Works matching DE "COPPER-tin alloys"

Results: 733

Alteration and Metallogenic Zonation in Magmatic-Hydrothermal Ore Systems: Scientific Understandings and Exploration Implications.

Published in:

Journal of Earth Science, 2025, v. 36, n. 3, p. 1303, doi. 10.1007/s12583-025-2034-z

By:

Zhai, Degao;
Wu, Jinchao;
Zhao, Qingqing;
Voudouris, Panagiotis;
Tombros, Stylianos;
Wang, Xinli;
Chen, Wangjie;
Sun, Jinghao;
Xu, Zhan;
Liu, Jiajun

Publication type:

Article

Effects of Minor Addition of Cu and Ni on the Microstructure, Thermal and Mechanical Properties, and Wettability of Sn-58Bi Solder Alloys.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 5, p. 4154, doi. 10.1007/s11664-025-11861-3

By:

Sungkhaphaitoon, Phairote;
Chantaramanee, Suchart

Publication type:

Article

Effects of Interaction Between Sn-Rich and Pb-Rich Phases on the Mechanical Properties of Sn-Pb Eutectic Solder Alloy at Cryogenic Temperature.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 3, p. 2368, doi. 10.1007/s11664-024-11694-6

By:

An, Qi;
Zhang, Minghua;
Wang, Ningning;
Fei, Jingming

Publication type:

Article

Microstructure and Bonding Properties of Transient Liquid-Phase Bonding using Cu-SnAgCu Molded Sheets By High-Pressure Powder Compression.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 1, p. 773, doi. 10.1007/s11664-024-11524-9

By:

Sakamoto, Ichizo;
Jeong, Doojin;
Tatsumi, Hiroaki;
Nishikawa, Hiroshi

Publication type:

Article

Effects of Mixed Percentage on the Microstructure and Mechanical Properties of Sn-52In/Sn-3.0Ag-0.5Cu Hybrid Solder Joints.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6463, doi. 10.1007/s11664-024-11350-z

By:

Zhao, W. T.;
Ren, J.;
Huang, M. L.

Publication type:

Article

Effect of Sn Orientation on Electromigration Failure in CuSn Solders.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6424, doi. 10.1007/s11664-024-11301-8

By:

Pham, Andrew Minh;
Haq, Fariha;
Sadasiva, Subramanya;
Li, Guangxu;
Koslowski, Marisol

Publication type:

Article

The Effect of Thermal Aging on the Mechanical Properties of Gold-Containing Solder Joints.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 9, p. 5460, doi. 10.1007/s11664-024-11264-w

By:

Bi, Yinghao;
Guo, Weiqi;
Wang, Shaobin;
Zhang, Weiwei;
Wu, Ping

Publication type:

Article

Enhanced Shear Strength of Sn-Bi/(111)Cu Joints by Refined Distribution of Bi in the Composite Solder.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 8, p. 4539, doi. 10.1007/s11664-024-11169-8

By:

Zhang, Dan;
Ma, Haoran;
Dong, Chong;
Guo, Tianhao;
Ma, Haitao;
Wang, Yunpeng

Publication type:

Article

Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 6, p. 3049, doi. 10.1007/s11664-024-11029-5

By:

Tu, Wenbin;
Wang, Hanbing;
Wang, Shanlin;
Chen, Yuhua;
Wei, Mingwei;
Zhang, Timing;
Xie, Jilin

Publication type:

Article

Effect of Cu Particles on the Properties of Sn-Bi-Pb Low-Melting-Point Alloys.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 6, p. 3035, doi. 10.1007/s11664-024-11009-9

By:

Niu, Chengchao;
Song, Zhuofei

Publication type:

Article

Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique.

Published in:

Surface Engineering, 2008, v. 24, n. 5, p. 337, doi. 10.1179/174329408X281821

By:

Hong, S. J.;
Park, B-H.;
Seo, D. S.;
Ryu, C.-R.

