Works about COPPER plating
Results: 480
Enhancing copper plating quality: the role of organic acids in electroless processes.
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- Transactions of the Institute of Metal Finishing, 2025, v. 103, n. 2, p. 82, doi. 10.1080/00202967.2024.2440275
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- Article
Effects of Tool Structure and Process Parameters in Friction Stir Welding on the Temperature and Mechanical Properties of Dissimilar Copper–Aluminium Welded Joints.
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- Metals (2075-4701), 2025, v. 15, n. 2, p. 193, doi. 10.3390/met15020193
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- Article
Factors influencing damascene feature fill using copper PVD and electroplating.
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- Solid State Technology, 2000, v. 43, n. 7, p. 86
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- Article
Surface Grafting "Band‐Aid" for "Everyone": Filter Paper‐Assisted Surface‐Initiated Polymerization in the Presence of Air.
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- Angewandte Chemie, 2021, v. 133, n. 24, p. 13733, doi. 10.1002/ange.202103182
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- Article
Very long-term aging of 52In–48Sn (at.%) solder joints on Cu-plated stainless steel substrates.
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- Journal of Materials Science, 2009, v. 44, n. 2, p. 545, doi. 10.1007/s10853-008-3083-2
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- Article
“Anionic effect” in copper plating from sulfate aqueous-ethanolic electrolyte containing cyclic polyester.
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- Protection of Metals, 2005, v. 41, n. 2, p. 149, doi. 10.1007/s11124-005-0021-4
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- Article
Nickel silicide contacts formed by excimer laser annealing for high efficiency solar cells.
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- Progress in Photovoltaics, 2013, v. 21, n. 3, p. 267, doi. 10.1002/pip.2362
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- Article
Compact metal-plate slotted WLAN-WIMAX antenna design with USB Wi-Fi adapter application.
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- Turkish Journal of Electrical Engineering & Computer Sciences, 2019, v. 27, n. 6, p. 4403, doi. 10.3906/elk-1904-122
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- Article
Рівновага шаруватого Cu/Ni/Cr-покриття під локальним навантаженням.
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- Nanosistemi, Nanomateriali, Nanotehnologii, 2023, v. 21, n. 2, p. 379
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- Article
3D Printings: Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers (Adv. Mater. Interfaces 8/2018).
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- Advanced Materials Interfaces, 2018, v. 5, n. 8, p. 1, doi. 10.1002/admi.201870038
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- Article
Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers.
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- Advanced Materials Interfaces, 2018, v. 5, n. 8, p. 1, doi. 10.1002/admi.201701285
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- Article
Impact of Particle Size Distribution on Performance of Lithium‐Ion Batteries.
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- ChemElectroChem, 2020, v. 7, n. 23, p. 4755, doi. 10.1002/celc.202001249
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- Article
Cuprous Ion Mass Transport Limitations During Copper Electrodeposition.
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- ChemElectroChem, 2017, v. 4, n. 8, p. 1849, doi. 10.1002/celc.201700208
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- Article
SYNTHESIS AND STUDY OF AN ELECTROCHEMICAL CELL BASED ON ZEOLITE AND ITS COMPOSITES.
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- Oxidation Communications, 2023, v. 46, n. 3, p. 707
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- Article
Microstructure and properties of joint of Al/Cu welded by resistance element welding with an auxiliary gasket of Ni.
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- Scientific Reports, 2025, v. 14, n. 1, p. 1, doi. 10.1038/s41598-025-85124-w
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- Article
Corrective Estimation of Copper Deposition Density onto Stainless Steel Substrate by Electroplating.
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- Walailak Journal of Science & Technology, 2017, v. 14, n. 5, p. 369
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- Article
Characterization of MAO + Cu Composite Coatings on Aluminum Alloy.
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- Coatings (2079-6412), 2021, v. 11, n. 10, p. 1172, doi. 10.3390/coatings11101172
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- Article
The improvement of the circular saw cutting unit using linear induction drive.
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- International Wood Products Journal, 2022, v. 13, n. 2, p. 115, doi. 10.1080/20426445.2022.2039984
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- Article
Electrical Activation of Polymer Reny1002H Surface with Laser Irradiation for Molded Interconnect Devices.
