Works about COPPER-tin alloys

Results: 738

TIN.

Published in:

Mining Engineering, 2025, v. 77, n. 7, p. 75

By:

Angadi, Shivakumar

Publication type:

Article

Influence of Copper Pretreatment on the Phase and Pore Formations in the Solid Phase Reactions of Copper with Tin.

Published in:

Metallophysics & Advanced Technologies / Metallofizika i Novejsie Tehnologii, 2018, v. 40, n. 12, p. 1649, doi. 10.15407/mfint.40.12.1649

By:

Morozovych, V. V.;
Honda, A. R.;
Lyashenko, Yu. O.;
Korol, Ya. D.;
Liashenko, O. Yu.;
Cserhati, C.;
Gusak, A. M.

Publication type:

Article

金属材料に関する粉末技術～非鉄金属粉～.

Published in:

Journal of the Japan Society of Powder & Powder Metallurgy / Funtai Oyobi Fummatsu Yakin, 2021, v. 68, n. 5, p. 147, doi. 10.2497/jjspm.68.147

By:

新見;
義朗

Publication type:

Article

Characterization of Sn-xIn Solders and Thermomigration-Induced Interfacial IMC Growth of Cu/Sn-xIn/Cu Micro Solder Joints.

Published in:

Electronics (2079-9292), 2023, v. 12, n. 8, p. 1899, doi. 10.3390/electronics12081899

By:

Du, Yanfeng;
Qiao, Yuanyuan;
Ren, Xiaolei;
Lai, Yanqing;
Zhao, Ning

Publication type:

Article

Recovery of high-grade copper from metal-rich particles of waste printed circuit boards by ball milling and sieving.

Published in:

Environmental Technology, 2022, v. 43, n. 4, p. 514, doi. 10.1080/09593330.2020.1795932

By:

Liu, Fangfang;
Chen, Weiping;
Wan, Bingbing;
Chen, Huanda;
Ling, Zicheng;
Chen, Zhiping;
Fu, Zhiqiang

Publication type:

Article

Study of the Formation of the Alloyed Surface Layer During Plasma Heating of Mixtures of Cu-Sn/CrXCY Alloys.

Published in:

Tribology in Industry, 2021, v. 43, n. 3, p. 386, doi. 10.24874/ti.1070.03.21.05

By:

Nguyen, V. T.;
Astafeva, N. A.;
Balanovskiy, A. E.

Publication type:

Article

Crystallographical Analysis of Martensitic Transformation Observed in Cu-Sn Alloy.

Published in:

Afyon Kocatepe University Journal of Science & Engineering / Afyon Kocatepe Üniversitesi Fen Ve Mühendislik Bilimleri Dergisi, 2025, v. 25, n. 2, p. 279, doi. 10.35414/akufemubid.1526475

By:

ARSLAN, Hüseyin

Publication type:

Article

The tin-rich copper lithium stannides: Li3Cu6Sn4 and Li2CuSn2.

Published in:

Zeitschrift für Kristallographie. Crystalline Materials, 2015, v. 230, n. 2, p. 97, doi. 10.1515/zkri-2014-1778

By:

Fürtauer, Siegfried;
Effenberger, Herta S.;
Flandorfer, Hans

Publication type:

Article

Development of hypoeutectic SnBi alloy solder reinforced with WO3 nanoparticles for connecting Cu substrates via thermal bonding.

Published in:

Scientific Reports, 2025, v. 15, n. 1, p. 1, doi. 10.1038/s41598-025-89729-z

By:

Fathy, Naglaa;
Hafez, Khalid M.;
Abdulaziz, Fahad;
Abdelraouf, R. E.;
Ramadan, Mohamed

Publication type:

Article

Micro-Particle Induced X-ray Emission Study of Lead-Free and Lead-Based Solders and Interactions with Copper Wires.

Published in:

Physica Status Solidi. A: Applications & Materials Science, 2023, v. 220, n. 10, p. 1, doi. 10.1002/pssa.202200432

By:

Whitlow, Harry J.;
Nagy, Gyula

Publication type:

Article

Electrocatalytic Reduction of Gaseous CO2 to CO on Sn/Cu‐Nanofiber‐Based Gas Diffusion Electrodes.

Published in:

Advanced Energy Materials, 2019, v. 9, n. 32, p. N.PAG, doi. 10.1002/aenm.201901514

By:

Ju, Wenbo;
Jiang, Fuze;
Ma, Huan;
Pan, Zhengyuan;
Zhao, Yi‐Bo;
Pagani, Francesco;
Rentsch, Daniel;
Wang, Jing;
Battaglia, Corsin

Publication type:

Article

A Hybrid Method for Predicting Fatigue Life of Lead-Free Solder Joints Under Coupled Electrical–Thermal–Mechanical Fields.

