Works matching DE "COPPER-nickel-tin alloys"
Results: 8
An Experimental Investigation of Cu-Ni-Sn Alloy on Microstructure, Hardness and Wear Parameters Optimization using DOE.
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- Tribology in Industry, 2018, v. 40, n. 1, p. 156, doi. 10.24874/ti.2018.40.01.15
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- Article
A novel lattice correspondence of B19 → B19' transformation in Ti-Ni-Cu shape memory alloy thin film.
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- Philosophical Magazine Letters, 2011, v. 91, n. 5, p. 344, doi. 10.1080/09500839.2011.559912
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- Article
Microstructure formation in Sn-Cu-Ni solder alloys.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2011, v. 63, n. 10, p. 52, doi. 10.1007/s11837-011-0175-2
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- Article
Effect of Ni Content on Microstructure and Characterization of Cu-Ni-Sn Alloys.
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- Materials (1996-1944), 2018, v. 11, n. 7, p. 1108, doi. 10.3390/ma11071108
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- Article
Precipitation in a copper matrix modeled by ab initio calculations and atomistic kinetic Monte Carlo simulations.
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- Physica Status Solidi (B), 2017, v. 254, n. 4, p. n/a, doi. 10.1002/pssb.201600407
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- Article
Additive manufacturing of fine-structured copper alloy by selective laser melting of pre-alloyed Cu-15Ni-8Sn powder.
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- International Journal of Advanced Manufacturing Technology, 2018, v. 96, n. 9-12, p. 4223, doi. 10.1007/s00170-018-1891-3
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- Article
Dissolution and Interfacial Reactions of (Cu,Ni)Sn Intermetallic Compound in Molten Sn-Cu-Ni Solders.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 195, doi. 10.1007/s11664-013-2708-7
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- Article
Lead-free copper alloy endures high loads in piston bushings.
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- Advanced Materials & Processes, 2006, v. 164, n. 11, p. 34
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- Article