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- Journal of Laser Micro / Nanoengineering, 2021, v. 16, n. 1, p. 68, doi. 10.2961/jlmn.2021.01.2012
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- Article
Effect of Multiwalled Carbon Nanotubes and Electroless Copper Plating on the Tensile Behavior of Carbon Fiber Reinforced Polymers.
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- Advances in Materials Science & Engineering, 2018, p. 1, doi. 10.1155/2018/8264138
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- Article
A NOVEL PREPARATION ROUTE FOR ELECTROLESS COPPER PLATING ON SURFACE OF CaCO<sub>3</sub> POWDERS.
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- Surface Review & Letters, 2019, v. 26, n. 5, p. N.PAG, doi. 10.1142/S0218625X1850186X
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- Article
COPPER PLATING FROM NON-CYANIDE ALKALINE BATHS.
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- Surface Review & Letters, 2014, v. 21, n. 1, p. -1, doi. 10.1142/S0218625X14500097
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- Article
Photoelectron shield for the first mirror of a soft X‐ray beamline.
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- Journal of Synchrotron Radiation, 2021, v. 28, n. 1, p. 86, doi. 10.1107/S1600577520013648
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- Article
STUDY OF DROPLET DYNAMICS AND CONDENSATION HEAT TRANSFER ON SUPERHYDROPHOBIC COPPER SURFACE.
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- Thermal Science, 2021, v. 25, n. 1B, p. 653, doi. 10.2298/TSCI190126089Y
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- Article
Cyclic Biaxial Stress Measurement Method Using the Grain Growth Direction in Electrodeposited Copper Foil.
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- EURASIP Journal on Advances in Signal Processing, 2010, p. 1, doi. 10.1155/2010/928216
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- Article
Methods for surface preparation for brazing dissimilar metallic materials.
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- Welding International, 2010, v. 24, n. 9, p. 726, doi. 10.1080/09507116.2010.486175
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- Article
The origins of engraved marine shell cups, copper repoussé plates, and ritual centers: disentangling early Cahokia symbolism from post–AD 1200 SECC iconography.
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- Southeastern Archaeology, 2023, v. 42, n. 2, p. 83, doi. 10.1080/0734578X.2022.2155357
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- Article
Rembrandt's Old Woman Praying, 1629/30: A look below the surface using X‐ray fluorescence mapping.
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- XRS: X-ray Spectrometry, 2019, v. 48, n. 4, p. 293, doi. 10.1002/xrs.2985
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- Article
LOCATING FAILURES IN CURRENT DEVICE NODES: EBIC/EBAC, CURRENT IMAGING AND NANOPROBING.
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- Electronic Device Failure Analysis, 2018, v. 20, n. 3, p. 24, doi. 10.31399/asm.edfa.2018-3.p024
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- Article
Sol-gel synthesis, physicochemical characterization, and analytical applications of copper selective composite cation exchanger: Polyvinyl alcohol Ce(IV) phosphate.
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- Polymer Composites, 2017, v. 38, n. 2, p. 332, doi. 10.1002/pc.23591
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- Article
DIRECT PLATED COPPER METALLIZED SUBSTRATE AND ITS APPLICATION ON MICROWAVE CIRCUITS.
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- Microwave Journal, 2010, v. 53, n. 10, p. 84
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- Article
Electromagnetic shielding efficiency of plasma treated and electroless metal plated polypropylene nonwoven fabrics.
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- Journal of Materials Science, 2004, v. 39, n. 6, p. 2215
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- Article
耐蚀合金特殊螺纹拧接异常原因分析及改进方法.
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- Steel Pipe, 2022, v. 51, n. 6, p. 38, doi. 10.19938/j.steelpipe.1001-2311.2022.6.38.41
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- Article
Electrical conductive Cu/glass fibre composites prepared by electroless plating.
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- Micro & Nano Letters (Wiley-Blackwell), 2014, v. 9, n. 2, p. 83, doi. 10.1049/mnl.2013.0704
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- Article
Study on the Influence of Consignment Copper Cathode Sampling and Preparation Method on Iron Content.
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- Chinese Journal of Inorganic Analytical Chemistry / Zhongguo Wuji Fenxi Huaxue, 2022, v. 12, n. 2, p. 108, doi. 10.3969/j.issn.2095-1035.2022.02.018
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- Article
EXPLORING CADAVER SKIN FOR STANDARDIZATION OF RABBIT AND PORCINE BURN MODELS IN RESEARCH.
