Works matching DE "COPPER-bismuth alloys"
Results: 4
Creep of Cu-Bi Alloys with High Bi Content Near and Above Melting Temperature of Bi.
- Published in:
- Metallurgical & Materials Transactions. Part A, 2019, v. 50, n. 6, p. 2690, doi. 10.1007/s11661-019-05206-z
- By:
- Publication type:
- Article
Interfacial microstructure, wettability and material properties of nickel (Ni) nanoparticle doped tin-bismuth-silver (Sn-Bi-Ag) solder on copper (Cu) substrate.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3982, doi. 10.1007/s10854-015-4252-0
- By:
- Publication type:
- Article
Phase Equilibria of the Cu-Sn-Bi Ternary System.
- Published in:
- Journal of Phase Equilibria & Diffusion, 2016, v. 37, n. 5, p. 556, doi. 10.1007/s11669-016-0477-8
- By:
- Publication type:
- Article
Thermodynamic Assessment of the Bi-Ni and Bi-Ni- X ( X = Ag, Cu) Systems.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 2, p. 1041, doi. 10.1007/s11664-015-4272-9
- By:
- Publication type:
- Article