Publication type:

Article

Bimetallic Organic Framework‐Decorated Leaf‐like 2D Nanosheets as Flexible Air Cathode for Rechargeable Zn‐air Batteries.

Published in:

Chemistry - A European Journal, 2023, v. 29, n. 8, p. 1, doi. 10.1002/chem.202202992

By:

Li, Jiajia;
Huang, Shuhong;
Li, Zhiyong;
Zhao, Xiaohui;
Ouyang, Bo;
Kan, Erjun;
Zhao, Jie;
Zhang, Wenming

Publication type:

Article

Systematic Access of Ternary Organotetrel‐Copper Chalcogenide Clusters by [PhTE3]3− Anions (T=Si, Sn; E=S, Se).

Published in:

Chemistry - A European Journal, 2021, v. 27, n. 43, p. 11167, doi. 10.1002/chem.202101139

By:

Rinn, Niklas;
Guggolz, Lukas;
Hou, Han Yu;
Dehnen, Stefanie

Publication type:

Article

The interfacial Cu–Sn intermetallic compounds (IMCs) growth behavior of Cu/Sn/Cu sandwich structure via induction heating method.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18878, doi. 10.1007/s10854-019-02244-6

By:

Sun, Fenglian;
Yin, Zuozhu

Publication type:

Article

Effects of TiO2 nanoparticles addition on physical and soldering properties of Sn–xTiO2 composite solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18828, doi. 10.1007/s10854-019-02239-3

By:

Liu, Zhiyuan;
Ma, Haoran;
Shang, Shengyan;
Wang, Yunpeng;
Li, Xiaogan;
Ma, Haitao

Publication type:

Article

Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18524, doi. 10.1007/s10854-019-02206-y

By:

Wang, Z.;
Zhang, Q. K.;
Chen, Y. X.;
Song, Z. L.

Publication type:

Article

Wettability, interfacial reaction and mechanical properties of Sn/Sn–CuZnAl solder and Cu sheet during solid–liquid diffusion.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18462, doi. 10.1007/s10854-019-02200-4

By:

Sun, Lei;
Chen, Ming-he;
Zhang, Liang;
Xie, Lan-sheng;
Wei, Chun-chun

Publication type:

Article

Shear strength, fracture mechanism and plastic performance of Cu/Sn5Sb–xCuNiAg/Cu solder joints during thermal aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18342, doi. 10.1007/s10854-019-02188-x

By:

Han, Bangyao;
Sun, Fenglian;
Li, Tianhui;
Liu, Yang

Publication type:

Article

Microstructure and shear property of In-Sn-xAg solder joints fabricated by TLP bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 19, p. 18211, doi. 10.1007/s10854-019-02175-2

By:

Yang, Li;
Xiong, Yifeng;
Zhang, Yaocheng;
Jiang, Wei;
Wei, Di

Publication type:

Article

Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 19, p. 17583, doi. 10.1007/s10854-019-02107-0

By:

Jiang, Nan;
Zhang, Liang;
Liu, Zhi-quan;
Sun, Lei;
Xiong, Ming-yue;
Zhao, Meng;
Xu, Kai-kai

Publication type:

Article

Nucleation behavior of Mg2Sn on Ta surface during ultrasonic-assisted soldering of Ta/Sn/Mg joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 18, p. 17239, doi. 10.1007/s10854-019-02071-9

By:

Yang, Haifeng;
Tan, Qi;
Ji, Hongjun;
Xu, Wenfu;
Wang, Zhihong;
Li, Mingyu

Publication type:

Article

Experimental investigations in the intermetallic and microvoid formation in sub-200 °C Cu–Sn bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 16427, doi. 10.1007/s10854-019-02017-1

By:

Kannojia, Harindra Kumar;
Dixit, Pradeep

Publication type:

Article

Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 15964, doi. 10.1007/s10854-019-01966-x

By:

Zhu, Zhidan;
Ma, Haoran;
Shang, Shengyan;
Ma, Haitao;
Wang, Yunpeng;
Li, Xiaogan

Publication type:

Article

Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 16, p. 15054, doi. 10.1007/s10854-019-01878-w

By:

Zhao, Meng;
Zhang, Liang;
Liu, Zhi-quan;
Xiong, Ming-yue;
Sun, Lei;
Jiang, Nan;
Xu, Kai-kai

Publication type:

Article

Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 14791, doi. 10.1007/s10854-019-01852-6

By:

Cheng, Jinxuan;
Hu, Xiaowu;
Li, Qinglin

Publication type:

Article

Effect of Cu6Sn5 nanoparticles size on the properties of Sn0.3Ag0.7Cu nano-composite solders and joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 14726, doi. 10.1007/s10854-019-01844-6

By:

Min, Zhixian;
Qiu, Yu;
Hu, Xiaowu;
Wang, Haozhong

Publication type:

Article

Leveraging prior strain rates effect during stress relaxation of Sn–1.7Ag–0.7Cu lead-free alloys with microalloying of Te and Co for microelectronics applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 13757, doi. 10.1007/s10854-019-01758-3

By:

El-Daly, A. A.;
Zohdy, K. M.;
Abdo, M. A.;
Eid, N. A. M.

Publication type:

Article

The microstructure and shear behavior of Zn–25Sn–xTi solder joints with Ni substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 13090, doi. 10.1007/s10854-019-01672-8

By:

Chang, Che-Wei;
Lin, Kwang-Lung

Publication type:

Article

Viscoplastic characterization and mechanical strength of novel Sn–1.7Ag–0.7Cu lead-free solder alloys with microalloying of Te and Co.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12937, doi. 10.1007/s10854-019-01656-8

By:

El-Daly, A. A.;
Ibrahiem, A. A.;
Abdo, M. A.;
Eid, N. A. M.

Publication type:

Article

Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0Ag–0.5Cu solder joints during aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12911, doi. 10.1007/s10854-019-01653-x

By:

Kim, Jungsoo;
Back, Jong-Hoon;
Jung, Seung-Boo;
Yoon, Jeong-Won

Publication type:

Article

Microstructure and mechanical properties of Sn–1.0Ag–0.5Cu solder with minor Zn additions.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 13, p. 11914, doi. 10.1007/s10854-019-01532-5

By:

Leong, Y. M.;
Haseeb, A. S. M. A.;
Nishikawa, Hiroshi;
Mokhtari, Omid

Publication type:

Article

All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 18, p. 15966, doi. 10.1007/s10854-018-9682-z

By:

Shang, Shengyan;
Kunwar, Anil;
Yao, Jinye;
Wang, Yunpeng;
Zhao, Ning;
Huang, Mingliang;
Ma, Haitao

Publication type:

Article

Effects of aging temperature on tensile and fatigue behavior of Sn-3.0Ag-0.5Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 19, p. 14884, doi. 10.1007/s10854-017-7360-1

By:

Wang, Jundong;
Long, Xu;
Yao, Yao

Publication type:

Article

Formation mechanism and kinetic analysis of the morphology of CuSn in the spherical solder joints at the Sn/Cu liquid-solid interface during soldering cooling stage.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 7, p. 5398, doi. 10.1007/s10854-016-6200-z

By:

Guo, Bingfeng;
Ma, Haitao;
Jiang, Chengrong;
Wang, Yunpeng;
Kunwar, Anil;
Zhao, Ning;
Huang, Mingliang

Publication type:

Article

Interfacial reaction and mechanical properties for Cu/Sn/Ag system low temperature transient liquid phase bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4839, doi. 10.1007/s10854-016-4366-z

By:

Shao, Huakai;
Wu, Aiping;
Bao, Yudian;
Zhao, Yue;
Zou, Guisheng

Publication type:

Article

Low temperature chip on film bonding technology for 20 µm pitch applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3658, doi. 10.1007/s10854-015-4205-7

By:

Kim, Sun-Chul;
Kim, Young-Ho

Publication type:

Article

Electromigration in reduced-height solder joints with Cu pillars.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3715, doi. 10.1007/s10854-015-4213-7