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- Annals of Burns & Fire Disasters, 2020, v. 33, n. 4, p. 334
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- Article
碳纳米管-Ti3AlC2/AZ91D 复合材料的 微观组织及力学性能.
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- Acta Materiae Compositae Sinica, 2020, v. 37, n. 7, p. 1649, doi. 10.13801/j.cnki.fhclxb.20191128.002
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- Article
О СЮЖЕТЕ НА ТАЛЕРЕ ИЗ СОБРАНИЯ НАЦИОНАЛЬНОГО МУЗЕЯ ВАРШАВЫ.
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- Tyragetia, 2022, v. 16, n. 1, p. 333
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- Article
대면 구조 유전체 장벽 방전 플라즈마의 X-Band 내 RCS 저감 효과.
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- Journal of Korean Institute of Electromagnetic Engineering & Science / Han-Guk Jeonjapa Hakoe Nonmunji, 2020, v. 31, n. 12, p. 1084, doi. 10.5515/KJKIEES.2020.31.12.1084
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- Article
Speciation of Copper(II)‐Betaine Complexes as Starting Point for Electrochemical Copper Deposition from Ionic Liquids.
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- ChemistryOpen, 2021, v. 10, n. 2, p. 97, doi. 10.1002/open.202000231
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- Article
Identifying Editions of the Ptolemy of Rome Maps (1478/90–1507/08) by Copper Plates Changes.
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- ISPRS International Journal of Geo-Information, 2024, v. 13, n. 6, p. 195, doi. 10.3390/ijgi13060195
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- Article
Generalized thermoelastic diffusion problem in a thick circular plate with axisymmetric heat supply.
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- Acta Mechanica, 2015, v. 226, n. 7, p. 2121, doi. 10.1007/s00707-015-1305-7
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- Article
Application of new biosorbent based on chemicaly modified Lagenaria vulgaris shell for the removal of copper(II) from aqueous solutions: Effects of operational parameters.
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- Chemical Industry / Hemijska Industrija, 2013, v. 67, n. 4, p. 559, doi. 10.2298/HEMIND120703097K
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- Article
Heat transfer behaviour of funnel mould copper plates with high casting speed during different water supply processes.
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- Ironmaking & Steelmaking, 2022, v. 49, n. 8, p. 771, doi. 10.1080/03019233.2022.2056294
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- Article
Space–time characteristics of true and false sticker breakouts in mould during continuous casting.
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- Ironmaking & Steelmaking, 2021, v. 48, n. 8, p. 901, doi. 10.1080/03019233.2020.1836709
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- Article
Heat transfer behaviour of funnel mould copper plates during thin slab continuous casting and channel structure optimization.
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- Ironmaking & Steelmaking, 2020, v. 47, n. 10, p. 1135, doi. 10.1080/03019233.2019.1674590
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- Article
THE ENERGY OF ACTIVATION FOR ACCELERATORS AND STABILIZERS IN ELECTROLESS COPPER COATING.
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- Rasayan Journal of Chemistry, 2023, v. 16, n. 2, p. 833, doi. 10.31788/RJC.2023.1628292
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- Article
INVESTIGATION OF ENHANCING THE PERFORMANCE AND DEPOSITION CHARACTERISTICS OF COPPER (II) METHANE SULPHONATE SALT COMPLEXED WITH D-MANNITOL BATH.
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- Rasayan Journal of Chemistry, 2022, v. 15, n. 2, p. 1154, doi. 10.31788/RJC.2022.1526837
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- Article
ELEMENTAL CHARACTERIZATION OF HUMAN BLOOD USING LASER-INDUCED BREAKDOWN SPECTROSCOPY UTILIZING 355 NM Nd: YAG OPERATED AT REDUCED PRESSURE OF He GAS.
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- Rasayan Journal of Chemistry, 2021, v. 14, n. 4, p. 2413, doi. 10.31788/RJC.2021.1445975
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- Article
Chemical and Electrochemical Metallic Covering of ABS polymers.
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- Analele Universitatii 'Eftimie Murgu', 2009, v. 16, n. 1, p. 89
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- Article