Effect of Creep on Failure of Distribution Transformers: An Experimental Evaluation.
- Published in:
- International Journal of Performability Engineering, 2010, v. 6, n. 2, p. 171
- By:
- Publication type:
- Article
Works matching DE "CREEP of copper"
Results: 10
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PARAMETRİK ÜÇ BOYUT TABANLI HESAPLANMIŞ FAZ DİRENÇLERİNE SAHİP KISA KUTUP VE TAM KUTUP ADIMLI AR MOTORLARININ PERFORMANS ANALİZİ.
- Published in:
- Journal of the Faculty of Engineering & Architecture of Gazi University / Gazi Üniversitesi Mühendislik Mimarlık Fakültesi Dergisi,, 2008, v. 23, n. 2, p. 375
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- Article
3
Creep Behavior of Copper-Chromium In-Situ Composite.
- Published in:
- Metallurgical & Materials Transactions. Part A, 2004, v. 35, n. 2, p. 695, doi. 10.1007/s11661-004-0380-5
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- Publication type:
- Article
4
What is 'stationary' deformation of pure Cu?
- Published in:
- Journal of Materials Science, 2014, v. 49, n. 8, p. 2987, doi. 10.1007/s10853-013-7983-4
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- Publication type:
- Article
5
Basic modelling of tertiary creep of copper.
- Published in:
- Journal of Materials Science, 2018, v. 53, n. 9, p. 6850, doi. 10.1007/s10853-017-1968-7
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- Publication type:
- Article
6
Modelling of creep in friction stir welded copper.
- Published in:
- Materials Research Innovations, 2013, v. 17, n. 5, p. 350, doi. 10.1179/1433075X13Y.0000000121
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- Publication type:
- Article
7
Influence of short time annealing on strain hardening rate and flow stress of ultrafine grained material processed by severe plastic deformation.
- Published in:
- Materials Research Innovations, 2011, v. 15, p. 69, doi. 10.1179/143307511X12858956847075
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- Publication type:
- Article
8
Estimation of Creep Voids Using a Progressive Damage Model and Neural Networks.
- Published in:
- Research in Nondestructive Evaluation, 2002, v. 14, n. 1, p. 33, doi. 10.1080/09349840209409702
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- Publication type:
- Article
9
Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 4, p. 507, doi. 10.1007/s11664-007-0208-3
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- Publication type:
- Article
10
Creep Deformation of Sn-3.5Ag-xCu and Sn-3.5Ag-xBi Solder Joints.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 2, p. 188, doi. 10.1007/s11664-005-0232-0
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- Publication type:
- Article