
- Article
11
A re-examination of silicon wafer specifications.
- Published in:
- Solid State Technology, 2000, v. 43, n. 10, p. 210
- By:
- Publication type:
- Article
12
Low-k thin films analyzed using automated SEM sample preparation.
- Published in:
- Solid State Technology, 2000, v. 43, n. 10, p. 167
- By:
- Publication type:
- Article
13
Low-k dialectric metrology.
- Published in:
- Solid State Technology, 2000, v. 43, n. 8, p. 55
- By:
- Publication type:
- Article
14
TECHNOLOGY NEWS.
- Published in:
- Solid State Technology, 2000, v. 43, n. 7, p. 36
- Publication type:
- Article
15
Improved planarization for STI with fixed abrasive technology.
- Published in:
- Solid State Technology, 2000, v. 43, n. 6, p. 123
- By:
- Publication type:
- Article
16
Modeling CMP for copper dual damascene interconnects.
- Published in:
- Solid State Technology, 2000, v. 43, n. 6, p. 111
- By:
- Publication type:
- Article
17
Hot topics at MRS: low-k, dopant profiling, copper.
- Published in:
- Solid State Technology, 2000, v. 43, n. 6, p. 50
- By:
- Publication type:
- Article
18
Pattern transfer into low dielectric constant materials by high-density plasma etching.
- Published in:
- Solid State Technology, 2000, v. 43, n. 5, p. 125
- By:
- Publication type:
- Article
19
Predicting the market in low-k dielectrics.
- Published in:
- Solid State Technology, 2000, v. 43, n. 4, p. 38
- By:
- Publication type:
- Article
20
Spin-etch planarization for dual damascene interconnect structures.
- Published in:
- Solid State Technology, 2000, v. 43, n. 3, p. 53
- By:
- Publication type:
- Article
21
AMAT, 3M eye slurry-free CMP on Mirra tools.
- Published in:
- Solid State Technology, 2000, v. 43, n. 2, p. 28
- By:
- Publication type:
- Article
22
The market for low-k interlayer dielectrics.
- Published in:
- Solid State Technology, 1999, v. 42, n. 10, p. 42
- By:
- Publication type:
- Article
23
CMP processing with low-k dielectrics.
- Published in:
- Solid State Technology, 1999, v. 42, n. 7, p. 87
- By:
- Publication type:
- Article
24
Low-k dielectric costs for dual-damascene integration.
- Published in:
- Solid State Technology, 1999, v. 42, n. 5, p. 43
- By:
- Publication type:
- Article
25
Report from DUMIC: Low-k still in development.
- Published in:
- Solid State Technology, 1999, v. 42, n. 5, p. 22
- By:
- Publication type:
- Article
26
Novellus drops parylene, bets on SiOC low-k.
- Published in:
- Solid State Technology, 1999, v. 42, n. 5, p. 22
- By:
- Publication type:
- Article
27
Air gaps lower k of interconnect dielectrics.
- Published in:
- Solid State Technology, 1999, v. 42, n. 2, p. 51
- By:
- Publication type:
- Article
28
Understanding hydrogen silsesquioxane-based dielectric...
- Published in:
- Solid State Technology, 1998, v. 41, n. 5, p. 99
- By:
- Publication type:
- Article
29
On self-similar behaviour of the hysteresis loops in pitching motions.
- Published in:
- Aeronautical Journal, 2004, v. 108, n. 1086, p. 427, doi. 10.1017/S0001924000000245
- By:
- Publication type:
- Article
30
Dielectric Properties of an Epoxy-Amine System at a High Microwave Frequency.
- Published in:
- Polymer Engineering & Science, 2005, v. 45, n. 12, p. 1576, doi. 10.1002/pen.20345
- By:
- Publication type:
- Article
31
Polyurethane and Unsaturated Polyester Hybrid Networks: Chemorheological and Dielectric Study for the Resin Transfer Molding Process (RTM).
- Published in:
- Polymer Engineering & Science, 2000, v. 40, n. 3, p. 690, doi. 10.1002/pen.11199
- By:
- Publication type:
- Article
32
Dielectric Spectroscopy for Polymer Melt Composition Measurements.
- Published in:
- Polymer Engineering & Science, 2000, v. 40, n. 1, p. 214, doi. 10.1002/pen.11154
- By:
- Publication type:
- Article
33
Dielectric Rheological Measurements of Molten Polymers.
