Works matching DE "COPPER siding"

Results: 17

A facile method for the preparation of furfurylamine based benzoxazine resin with high-frequency low dielectric constants and ultra-low dielectric losses.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 9, p. 8358, doi. 10.1007/s10854-019-01153-y

By:

Pang, Tao;
Zeng, Ming;
Feng, Zijian;
Chen, Jiangbing;
Huang, Yiwan;
Xu, Qingyu

Publication type:

Article

Synthesis and properties of cyanate mixed resin systems modified by polyphenylene oxide for production of high-frequency copper clad laminates.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 4, p. 2831, doi. 10.1007/s10854-017-8212-8

By:

Weng, Ling;
Zhang, Yingchun;
Zhang, Xiaorui;
Liu, Lizhu;
Zhang, Hexin

Publication type:

Article

Strength and its prediction models based on fracture mechanics of thin layers copper cladding steel wires under different amount of deformation.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 12, p. 12499, doi. 10.1007/s10854-016-5687-7

By:

Li, Hongjuan;
Ding, Zhimin;
Zhao, Yadong;
Zhao, Ruirong

Publication type:

Article

Design of flexible copper clad laminate with outstanding adhesion strength induced by chemical bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 12, p. 5446, doi. 10.1007/s10854-014-2327-y

By:

Li, Kui;
Tong, Lifen;
Jia, Kun;
Liu, Xiaobo

Publication type:

Article

Effects of annealing process on microstructure and electrical properties of cold-drawn thin layer copper cladding steel wire.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 11, p. 5107, doi. 10.1007/s10854-014-2279-2

By:

Li, Hongjuan;
Ding, Zhimin;
Fang, Jianfei;
Gao, Yang;
Sun, Chengxin

Publication type:

Article

Electroless copper plating on 1,2-ethylenediamine grafted poly(ethyleneterepthalate) for the fabrication of flexible copper clad laminate.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 7, p. 2211, doi. 10.1007/s10854-013-1081-x

By:

Xue, Longlong;
liang, Qian;
Lu, Yinxiang

Publication type:

Article

Novel Poly(benzoxazole-etherimide) Copolymer for Two-Layer Flexible Copper-Clad Laminate.

Published in:

Journal of Macromolecular Science: Physics, 2012, v. 51, n. 11, p. 2157, doi. 10.1080/00222348.2012.665779

By:

Zhuang, Yongbing;
Gu, Yi

Publication type:

Article

NOVEL MINIATURIZED KOCH PENTAGONAL FRACTAL ANTENNA FOR MULTIBAND WIRELESS APPLICATIONS.

Published in:

Progress in Electromagnetics Research, 2013, v. 141, p. 693, doi. 10.2528/pier13060904

By:

Khan, Omar M.;
Islam, Zain U.;
Rashid, Imran;
Bhatti, Farooq A.;
Islam, Qamar U.

Publication type:

Article

Application of bio‐based dimer acid diglycidyl ester in paper‐based copper clad laminate.

Published in:

Journal of Applied Polymer Science, 2019, v. 136, n. 19, p. N.PAG, doi. 10.1002/app.47508

By:

Sun, Yiang;
Zong, Chuanhui;
Wang, Fei;
Zhang, Na;
Li, Aixiang;
Li, Qiuhong;
LYu, Zijian

Publication type:

Article

Grey system theory and fuzzy time series forecasting for the growth of green electronic materials.

Published in:

International Journal of Production Research, 2014, v. 52, n. 10, p. 2931, doi. 10.1080/00207543.2013.857057

By:

Lee, Yu-Cheng;
Wu, Chia-Huei;
Tsai, Sang-Bing

Publication type:

Article

Fabrication of Micro-sized Al/Cu Clad by Repeated Hydrostatic Extrusion and Its Mechanical Properties.

Published in:

Materials & Manufacturing Processes, 2014, v. 29, n. 6, p. 683, doi. 10.1080/10426914.2014.912303

By:

Lee, J.B.;
Kim, Y.H.;
Jeong, H.G.

Publication type:

Article

Dielectric properties and their dependence of polyetherimide/bismaleimide blends for high performance copper clad laminates.

Published in:

Journal of Polymer Research, 2011, v. 18, n. 6, p. 1459, doi. 10.1007/s10965-010-9551-9

By:

Zhu, Sunxin;
Gu, Aijuan;
Liang, Guozheng;
Yuan, Li

Publication type:

Article

Microstructure and properties of the Al-0.5 wt.% Fe alloy wire, copperclad by electrochemical deposition.

Published in:

International Journal of Lightweight Materials & Manufacture, 2025, v. 8, n. 1, p. 28, doi. 10.1016/j.ijlmm.2024.08.001

By:

Medvedev, A. E.;
Kiryanova, K. E.;
Medvedev, E. B.;
Gorbatkov, M. V.;
Motkov, M. M.

Publication type:

Article

How Can a Company Continue an Unprofitable Business?: Case Study of a Japanese Functional Chemical Company.

Published in:

Annals of Business Administrative Science (ABAS), 2017, v. 16, n. 3, p. 125, doi. 10.7880/abas.0170227a

By:

Kenichi KUWASHIMA

Publication type:

Article

Surface Defects and Corrosions Developed on Copper Clad Aluminium Wires Investigated by Scanning Electron Microscope Analysis and X-Ray Mappings.

Published in:

Acta Microscopica, 2022, v. 31, n. 2, p. 1

By:

Aydar, E.

Publication type:

Article

Thermal Resistance Analysis of Light-Emitting Diode Modules with Thermal Via Structure.

Published in:

Journal of Electronic Materials, 2018, v. 47, n. 12, p. 7323, doi. 10.1007/s11664-018-6672-0

By:

Shin, Hyeong-Won;
Jung, Seung-Boo;
Lee, Hyo-Soo

Publication type:

Article

Casting Defects in Transition Layer of Cu/Al Composite Castings Prepared Using Pouring Aluminum Method and Their Formation Mechanism.

Published in:

High Temperature Materials & Processes, 2019, v. 38, p. 199, doi. 10.1515/htmp-2017-0124

By:

Chen, Shuying;
Ma, Shengnan;
Chen, Zhilin;
Yue, Xudong;
Chang, Guowei

Publication type:

Article