Works matching DE "DEEP level transient spectroscopy"
1
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, p. 281, doi. 10.1007/s10854-007-9553-5
- Tokuda, Yutaka;
- Takeshi Seo
- Article
2
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, p. 92, doi. 10.1007/s10854-008-9693-2
- Nguyen, Thien;
- Renaud, Cédric;
- Chun Huang;
- Chih-Nan Lo;
- Chih-Wen Lee;
- Chain-Shu Hsu
- Article
3
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, p. 87, doi. 10.1007/s10854-008-9629-x
- Renaud, Cédric;
- Josse, Yves;
- Chih-Wen Lee;
- Nguyen, Thien-Phap
- Article
4
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, p. 101, doi. 10.1007/s10854-008-9703-4
- Kaniewska, M.;
- Engström, O.;
- Kaczmarczyk, M.;
- Zaremba, G.
- Article
5
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 487, doi. 10.1007/s10854-007-9367-5
- Talbi, N.;
- Khirouni, K.;
- Sun, G. C.;
- Samic, H.;
- Bourgoin, J. C.
- Article
6
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 3, p. 267, doi. 10.1007/s10854-007-9272-y
- Ali, Akbar;
- Majid, Abdul;
- Saleh, M. Nawaz
- Article
7
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 2, p. 171, doi. 10.1007/s10854-007-9302-9
- Ohyama, H.;
- Shitogiden, H.;
- Takakura, K.;
- Shigaki, K.;
- Kuboyama, S.;
- Kamesawa, C.;
- Simoen, E.;
- Claeys, C.
- Article
8
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 7, p. 705, doi. 10.1007/s10854-006-9092-5
- Huang, Y.;
- Simoen, E.;
- Claeys, C.;
- Rafí, J.;
- Clauws, P.
- Article
9
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 7, p. 799, doi. 10.1007/s10854-006-9110-7
- Simoen, E.;
- Claeys, C.;
- Sioncke, S.;
- Steenbergen, J.;
- Meuris, M.;
- Forment, S.;
- Vanhellemont, J.;
- Clauws, P.;
- Theuwis, A.
- Article
10
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 7, p. 759, doi. 10.1007/s10854-006-9104-5
- Kruszewski, P.;
- Mesli, A.;
- Dobaczewski, L.;
- Abrosimov, N.;
- Markevich, V.;
- Peaker, A.
- Article
11
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 4, p. 421, doi. 10.1007/s10854-006-9043-1
- Akbar Ali;
- Abdul Majid;
- M. Saleh
- Article
12
- 2019
- Grassman, T. J.;
- Galiano, K.;
- Deitz, J. I.;
- Carnevale, S. D.;
- Gleason, D. A.;
- Zhang, Z.;
- Ringel, S. A.;
- Arehart, A. R.;
- Pelz, J. P.
- Abstract
13
- Microscopy & Microanalysis, 2019, p. 456, doi. 10.1017/S1431927618002775
- Deitz, Julia I.;
- Paul, Pran K.;
- Karki, Shankar;
- Marsillac, Sylvain;
- Arehart, Aaron R.;
- Walls, John M.;
- Bowers, Jake W.;
- Grassman, Tyler J.;
- McComb, David W.
- Article
14
- Physica Status Solidi. A: Applications & Materials Science, 2022, v. 219, n. 7, p. 1, doi. 10.1002/pssa.202100662
- Danilov, Denis;
- Vyvenko, Oleg;
- Loshachenko, Anton;
- Sobolev, Nikolay
- Article
15
- Advanced Energy Materials, 2019, v. 9, n. 35, p. N.PAG, doi. 10.1002/aenm.201901612
- Deitz, Julia I.;
- Paul, Pran K.;
- Farshchi, Rouin;
- Poplavskyy, Dmitry;
- Bailey, Jeff;
- Arehart, Aaron R.;
- McComb, David W.;
- Grassman, Tyler J.
- Article
16
- Semiconductors, 2001, v. 35, n. 10, p. 1175, doi. 10.1134/1.1410660
- Sobolev, M. M.;
- Kochnev, I. V.;
- Lantratov, V. M.;
- Ledentsov, N. N.
- Article
17
- Semiconductors, 1999, v. 33, n. 8, p. 821, doi. 10.1134/1.1187789
- Barabanenkov, M. Yu.;
- Leonov, A. V.;
- Mordkovich, V. N.;
- Omelyanovskaya, N. M.
- Article
18
- Semiconductors, 1997, v. 31, n. 8, p. 852, doi. 10.1134/1.1187240
- Antonova, I. V.;
- Popov, V. P.;
- Shaımeev, S. S.;
- Misiuk, A.
