Works matching DE "COPPER-tin alloys"
Results: 712
Development of hypoeutectic SnBi alloy solder reinforced with WO<sub>3</sub> nanoparticles for connecting Cu substrates via thermal bonding.
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- Scientific Reports, 2025, v. 15, n. 1, p. 1, doi. 10.1038/s41598-025-89729-z
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Investigation of the Microstructures and Mechanical Properties of Sn-Cu-Bi-In-Ni Solders.
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- Materials (1996-1944), 2025, v. 18, n. 4, p. 858, doi. 10.3390/ma18040858
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Bimetallic Organic Framework‐Decorated Leaf‐like 2D Nanosheets as Flexible Air Cathode for Rechargeable Zn‐air Batteries.
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- Chemistry - A European Journal, 2023, v. 29, n. 8, p. 1, doi. 10.1002/chem.202202992
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Dynamic Restructuring of Cu‐Doped SnS<sub>2</sub> Nanoflowers for Highly Selective Electrochemical CO<sub>2</sub> Reduction to Formate.
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- Angewandte Chemie, 2021, v. 133, n. 50, p. 26437, doi. 10.1002/ange.202111905
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Solidification microstructures in AgSn-CuSn pseudo-binary alloys.
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- Journal of Materials Science, 2016, v. 51, n. 13, p. 6474, doi. 10.1007/s10853-016-9947-y
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Synthesis of reduced graphene oxide-copper tin sulphide composites and their photoconductivity enhancement for photovoltaic applications.
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- Journal of Materials Science, 2015, v. 50, n. 24, p. 8029, doi. 10.1007/s10853-015-9370-9
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Microstructural study of Sn films electrodeposited on Cu substrates: Sn whiskers and CuSn precipitates.
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- Journal of Materials Science, 2015, v. 50, n. 7, p. 2944, doi. 10.1007/s10853-015-8859-6
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Infiltration of tin bronze into alumina particle beds: influence of alloy chemistry on drainage curves.
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- Journal of Materials Science, 2014, v. 49, n. 22, p. 7669, doi. 10.1007/s10853-014-8475-x
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First principles study of electronic and optical properties of CuZnSnX (X = S, Se) solar absorbers by Tran-Blaha-modified Becke-Johnson potential approach.
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- Journal of Materials Science, 2013, v. 48, n. 23, p. 8259, doi. 10.1007/s10853-013-7638-5
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Copper-oxide whisker growth on tin-copper alloy coatings caused by the corrosion of CuSn intermetallics.
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- Journal of Materials Science, 2013, v. 48, n. 23, p. 8052, doi. 10.1007/s10853-013-7619-8
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Interfacial reactions with and without current stressing at Sn-Co/Ag and Sn-Co/Cu solder joints.
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- Journal of Materials Science, 2013, v. 48, n. 19, p. 6640, doi. 10.1007/s10853-013-7464-9
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Strain- and strain-rate-dependent mechanical properties and behaviors of CuSn compound using molecular dynamics simulation.
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- Journal of Materials Science, 2012, v. 47, n. 7, p. 3103, doi. 10.1007/s10853-011-6144-x
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Vibrational properties of the mechanochemically synthesized Cu<sub>2</sub>SnS<sub>3</sub>: Raman study.
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- Journal of Raman Spectroscopy, 2022, v. 53, n. 5, p. 977, doi. 10.1002/jrs.6318
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Ancient Roman Coins from the Republican Age to the Imperial Age: A Multi-Analytical Approach.
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- Heritage (2571-9408), 2024, v. 7, n. 1, p. 412, doi. 10.3390/heritage7010020
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新型低温无铅焊料的研究进展.
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- Precious Metals / Guijinshu, 2022, v. 43, p. 42
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Ni 对 Ag-22Cu-17Zn-5Sn 钎料铸态组织与力学性能的影响.
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- Precious Metals / Guijinshu, 2022, v. 43, n. 3, p. 62
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Structure and properties of Sn-Cu lead-free solders in electronics packaging.