Published in:

International Journal of Applied Mechanics, 2022, v. 14, n. 6, p. 1, doi. 10.1142/S1758825122500570

By:

Yi, J. L.;
Chen, J. H.;
Qu, C.;
Zhang, Y. X.;
Cui, Y. H.

Publication type:

Article

Structural and superconducting properties of Nb3Sn film for superconducting radio-frequency cavities synthesized via bronze route.

Published in:

Functional Materials Letters, 2021, v. 14, n. 5, p. 1, doi. 10.1142/S1793604721510309

By:

Pan, Feng;
Lu, Ming;
Wu, Andong;
Chu, Qingwei;
Lu, Ziwei;
He, Yuan;
Tan, Teng

Publication type:

Article

The fractal nature analysis by applying grain formations of SAC305/OSP Cu and SAC305-0.05Ni/OSP Cu solder joints for microelectronic packaging.

Published in:

Modern Physics Letters B, 2021, v. 35, n. 33, p. 1, doi. 10.1142/S0217984921504273

By:

Mitić, Vojislav V.;
Fleshman, Collin;
Duh, Jenq-Gong;
Ilić, Ivana D.;
Lazović, Goran

Publication type:

Article

Formation mechanism of Cu/Cu3Sn–Cu/Cu interconnections based on solder-filled microporous copper as interlayer via a current-assisted thermal compression bonding.

Published in:

Modern Physics Letters B, 2021, v. 35, n. 20, p. N.PAG, doi. 10.1142/S021798492150322X

By:

Li, Xiang;
Sun, Fenglian;
Pan, Zhen

Publication type:

Article

Microstructure evolution and mechanical properties of copper/304 stainless-steel joints by low-temperature soldering.

Published in:

International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2022, v. 36, n. 9-11, p. 1, doi. 10.1142/S021797922240015X

By:

Yao, Shuyi;
Shi, Xin;
Li, Yuanxing;
Wan, Liping;
Zheng, Xiangbo;
Wang, Yao;
Chen, Hui

Publication type:

Article

Effects of SiC nanowires on reliability of Sn58Bi-0.05GNSs/Cu solder joints.

Published in:

International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2021, v. 35, n. 1, p. N.PAG, doi. 10.1142/S0217979221500077

By:

Jiang, Nan;
Zhang, Liang;
Xu, Kai-Kai;
Li, Mu-Lan;
Wang, Feng-Jiang

Publication type:

Article

Effects of nanoparticles on properties and interface reaction of Sn solder for microelectronic packaging.

Published in:

International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2020, v. 34, n. 8, p. N.PAG, doi. 10.1142/S0217979220500642

By:

Zhao, Meng;
Zhang, Liang;
Sun, Lei;
Xiong, Ming-yue;
Jiang, Nan;
Xu, Kai-kai

Publication type:

Article

Influence of bismuth addition on the microstructure, wettability, thermal properties and electrical resistivity of Sn–Zn-based solder alloys.

Published in:

Welding International, 2025, v. 39, n. 4, p. 322, doi. 10.1080/09507116.2025.2462692

By:

Ibrahim Al-Ezzi, Athil S.

Publication type:

Article

Thermodynamic activity in Zn–Cu–Sn–In liquid solder alloys: a comprehensive analysis using the molecular interaction volume model.

Published in:

Welding International, 2024, v. 38, n. 4, p. 265, doi. 10.1080/09507116.2024.2325151

By:

Sah, Sanjay Kumar;
Jha, Indu Shekhar;
Koirala, Ishwar

Publication type:

Article

Effects of Sn-Ag-x layers on the solderability and mechanical properties of Sn-58Bi solder.

Published in:

Welding International, 2021, v. 35, n. 1-3, p. 16, doi. 10.1080/09507116.2021.1913451

By:

Zhang, Shuang;
Liu, Yang;
Zhang, Hao;
Zhou, Min;
Xue, Yuxiong;
Zeng, Xianghua;
Cao, Rongxing;
Chen, Penghui

Publication type:

Article

Effect of isothermal ageing on the microstructure, shear behaviour and hardness of the Sn58Bi/SnAgCuBiNi/Cu solder joints.

Published in:

Welding International, 2021, v. 35, n. 1-3, p. 3, doi. 10.1080/09507116.2021.1889291

By:

Chang, Jian;
Liu, Yang;
Zhang, Hao;
Zhou, Min;
Yuxiong, Xue;
Zeng, Xianghua;
Cao, Rongxing;
Chen, Penghui

Publication type:

Article

Induction brazing of carbide cutters for a mining tool. The choice of composition and solder form.

Published in:

Welding International, 2019, v. 33, n. 10-12, p. 411, doi. 10.1080/09507116.2021.1894032

By:

Pashkov, I.N;
Misnikov, V.E;
Morozov, V.A;
Tavolzhanskiy, S.A

Publication type:

Article

Density-functional and global optimization study of copper-tin core-shell clusters.