- Article
19
- Semiconductors, 1997, v. 31, n. 8, p. 847, doi. 10.1134/1.1187266
- Naumova, O. V.;
- Smirnov, L. S.;
- Stas’, V. F.
- Article
20
- Semiconductors, 1997, v. 31, n. 4, p. 371, doi. 10.1134/1.1187165
- Article
21
- Journal of Materials Science, 2017, v. 52, n. 17, p. 10119, doi. 10.1007/s10853-017-1217-0
- Paprocki, Kazimierz;
- Fabisiak, Kazimierz;
- Bogdanowicz, Robert;
- Gołuński, Łukasz;
- Staryga, Elżbieta;
- Szybowicz, Mirosław;
- Kowalska, Magdalena;
- Banaszak-Piechowska, Agnieszka
- Article
22
- Journal of Materials Science, 2007, v. 42, n. 13, p. 4753, doi. 10.1007/s10853-006-0765-5
- Article
23
- Journal of Materials Science, 2006, v. 41, n. 22, p. 7319, doi. 10.1007/s10853-006-0961-3
- Kim, D. S.;
- Choi, W. C.;
- Moon, G. W.;
- Jang, K. Y.;
- Kim, T. G.;
- Sung, Y. M.
- Article
24
- Journal of Materials Science, 2006, v. 41, n. 3, p. 1007, doi. 10.1007/s10853-006-6597-5
- Evans-Freeman, J. H.;
- Emiroglu, D.;
- Gad, M. A.;
- Mitromara, N.;
- Vernon-Parry, K. D.
- Article
25
- Crystals (2073-4352), 2024, v. 14, n. 6, p. 536, doi. 10.3390/cryst14060536
- Kamiński, Paweł;
- Kozłowski, Roman;
- Żelazko, Jarosław;
- Kościewicz, Kinga;
- Ciuk, Tymoteusz
- Article
26
- Crystals (2073-4352), 2021, v. 11, n. 11, p. 1404, doi. 10.3390/cryst11111404
- Capan, Ivana;
- Brodar, Tomislav;
- Makino, Takahiro;
- Radulovic, Vladimir;
- Snoj, Luka
- Article
27
- 2021
- Capan, Ivana;
- Coutinho, José;
- Radulović, Vladimir;
- Makino, Takahiro
- Editorial
28
- Applied Physics A: Materials Science & Processing, 2003, v. 76, n. 6, p. 961, doi. 10.1007/s00339-002-1826-5
- Deenapanray, P.N.K.;
- Tan, H.H.;
- Jagadish, C.
- Article
29
- Electronics & Electrical Engineering, 2010, n. 100, p. 51
- Toompuu, J.;
- Korolkov, O.;
- Sleptšuk, N.;
- Rang, T.
- Article
30
- Electronics & Electrical Engineering, 2007, n. 76, p. 13
- Bobrovs, V.;
- Porins, J.;
- Ivanovs, G.
- Article
31
- Journal of Electronic Materials, 2019, v. 48, n. 10, p. 6113, doi. 10.1007/s11664-019-07213-7
- Guinedor, P.;
- Brunner, A.;
- Rubaldo, L.;
- Bauza, D.;
- Reimbold, G.;
- Billon-Lanfrey, D.
- Article
32
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5039, doi. 10.1007/s11664-018-6299-1
- Li, Jiyang;
- Song, Lihui;
- Yu, Xuegong;
- Yang, Deren
- Article
33
- Journal of Electronic Materials, 2018, v. 47, n. 2, p. 955, doi. 10.1007/s11664-017-5938-2
- Kumar, Arvind;
- Mondal, Sandip;
- Koteswara Rao, K.
- Article
34
- Journal of Electronic Materials, 2016, v. 45, n. 4, p. 2001, doi. 10.1007/s11664-016-4337-4
- Wang, Jingzhou;
- Koizumi, Atsushi;
- Fujiwara, Yasufumi;
- Jadwisienczak, Wojciech
- Article
35
- Journal of Electronic Materials, 2012, v. 41, n. 3, p. 488, doi. 10.1007/s11664-011-1802-y
- Gul, R.;
- Keeter, K.;
- Rodriguez, R.;
- Bolotnikov, A.E.;
- Hossain, A.;
- Camarda, G.S.;
- Kim, K.H.;
- Yang, G.;
- Cui, Y.;
- Carcelen, V.;
- Franc, J.;
- Li, Z.;
- James, R.B.
- Article
36
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2337, doi. 10.1007/s11664-011-1787-6
- Fang, Z.-Q.;
- Claflin, B.;
- Look, D.C.
