Works matching DE "COPPER-nickel-tin alloys"


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    Microstructure formation in Sn-Cu-Ni solder alloys.

    Published in:
    JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2011, v. 63, n. 10, p. 52, doi. 10.1007/s11837-011-0175-2
    By:
    • Felberbaum, M.;
    • Ventura, T.;
    • Rappaz, M.;
    • Dahle, A.
    Publication type:
    Article
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