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- Science & Technology of Advanced Materials, 2019, v. 20, n. 1, p. 421, doi. 10.1080/14686996.2019.1591168
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Reevesite with Ordered Intralayer Atomic Arrangement as an Optimized Nickel‐Iron Oxygen Evolution Electrocatalyst.
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- ChemElectroChem, 2021, v. 8, n. 3, p. 558, doi. 10.1002/celc.202100030
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Graphene-Encapsulated Copper tin Sulfide Submicron Spheres as High-Capacity Binder-Free Anode for Lithium-Ion Batteries.
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- ChemElectroChem, 2017, v. 4, n. 5, p. 1124, doi. 10.1002/celc.201700100
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Recovery of high-grade copper from metal-rich particles of waste printed circuit boards by ball milling and sieving.
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- Environmental Technology, 2022, v. 43, n. 4, p. 514, doi. 10.1080/09593330.2020.1795932
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Effect of Ni/Sn ratio on microstructure and properties of Cu-Ni-Sn-P alloy.
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- Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-80079-w
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Irregular Electrodeposition of Cu-Sn Alloy Coatings in [EMIM]Cl Outside the Glove Box with Large Layer Thickness.
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- Coatings (2079-6412), 2021, v. 11, n. 3, p. 310, doi. 10.3390/coatings11030310
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Electrodeposition of Sn–In Alloys Involving Deep Eutectic Solvents.
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- Coatings (2079-6412), 2019, v. 9, n. 12, p. 800, doi. 10.3390/coatings9120800
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A New Type of Li Deposit: Hydrothermal Crypto-Explosive Breccia Pipe Type.
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- Journal of Earth Science, 2022, v. 33, n. 5, p. 1095, doi. 10.1007/s12583-022-1736-8
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Directional Solidification of Sn-Cu<sub>6</sub>Sn<sub>5</sub> In Situ Composites.
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- Advances in Materials Science & Engineering, 2019, p. 1, doi. 10.1155/2019/9210713
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Pb-FREE SOLDERS: ESTIMATING OF SOME PHYSICOCHEMICAL AND THERMODYNAMIC PROPERTIES OF TERNARY Cu-Ag-In SYSTEM.
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- Surface Review & Letters, 2019, v. 26, n. 10, p. N.PAG, doi. 10.1142/S0218625X19500768
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Density-functional and global optimization study of copper-tin core-shell clusters.
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- Canadian Journal of Chemistry, 2010, v. 88, n. 11, p. 1071, doi. 10.1139/V10-066
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LITERATURE REVIEW: Peer-Reviewed Literature of Interest to Failure Analysis: Cornucopia.
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- Electronic Device Failure Analysis, 2022, v. 24, n. 4, p. 55
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Thermal analysis of slow cooled copper-tin alloys.
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- Journal of Materials Science, 2001, v. 36, n. 19, p. 4779, doi. 10.1023/A:1017943525031
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Thermal analysis of copper-tin alloys during rapid solidification.
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- Journal of Materials Science, 2000, v. 35, n. 19, p. 4977, doi. 10.1023/A:1004846812384
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Controllability study of copper‐tin‐sulphide (Cu<sub>3</sub>SnS<sub>4</sub>) material based on the ratio adjustment of Cu to Sn elements.
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- Micro & Nano Letters (Wiley-Blackwell), 2023, v. 18, n. 9, p. 1, doi. 10.1049/mna2.12176
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Synthesis of novel CuSn<sub>10</sub>-graphite nanocomposite powders by mechanical alloying.
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- Micro & Nano Letters (Wiley-Blackwell), 2014, v. 9, n. 2, p. 109, doi. 10.1049/mnl.2013.0715
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- Article
石墨镀Sn 调控对石墨/Cu 复合材料组织及 力学性能的影响.
