Found: 15
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Beyond Borders: An Entangled History of Communism in the Post-Ottoman Middle East.
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- Journal of the Ottoman & Turkish Studies Association, 2021, v. 8, n. 1, p. 449, doi. 10.2979/jottturstuass.8.1.34
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- Article
Propagation Experiment of Twig Segmentation Cutting of Rosa damascene Mill.
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- Agricultural Biotechnology (2164-4993), 2018, v. 7, n. 4, p. 73
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- Article
Interpolated Spaces: The Metropolitan Museum of Art's 'Damascus Room' Reinstalled.
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- International Journal of Islamic Architecture, 2018, v. 7, n. 2, p. 305, doi. 10.1386/ijia.7.2.305_1
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- Article
Smart Hybrid Polymers for Advanced Damascene Electroplating: Combination of Superfill and Leveling Properties.
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- ChemElectroChem, 2015, v. 2, n. 8, p. 1096, doi. 10.1002/celc.201500104
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- Article
New insights into early bronze age damascene technique north of the alps.
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- Antiquaries Journal, 2013, v. 93, p. 25, doi. 10.1017/S0003581513000012
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- Article
Time Dependent Dielectric Breakdown in Copper Low-k Interconnects: Mechanisms and Reliability Models.
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- Materials (1996-1944), 2012, v. 5, n. 9, p. 1602, doi. 10.3390/ma5091602
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- Article
RECENT DEVELOPMENTS ON 3D INTEGRATION OF METALLIC SET ONTO CMOS PROCESS FOR MEMORY APPLICATION.
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- International Journal of Nanoscience, 2012, v. 11, n. 4, p. -1, doi. 10.1142/S0219581X12400248
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- Article
Novel Approach of Semiconductor Manufacturing Process on Copper Dual Damascene Processes Integration.
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- Strain, 2009, v. 45, n. 3, p. 221, doi. 10.1111/j.1475-1305.2009.00599.x
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- Article
The oxide electrochemistry of ruthenium and its relevance to trench liner applications in damascene copper plating.
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- Journal of Applied Electrochemistry, 2008, v. 38, n. 3, p. 377, doi. 10.1007/s10800-007-9449-3
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- Article
Textural and Microstructural Transformation of Cu Damascene Interconnects after Annealing.
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- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 506, doi. 10.1007/s11664-005-0058-9
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- Article
Three-Dimensional Simulation of Microstructure Evolution in Damascene Interconnects: Effect of Overburden Thickness.
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- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 559, doi. 10.1007/s11664-005-0065-x
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- Article
Navigating yield through the maze of copper CMP defects.
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- Solid State Technology, 2001, v. 44, n. 4, p. 63
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- Article
248nm and 193nm lithography for damascene patterning.
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- Solid State Technology, 2001, v. 44, n. 4, p. S15
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- Article
Low-k integration issues.
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- Solid State Technology, 2001, v. 44, n. 1, p. 78
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- Article
Low-k dielectric costs for dual-damascene integration.
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- Solid State Technology, 1999, v. 42, n. 5, p. 43
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- Article