By:

Chen, Ming-Yao;
Liang, Y.;
Chen, Chih

Publication type:

Article

The effect of Cu substrate texture on the intermetallic compounds (IMCs) growth at a Sn3.5Ag-Cu interface.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3854, doi. 10.1007/s10854-015-4233-3

By:

Hu, Fengtian;
Yang, Shan;
Kang, Un;
Hu, Anmin;
Li, Ming

Publication type:

Article

Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Sn/Cu and Cu/Sn0.7Cu/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 6, p. 4313, doi. 10.1007/s10854-015-2984-5

By:

Wei, G.;
Du, L.;
Jia, Y.;
Qi, L.

Publication type:

Article

Creep failure mechanism and life prediction of lead-free solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 1, p. 267, doi. 10.1007/s10854-014-2394-0

By:

Zhu, Yongxin;
Li, Xiaoyan;
Gao, Ruiting

Publication type:

Article

In situ study on growth behavior of CuSn during solidification with an applied DC in RE-doped Sn-Cu solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 10, p. 4538, doi. 10.1007/s10854-014-2201-y

By:

Zhou, Peng;
Kang, Huijun;
Cao, Fei;
Fu, Yanan;
Xiao, Tiqiao;
Wang, Tongmin

Publication type:

Article

Tensile properties of Cu/Sn-58Bi/Cu soldered joints subjected to isothermal aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 6, p. 2416, doi. 10.1007/s10854-014-1883-5

By:

Yu, Xiao;
Hu, Xiaowu;
Li, Yulong;
Liu, Teng;
Zhang, Ruhua;
Min, Zhixian

Publication type:

Article

The effect of reflow time on reactive wetting, evolution of interfacial IMCs and shear strength of eutectic Sn-Cu solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 3, p. 1446, doi. 10.1007/s10854-014-1749-x

By:

Sona, Mrunali;
Prabhu, K.

Publication type:

Article

Effect of heat-treatment on the structural and optical properties of CuS thin films deposited by CBD method.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 824, doi. 10.1007/s10854-013-1652-x

By:

Vasuhi, A.;
Xavier, R.;
Chandramohan, R.;
Muthukumaran, S.;
Dhanabalan, K.;
Ashokkumar, M.;
Parameswaran, P.

Publication type:

Article

Phase transformation and grain orientation of Cu-Sn intermetallic compounds during low temperature bonding process.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 10, p. 3905, doi. 10.1007/s10854-013-1337-5

By:

Hang, Chunjin;
Tian, Yanhong;
Zhang, Rui;
Yang, Dongsheng

Publication type:

Article

Influence of silver additions on electrical, mechanical and structures properties of rapidly solidified Sn-0.7%Cu alloy from melt.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 94, doi. 10.1007/s10854-011-0469-8

By:

Negm, Samia

Publication type:

Article

Suppression of CuSn and Kirkendall voids at Cu/Sn-3.5Ag solder joints by adding a small amount of Ge.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 56, doi. 10.1007/s10854-011-0412-z

By:

Yu, Chun;
Yang, Yang;
Li, Peilin;
Chen, Junmei;
Lu, Hao

Publication type:

Article

The effect of composition on microhardness and determination of electrical and thermal properties in the Sn-Cu alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 9, p. 1378, doi. 10.1007/s10854-011-0317-x

By:

Çadırlı, E.;
Kaya, H.

Publication type:

Article

Recent advances on Sn-Cu solders with alloying elements: review.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 6, p. 565, doi. 10.1007/s10854-011-0291-3

By:

Guang Zeng;
Songbai Xue;
Liang Zhang;
Lili Gao

Publication type:

Article

Electrical conductivity and viscosity of liquid Sn-Sb-Cu alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 6, p. 631, doi. 10.1007/s10854-010-0188-6

By:

Plevachuk, Yu.;
Sklyarchuk, V.;
Yakymovych, A.;
Svec, P.;
Janickovic, D.;
Illekova, E.

Publication type:

Article