Works matching DE "COPPER plating"

Results: 517

Factors influencing damascene feature fill using copper PVD and electroplating.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 86

By:

Reid, Jan;
Mayer, Steve;
Broadbent, Eliot;
Klawuhn, Erich;
Ashtiani, Kaihan

Publication type:

Article

Nanoparticles Addition in AA2024 Aluminum/Pure Copper Plate: FSSW Approach, Microstructure Evolution, Texture Study, and Mechanical Properties.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2022, v. 74, n. 11, p. 4420, doi. 10.1007/s11837-022-05481-z

By:

Bagheri, Behrouz;
Alizadeh, Mehdi;
Mirsalehi, Seyyed Ehsan;
Shamsipur, Ali;
Abdollahzadeh, Amin

Publication type:

Article

Separation and Extraction of Valuable Metals from Electroplating Sludge by Carbothermal Reduction and Low-Carbon Reduction Refining.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2020, v. 72, n. 2, p. 782, doi. 10.1007/s11837-019-03880-3

By:

Tian, Lei;
Chen, Lijie;
Gong, Ao;
Wu, Xuangao;
Cao, Caifang;
Liu, Dudan;
Chen, Zhi-Qiang;
Xu, Zhi-Feng;
Liu, Yong

Publication type:

Article

Experimental comparative study on using different cooling techniques with photovoltaic modules.

Published in:

Journal of Thermal Analysis & Calorimetry, 2023, v. 148, n. 9, p. 3805, doi. 10.1007/s10973-022-11940-1

By:

Alktranee, Mohammed;
Bencs, Péter

Publication type:

Article

Thermal performance evaluation of a water-filled axially grooved copper flat heat pipe for electronics cooling.

Published in:

Journal of Thermal Analysis & Calorimetry, 2022, v. 147, n. 15, p. 8579, doi. 10.1007/s10973-021-11099-1

By:

Mansouri, Jed;
Saad, Imène;
Maalej, Samah;
Driss, Améni;
Zaghdoudi, Mohamed Chaker

Publication type:

Article

Study on explosive welding A7075 and Ti–6Al–4 V with aluminum or copper interlayer.

Published in:

Journal of Materials Science, 2024, v. 59, n. 33, p. 15883, doi. 10.1007/s10853-024-10122-8

By:

Liang, Guofeng;
Huang, Jiawen;
Zhou, Dapeng;
Hu, Jianian;
Li, Kebin;
Zhu, Guichun;
Liu, Zhongshu;
Chen, Xiang

Publication type:

Article

Rapid and effective method of laser metallization of dielectric materials using deep eutectic solvents with copper acetate.

Published in:

Journal of Materials Science, 2023, v. 58, n. 22, p. 9322, doi. 10.1007/s10853-023-08573-6

By:

Khairullina, Evgeniia;
Shishov, Andrey;
Gordeychuk, Dmitry;
Logunov, Lev;
Levshakova, Aleksandra;
Sosnovsky, Vladimir B.;
Koroleva, Aleksandra;
Mikhailovsky, Vladimir;
Gurevich, Evgeny L.;
Chernyshov, Ivan;
Panov, Maxim S.;
Tumkin, Ilya

Publication type:

Article

Copper plating on water-soluble NaCl particles by evaporative crystallization and its effect on the pore structure of infiltrated AlSi12 alloy foam.

Published in:

Journal of Materials Science, 2023, v. 58, n. 22, p. 9308, doi. 10.1007/s10853-023-08570-9

By:

Xia, Qianfu;
Zuo, Xiaoqing;
Zhou, Yun;
Yi, Jianhong;
Huang, Bei

Publication type:

Article

Direct preparation of graphene films with improved cleanness on dielectric substrates by a face-to-face method.

Published in:

Journal of Materials Science, 2022, v. 57, n. 39, p. 18486, doi. 10.1007/s10853-022-07778-5

By:

Wang, Zehui;
Shen, Honglie;
Zhu, Junkui;
Zhang, Jingzhe;
Xu, Yajun;
Luo, Kewen;
Ge, Jiawei;
Mao, Weibiao;
Li, Yufang;
Wu, Tianru

Publication type:

Article

Cover Picture: Materials and Corrosion. 2/2025.

Published in:

Materials & Corrosion / Werkstoffe und Korrosion, 2025, v. 76, n. 2, p. 207, doi. 10.1002/maco.202570021

By:

Guo, Xuyan;
Xiong, Zhuangzhuang;
Wang, Guixiang;
Ma, Fuqiu;
Ji, Mingbo;
Wu, Ruizhi

Publication type:

Article

Machine learning‐based analysis and prediction of the interfacial corrosion processes of copper cathode plates during the electrolytic production of copper powders.

Published in:

Materials & Corrosion / Werkstoffe und Korrosion, 2022, v. 73, n. 5, p. 811, doi. 10.1002/maco.202112977

By:

Zhou, Youzhi;
Lin, Pengcheng;
Ke, Xin;
Hu, Qiang;
Shi, Qi;
Zhang, Jingguo;
Wang, Zhong;
Wang, Limin

Publication type:

Article

Thermal Design of CCM Mold with Slotted Water Cooling Channels.