- Article
37
- Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2179, doi. 10.1007/s11664-011-1741-7
- Fang, Z.-Q.;
- Claflin, B.;
- Look, D.;
- Chai, F.;
- Odekirk, B.
- Article
38
- Journal of Electronic Materials, 2011, v. 40, n. 3, p. 274, doi. 10.1007/s11664-010-1504-x
- Gul, R.;
- Bolotnikov, A.;
- Kim, H.;
- Rodriguez, R.;
- Keeter, K.;
- Li, Z.;
- Gu, G.;
- James, R.
- Article
39
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 832, doi. 10.1007/s11664-007-0104-x
- Johnstone, D.;
- Golding, T. D.;
- Hellmer, R.;
- Dinan, J. H.;
- Carmody, M.
- Article
40
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 19, p. 15679, doi. 10.1007/s10854-022-08471-8
- Omotoso, Ezekiel;
- Meyer, Walter E.;
- Igumbor, Emmanuel;
- Hlatshwayo, Thulani T.;
- Prinsloo, Aletta R. E.;
- Auret, F. Danie;
- Sheppard, Charles J.
- Article
41
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11079, doi. 10.1007/s10854-019-01450-6
- Ke, Xiao-yu;
- Ming, Si-ting;
- Wang, Duo-wei;
- Li, Tong;
- Liu, Bing-yan;
- Cao, Shu-rui;
- Ma, Yao;
- Li, Yun;
- Yang, Zhi-mei;
- Gong, Min;
- Huang, Ming-min;
- Bi, Jin-shun;
- Xu, Yan-nan;
- Xi, Kai;
- Xu, Gao-bo;
- Majumdar, Sandip
- Article
42
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 2, p. 1148, doi. 10.1007/s10854-018-0383-4
- Chen, Zhe;
- Dong, Peng;
- Xie, Meng;
- Li, Yun;
- Yu, Xuegong;
- Ma, Yao
- Article
43
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 9, p. 1400, doi. 10.1007/s10854-011-0320-2
- Seghier, D.;
- Gislason, H. P.
- Article
44
- Physica Status Solidi. A: Applications & Materials Science, 2022, v. 219, n. 6, p. 1, doi. 10.1002/pssa.202100704
- Zhang, Yanqing;
- Zhou, Jiaming;
- Liu, Chaoming;
- Qi, Chunhua;
- Wang, Tianqi;
- Ma, Guoliang;
- Zhou, Bin;
- Xiao, Liyi;
- Huo, Mingxue
- Article
45
- Physica Status Solidi. A: Applications & Materials Science, 2021, v. 218, n. 23, p. 1, doi. 10.1002/pssa.202100104
- Aharodnikau, Dzmitriy A.;
- Lastovskii, Stanislau B.;
- Shpakovski, Sergei V.;
- Markevich, Vladimir P.;
- Halsall, Matthew P.;
- Peaker, Anthony R.
- Article
46
- Physica Status Solidi. A: Applications & Materials Science, 2019, v. 216, n. 17, p. N.PAG, doi. 10.1002/pssa.201900354
- Makarenko, Leonid F.;
- Lastovski, Stanislav B.;
- Yakushevich, Hanna S.;
- Gaubas, Eugenijus;
- Pavlov, Jevgenij;
- Kozlovski, Vitali V.;
- Moll, Michael;
- Pintilie, Ioana
- Article
47
- Physica Status Solidi. A: Applications & Materials Science, 2019, v. 216, n. 17, p. N.PAG, doi. 10.1002/pssa.201900311
- Kolkovsky, Valery;
- Kolkovsky, Vladimir;
- Weber, Jörg
- Article
48
- Physica Status Solidi. A: Applications & Materials Science, 2019, v. 216, n. 17, p. N.PAG, doi. 10.1002/pssa.201900303
- Gwozdz, Katarzyna;
- Kolkovsky, Vladimir;
- Weber, Joerg;
- Yakovleva, Anastasia A.;
- Astrov, Yuri A.
- Article
49
- Physica Status Solidi. A: Applications & Materials Science, 2019, v. 216, n. 17, p. N.PAG, doi. 10.1002/pssa.201900142
- Mchedlidze, Teimuraz;
- Weber, Joerg
- Article
50
- Physica Status Solidi. A: Applications & Materials Science, 2019, v. 216, n. 14, p. N.PAG, doi. 10.1002/pssa.201800986
- Ayedh, Hussein M.;
- Grigorev, Aleksei A.;
- Galeckas, Augustinas;
- Svensson, Bengt G.;
- Monakhov, Edouard V.
- Article