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- Acta Materiae Compositae Sinica, 2021, v. 38, n. 5, p. 1497, doi. 10.13801/j.cnki.fhclxb.20200902.003
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Influence of Copper Pretreatment on the Phase and Pore Formations in the Solid Phase Reactions of Copper with Tin.
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- Metallophysics & Advanced Technologies / Metallofizika i Novejsie Tehnologii, 2018, v. 40, n. 12, p. 1649, doi. 10.15407/mfint.40.12.1649
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Transformation of ancient Chinese and model two-phase bronze surfaces to smooth adherent patinas.
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- Phase Transitions, 2008, v. 81, n. 2/3, p. 217, doi. 10.1080/01411590701514375
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- Article
Study of the Formation of the Alloyed Surface Layer During Plasma Heating of Mixtures of Cu-Sn/CrXCY Alloys.
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- Tribology in Industry, 2021, v. 43, n. 3, p. 386, doi. 10.24874/ti.1070.03.21.05
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Ancient Repairs on Bronze Objects.
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- EXARC Journal, 2012, n. 3, p. 1
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- Article
How Metallographic Examinations Can Give the Forming Process of Metal Artefacts? The Example of the Hoard of Farébersviller.
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- EXARC Journal, 2012, n. 3, p. 1
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Experimental and numerical investigations on interface microstructure characteristics and wave formation mechanism of Sn/Cu explosive welded plates.
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- Composite Interfaces, 2023, v. 30, n. 5, p. 467, doi. 10.1080/09276440.2023.2179256
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- Article
The Fabrication of Freestanding Heterogeneous Copper-Tin Films with Meniscus Brush Plating Electrodeposition.
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- Journal of New Materials for Electrochemical Systems, 2015, v. 18, n. 1, p. 25
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- Article
A Hybrid Method for Predicting Fatigue Life of Lead-Free Solder Joints Under Coupled Electrical–Thermal–Mechanical Fields.
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- International Journal of Applied Mechanics, 2022, v. 14, n. 6, p. 1, doi. 10.1142/S1758825122500570
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Numerical computation of wetting angles of Sn–(3−x)Ag–0.5Cu−x(Bi,In) quaternary Pb-free solder alloy systems on Cu substrate.
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- International Journal of Modern Physics C: Computational Physics & Physical Computation, 2020, v. 31, n. 09, p. N.PAG, doi. 10.1142/S0129183120501193
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Ore-bearing potential of target 185 in the Chelopech deposit: a LA-ICP-MS study.
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- Review of the Bulgarian Geological Society, 2023, v. 84, n. 3, p. 219, doi. 10.52215/rev.bgs.2023.84.3.219
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- Article
Preparation and Superconducting Properties of Nb<sub>3</sub>Sn by Mechanical Alloying.
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- Journal of Low Temperature Physics, 2021, v. 205, n. 3/4, p. 100, doi. 10.1007/s10909-021-02608-5
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Skilled mirror craft of intermetallic delta high-tin bronze (Cu<sub>31</sub>Sn<sub>8</sub>, 32.6% tin) from Aranmula, Kerala.
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- Current Science (00113891), 2007, v. 93, n. 1, p. 35
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Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints.
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- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 852, doi. 10.1007/s11664-009-0769-4
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Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders.
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- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 828, doi. 10.1007/s11664-008-0611-4
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- Article
Fabrication of Cu(Ti) Alloy Interconnects with Self-Formation of Thin Barrier Metal Layers Using a High- Pressure Annealing Process.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1658, doi. 10.1007/s11664-007-0274-6
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Characteristics of ultrahigh electrical conductivity for Cu-Sn alloys.
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- Materials Science & Technology, 2014, v. 30, n. 4, p. 506, doi. 10.1179/1743284713Y.0000000370
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On assessment of processing variables on copper-tin functionally graded alloys produced by incremental melting and solidification process.
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- Materials Science & Technology, 2012, v. 28, n. 6, p. 748, doi. 10.1179/1743284712Y.0000000013
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