Published in:

Canadian Journal of Chemistry, 2010, v. 88, n. 11, p. 1071, doi. 10.1139/V10-066

By:

Fournier, René

Publication type:

Article

The 45th Anniversary of the Journal of Phase Equilibria and Diffusion.

Published in:

Journal of Phase Equilibria & Diffusion, 2025, v. 46, n. 3, p. 295, doi. 10.1007/s11669-025-01198-z

By:

Kattner, Ursula R.

Publication type:

Article

The Cu–Sn System: A Comprehensive Review of the Crystal Structures of its Stable and Metastable Phases.

Published in:

Journal of Phase Equilibria & Diffusion, 2023, v. 44, n. 3, p. 343, doi. 10.1007/s11669-023-01041-3

By:

Leineweber, Andreas

Publication type:

Article

Prediction of Interfacial Reaction Between Cu and In During Low-Temperature Soldering.

Published in:

Journal of Phase Equilibria & Diffusion, 2022, v. 43, n. 6, p. 876, doi. 10.1007/s11669-022-01008-w

By:

Oh, Sang-Ho;
Chu, Kunmo;
Lee, Byeong-Joo

Publication type:

Article

Influence of Interdiffusion in Sn Solution on Growth of CuSn and CuSn Formed in Semi-infinite and Finite Cu-Sn Diffusion Couples.

Published in:

Journal of Phase Equilibria & Diffusion, 2017, v. 38, n. 1, p. 17, doi. 10.1007/s11669-016-0507-6

By:

Shimozaki, Toshitada;
Lee, Je-hyun;
Lee, Chan-Gyu

Publication type:

Article

Phase Equilibria of the Cu-Si-Sn System at 700 and 500 °C.

Published in:

Journal of Phase Equilibria & Diffusion, 2015, v. 36, n. 5, p. 493, doi. 10.1007/s11669-015-0405-3

By:

Song, Yuanyuan;
Su, Xuping;
Liu, Ya;
Peng, Haoping;
Wu, Changjun;
Wang, Jianhua

Publication type:

Article

Effects of Minor Addition of Cu and Ni on the Microstructure, Thermal and Mechanical Properties, and Wettability of Sn-58Bi Solder Alloys.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 5, p. 4154, doi. 10.1007/s11664-025-11861-3

By:

Sungkhaphaitoon, Phairote;
Chantaramanee, Suchart

Publication type:

Article

Effects of Interaction Between Sn-Rich and Pb-Rich Phases on the Mechanical Properties of Sn-Pb Eutectic Solder Alloy at Cryogenic Temperature.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 3, p. 2368, doi. 10.1007/s11664-024-11694-6

By:

An, Qi;
Zhang, Minghua;
Wang, Ningning;
Fei, Jingming

Publication type:

Article

Microstructure and Bonding Properties of Transient Liquid-Phase Bonding using Cu-SnAgCu Molded Sheets By High-Pressure Powder Compression.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 1, p. 773, doi. 10.1007/s11664-024-11524-9

By:

Sakamoto, Ichizo;
Jeong, Doojin;
Tatsumi, Hiroaki;
Nishikawa, Hiroshi

Publication type:

Article

Effects of Mixed Percentage on the Microstructure and Mechanical Properties of Sn-52In/Sn-3.0Ag-0.5Cu Hybrid Solder Joints.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6463, doi. 10.1007/s11664-024-11350-z

By:

Zhao, W. T.;
Ren, J.;
Huang, M. L.

Publication type:

Article

Effect of Sn Orientation on Electromigration Failure in CuSn Solders.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6424, doi. 10.1007/s11664-024-11301-8

By:

Pham, Andrew Minh;
Haq, Fariha;
Sadasiva, Subramanya;
Li, Guangxu;
Koslowski, Marisol

Publication type:

Article

The Effect of Thermal Aging on the Mechanical Properties of Gold-Containing Solder Joints.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 9, p. 5460, doi. 10.1007/s11664-024-11264-w

By:

Bi, Yinghao;
Guo, Weiqi;
Wang, Shaobin;
Zhang, Weiwei;
Wu, Ping

Publication type:

Article

Enhanced Shear Strength of Sn-Bi/(111)Cu Joints by Refined Distribution of Bi in the Composite Solder.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 8, p. 4539, doi. 10.1007/s11664-024-11169-8

By:

Zhang, Dan;
Ma, Haoran;
Dong, Chong;
Guo, Tianhao;
Ma, Haitao;
Wang, Yunpeng

Publication type:

Article

Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 6, p. 3049, doi. 10.1007/s11664-024-11029-5

By:

Tu, Wenbin;
Wang, Hanbing;
Wang, Shanlin;
Chen, Yuhua;
Wei, Mingwei;
Zhang, Timing;
Xie, Jilin

Publication type:

Article

Effect of Cu Particles on the Properties of Sn-Bi-Pb Low-Melting-Point Alloys.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 6, p. 3035, doi. 10.1007/s11664-024-11009-9

By:

Niu, Chengchao;
Song, Zhuofei

Publication type:

Article

Stereological Analysis of Microstructural Evolution Due to Aging in SnAgCu Solder Alloys.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1399, doi. 10.1007/s11664-023-10885-x

By:

Chavali, S.;
Ganti, S. S.;
Liao, H.;
Subbarayan, G.;
Dutta, I.;
Dayananda, M.