- Published in:
- Polymer Engineering & Science, 2000, v. 40, n. 1, p. 201, doi. 10.1002/pen.11153
- By:
- Publication type:
- Article
34
Variation in Dielectric Properties of an Epoxy-Novolac Molding Compound During Dynamic Cure.
- Published in:
- Polymer Engineering & Science, 1999, v. 39, n. 7, p. 1335, doi. 10.1002/pen.11521
- By:
- Publication type:
- Article
35
Dielectric Properties of Bisphenol-A Novolac Type Epoxide Oligomer as a Parameter for Cure...
- Published in:
- Polymer Engineering & Science, 1998, v. 38, n. 11, p. 1838, doi. 10.1002/pen.10353
- By:
- Publication type:
- Article
36
Dielectric properties of CaTiO<sub>3</sub> coatings prepared by plasma spraying.
- Published in:
- Surface Engineering, 2013, v. 29, n. 5, p. 384, doi. 10.1179/1743294413Y.0000000127
- By:
- Publication type:
- Article
37
Surface processing of materials with fluorocarbon fed atmospheric pressure dielectric barrier discharges.
- Published in:
- Surface Engineering, 2012, v. 28, n. 2, p. 83, doi. 10.1179/1743294411Y.0000000043
- By:
- Publication type:
- Article
38
Plasma polymerisation of siloxanes at atmospheric pressure.
- Published in:
- Surface Engineering, 2011, v. 27, n. 8, p. 627, doi. 10.1179/174329409X433858
- By:
- Publication type:
- Article
39
Fabrication of BaTiO<sub>3</sub>-Y:Eu composite micropatterns by combination of laser induced pyrolysis method and nanocrystalline seeding technique.
- Published in:
- Surface Engineering, 2011, v. 27, n. 6, p. 410, doi. 10.1179/026708410X12506873242903
- By:
- Publication type:
- Article
40
Intermixing of metal oxide/Ag/metal oxide nanoscale multilayers prepared by rf reactive magnetron sputtering.
- Published in:
- Surface Engineering, 2011, v. 27, n. 5, p. 382, doi. 10.1179/1743294410Y.0000000014
- By:
- Publication type:
- Article
41
Phosphate Coatings Porosity: Review of New Approaches.
- Published in:
- Surface Engineering, 2004, v. 20, n. 4, p. 292, doi. 10.1179/026708404225016526
- By:
- Publication type:
- Article
42
If it ain't broken, you're very lucky.
- Published in:
- Electronics Systems & Software, 2005, v. 3, n. 3, p. 12, doi. 10.1049/ess:20050301
- By:
- Publication type:
- Article
43
Process shrinks set to level out.
- Published in:
- Electronics Systems & Software, 2005, v. 3, n. 3, p. 4
- Publication type:
- Article
44
Inventing atomic resolution scanning dielectric microscopy to see a single protein complex operation live at resonance in a neuron without touching or adulterating the cell.
- Published in:
- Journal of Integrative Neuroscience, 2016, v. 15, n. 4, p. 435, doi. 10.1142/S0219635216500333
- By:
- Publication type:
- Article
45
Author Index Volume 15 (2016).
- Published in:
- Journal of Integrative Neuroscience, 2016, v. 15, n. 4, p. 607, doi. 10.1142/S0219635216990016
- Publication type:
- Article
46
Dielectric anisotropy of oven- and air-dried wood evaluated using a free space millimeter wave.
- Published in:
- Journal of Wood Science, 2013, v. 59, n. 5, p. 367, doi. 10.1007/s10086-013-1341-7
- By:
- Publication type:
- Article
47
Overview and comparison of microwave noncontact wood measurement techniques.
- Published in:
- Journal of Wood Science, 2010, v. 56, n. 5, p. 357, doi. 10.1007/s10086-010-1119-0
- By:
- Publication type:
- Article
48
Dielectric properties of hardwood species at microwave frequencies.
- Published in:
- Journal of Wood Science, 2004, v. 50, n. 4, p. 375, doi. 10.1007/s10086-003-0575-1
- By:
- Publication type:
- Article
49
Effect of Guest Particles on the Functional Dielectric Properties of Materials for Display Application.
- Published in:
- Macromolecular Symposia, 2024, v. 413, n. 5, p. 1, doi. 10.1002/masy.202400048
- By:
- Publication type:
- Article
50
Dielectric and Electrical Behavior of Apraseodymium Based Tungsten Bronze Ceramics.
- Published in:
- Macromolecular Symposia, 2024, v. 413, n. 2, p. 1, doi. 10.1002/masy.202300105
- By:
- Publication type:
- Article