Preview: Journal of the Chinese Chemical Society 7/2015.
- Published in:
- 2015
- Publication type:
- Other
Works matching DE "COPPER structure-activity relationships"
Results: 14
1
2
Synthesis, Structural and Dielectric Characterization of two Imidazole- and Oxalate-containing Copper(II) Complexes.
- Published in:
- Zeitschrift für Anorganische und Allgemeine Chemie, 2013, v. 639, n. 7, p. 1274, doi. 10.1002/zaac.201300101
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- Publication type:
- Article
3
Influence of acido ligands on the structure of copper dihalide solvates with dimethyl sulfoxide and N,N-dimethylformamide.
- Published in:
- Russian Journal of General Chemistry, 2011, v. 81, n. 9, p. 1772, doi. 10.1134/S1070363211090064
- By:
- Publication type:
- Article
4
Isolation of the Copper Redox Steps in the Standard Selective Catalytic Reduction on Cu-SSZ-13.
- Published in:
- Angewandte Chemie, 2014, v. 126, n. 44, p. 12022, doi. 10.1002/ange.201407030
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- Publication type:
- Article
5
Copper-catalysed couplings of N-substituted-N-methacryloylbenzamides with isopropanol to generate hydroxyl-substituted isoquinoline-1,3(2H,4H)-dione derivatives.
- Published in:
- Journal of Chemical Research, 2016, v. 40, n. 8, p. 498, doi. 10.3184/174751916X14665140776930
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- Publication type:
- Article
6
BUSINESS TRENDS.
- Published in:
- Advanced Materials & Processes, 2007, v. 165, n. 10, p. 19
- Publication type:
- Article
7
FORMATION MECHANISM AND CHARACTERIZATION OF NANOCRYSTALLINE CU SYNTHESIZED BY MECHANO-CHEMICAL METHOD.
- Published in:
- International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2008, v. 22, n. 18/19, p. 2962, doi. 10.1142/S021797920804781X
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- Publication type:
- Article
8
INFLUENCE OF MICROALLOYING AND THE THERMOMECHANICAL METHOD OF PROCESSING ON THE COMMINUTION OF THE COPPER STRUCTURE.
- Published in:
- Materials & Technologies / Materiali in Tehnologije, 2025, v. 59, n. 1, p. 11, doi. 10.17222/mit.2024.1171
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- Publication type:
- Article
9
Enhanced Electromigration Resistance of Pb-Free Solders by Using Cu/Sn Composite Structure.
- Published in:
- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2014, v. 66, n. 11, p. 2334, doi. 10.1007/s11837-014-1180-z
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- Publication type:
- Article
10
Amino Acid Based Dynamic Metal-Biomolecule Frameworks.
- Published in:
- Chemistry - A European Journal, 2013, v. 19, n. 34, p. 11178, doi. 10.1002/chem.201301744
- By:
- Publication type:
- Article
11
Conductive Carbon Loaded Polymer Film Electrodes for Pulsed Power Applications. Part II: Determination and Minimization of the Contact Resistance.
- Published in:
- International Journal of Polymer Analysis & Characterization, 2009, v. 14, n. 1, p. 1, doi. 10.1080/10236660802553533
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- Publication type:
- Article
12
NEW COPPER(I) COMPLEXES WITH ORGANOPHOSPHORUS LIGANDS WITH XPNSO SKELETON.
- Published in:
- Studia Universitatis Babes-Bolyai, Chemia, 2013, v. 58, n. 4, p. 243
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- Publication type:
- Article
13
Effect of Intermetallic on Electromigration and Atomic Diffusion in Cu/SnAg<sub>3.0</sub>Cu<sub>0.5</sub>/Cu Joints: Experimental and First-Principles Study.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 866, doi. 10.1007/s11664-009-0760-0
- By:
- Publication type:
- Article
14
Responses of Candida fukuyamaensis RCL-3 and Rhodotorula mucilaginosa RCL-11 to copper stress.
- Published in:
- Journal of Basic Microbiology, 2009, v. 49, n. 4, p. 395, doi. 10.1002/jobm.200800218
- By:
- Publication type:
- Article