Publication type:

Article

A Cu Pillar Bump Bonding Method Using Au-Sn Alloy Cap as the Interconnection Layer.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1414, doi. 10.1007/s11664-023-10881-1

By:

Hu, Yuhua;
Zhang, Yan;
Bao, Zuguo;
Wu, Jing;
Li, Jie;
Wu, Jie;
Huang, Min

Publication type:

Article

Changes in the Microstructure and Electrical Resistance of SnBi-Based Solder Joints during Current Stressing.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1299, doi. 10.1007/s11664-023-10875-z

By:

Flores, Javier;
Panta, Sitaram;
Hadian, Faramarz;
Cotts, Eric

Publication type:

Article

Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1284, doi. 10.1007/s11664-023-10866-0

By:

Fowler, Hannah N.;
Puttur Lakshminarayana, Sukshitha Achar;
Lai, Sean Yenyu;
Tay, Sui Xiong;
Masaeng, Aleena;
Subbarayan, Ganesh;
Blendell, John E.;
Handwerker, Carol A.

Publication type:

Article

Investigating the Effects of Rapid Precipitation of Bi in Sn on the Shear Strength of BGA Sn-Bi Alloys.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1223, doi. 10.1007/s11664-023-10850-8

By:

Hao, Qichao;
Tan, Xin F.;
McDonald, Stuart D.;
Sweatman, Keith;
Akaiwa, Tetsuya;
Nogita, Kazuhiro

Publication type:

Article

The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1183, doi. 10.1007/s11664-023-10849-1

By:

Tan, Xin F.;
Hao, Qichao;
Zhou, Jiye;
McDonald, Stuart D.;
Sweatman, Keith;
Nogita, Kazuhiro

Publication type:

Article

The Effect of Joint Thickness on Intermetallic Growth in the In52Sn48(Liquid)/Cu(Solid) Diffusion Couple.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 1, p. 418, doi. 10.1007/s11664-023-10764-5

By:

Mouratidis, Theodore

Publication type:

Article

Tailoring Microstructural and Electrical Properties of Hypoeutectic Sn-Cu Through Ni Doping.

Published in:

Journal of Electronic Materials, 2023, v. 52, n. 12, p. 7972, doi. 10.1007/s11664-023-10713-2

By:

Dantas, S. L. A.;
Souza, A. L. R.;
Spinelli, J. E.;
Correa, M. A.;
Silva, B. L.

Publication type:

Article

Impact of Cooling Rate and Nickel Addition on the Dendritic Spacing, Ag3Sn Morphology and Cytotoxicity of Sn-2Ag Solder.

Published in:

Journal of Electronic Materials, 2023, v. 52, n. 11, p. 7740, doi. 10.1007/s11664-023-10685-3

By:

de Sousa, Raí Batista;
Paixão, Jeverton Laureano;
de Araújo Dantas, Suylan Lourdes;
de Freitas, Pâmella Raffaela Dantas;
da Luz, Jefferson Romáryo Duarte;
Spinelli, José Eduardo;
Silva, Bismarck Luiz

Publication type:

Article

Sb Additions in Near-Eutectic Sn-Bi Solder Decrease Planar Slip.

Published in:

Journal of Electronic Materials, 2023, v. 52, n. 11, p. 7365, doi. 10.1007/s11664-023-10666-6

By:

Fowler, Hannah N.;
Loaiza, Alexandra;
Bahr, David F.;
Blendell, John E.;
Handwerker, Carol A.

Publication type:

Article

Partial Segregation of Bi and Microvoid Formation on a Pure Cu Substrate After Solid–Solid Reactions.

Published in:

Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4000, doi. 10.1007/s11664-023-10390-1

By:

Wang, Yi-Wun;
Liang, Hua-Tui;
Chang, Kai-Chia;
Wu, Guo-Wei;
Tseng, Tzu-Ting;
Chen, Yi

Publication type:

Article

High-Temperature Thermal–Electrical Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints.

Published in:

Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3807, doi. 10.1007/s11664-023-10379-w

By:

An, C. W.;
Zhang, Q. K.;
Song, Z. L.

Publication type:

Article