Published in:

Metallurgist, 2023, v. 66, n. 9/10, p. 1181, doi. 10.1007/s11015-023-01431-5

By:

Yachikov, I. M.;
Samodurova, M. N.;
Feoktistov, N. A.;
Latfulina, Yu.S.;
Trofimova, S. N.

Publication type:

Article

Mathematical Model of Electromembrane Separation of Copper-Electroplating Production Solutions.

Published in:

Theoretical Foundations of Chemical Engineering, 2020, v. 54, n. 1, p. 208, doi. 10.1134/S0040579519060071

By:

Lazarev, S. I.;
Abonosimov, O. A.;
Protasov, D. N.;
Shestakov, K. V.

Publication type:

Article

Synthesis of Cu2O-Based Heterostructures and Their Photocatalytic Properties for Water Splitting.

Published in:

Inorganic Materials, 2020, v. 56, n. 4, p. 366, doi. 10.1134/S0020168520040159

By:

Zimbovskii, D. S.;
Baranov, A. N.

Publication type:

Article

Hydrothermal Synthesis of Cu<sub>2</sub>O Films on the Surface of Metallic Copper in a NaOH Solution.

Published in:

Inorganic Materials, 2019, v. 55, n. 6, p. 582, doi. 10.1134/S0020168519060177

By:

Zimbovskii, D. S.;
Churagulov, B. R.;
Baranov, A. N.

Publication type:

Article

铜和陶瓷低温钎焊接头研究.

Published in:

Metal Working (1674-165X), 2025, n. 1, p. 27

By:

王发;
刘美川;
陈炫如;
李佳萍;
周嘉玲;
于学勇;
戴军

Publication type:

Article

Study on the Influence of Consignment Copper Cathode Sampling and Preparation Method on Iron Content.

Published in:

Chinese Journal of Inorganic Analytical Chemistry / Zhongguo Wuji Fenxi Huaxue, 2022, v. 12, n. 2, p. 108, doi. 10.3969/j.issn.2095-1035.2022.02.018

By:

ZHU Mingwei;
SUN Menghe;
JIANG Lili;
LIU Wei;
JIANG Qiutao

Publication type:

Article

SYNTHESIS AND STUDY OF AN ELECTROCHEMICAL CELL BASED ON ZEOLITE AND ITS COMPOSITES.

Published in:

Oxidation Communications, 2023, v. 46, n. 3, p. 707

By:

BELOVSKI, I. R.;
IVANOV, K. I.;
MIDYUROVA, B. N.;
MIHALEV, T. T.

Publication type:

Article

Conductivity and tribological properties of IL-PANI/WS<sub>2</sub> composite material in lithium complex grease.

Published in:

Friction (2223-7704), 2023, v. 11, n. 6, p. 977, doi. 10.1007/s40544-022-0638-1

By:

Xia, Yanqiu;
Wang, Yuanhui;
Hu, Chenglong;
Feng, Xin

Publication type:

Article

Corrective Estimation of Copper Deposition Density onto Stainless Steel Substrate by Electroplating.

Published in:

Walailak Journal of Science & Technology, 2017, v. 14, n. 5, p. 369

By:

SUMRUNRONNASAK, Sarocha;
TANTAYANON, Supawan;
KIATGAMOLCHAI, Somchai

Publication type:

Article

The Effect of Surface Coating Treatment on the Properties of Carbon Nanotube Reinforced Copper Matrix Composites.

Published in:

Physica Status Solidi. A: Applications & Materials Science, 2022, v. 219, n. 21, p. 1, doi. 10.1002/pssa.202200368

By:

Zhou, Ting;
Xu, Yanjun;
Lei, Ming;
Zhang, Xu;
Zhao, Yiluo;
Zhao, Yong;
Zhou, Lijun

Publication type:

Article

Two Coupled Analysis Strategies for Melt-Ablation Modeling of Thermal Protection Material in Supersonic Gas-Particle Two-Phase Impingement Flow.

Published in:

Aerospace (MDPI Publishing), 2023, v. 10, n. 7, p. 583, doi. 10.3390/aerospace10070583

By:

Lai, Chong-You;
Leu, Tzong-Shyng

Publication type:

Article

Lead Contamination Differences in the Muscle of Wild Turkeys Harvested with Lead and Copper-Plated Lead Shot.

Published in:

Journal of Fish & Wildlife Management, 2021, v. 12, n. 1, p. 250, doi. 10.3996/JFWM-20-084

By:

Tisdale, Cody A.;
Martin, James A.;
Beasley, James C.

Publication type:

Article

Preparation and properties of carbon fiber reinforced silver based electrical contact materials.

Published in:

Basic Sciences Journal of Textile Universities / Fangzhi Gaoxiao Jichu Kexue Xuebao, 2024, v. 37, n. 5, p. 55, doi. 10.13338/j.issn.1006-8341.2024.05.008

By:

FU Chang;
LIU Yuxin;
MAN Shengbo

Publication type:

Article

STUDY OF DROPLET DYNAMICS AND CONDENSATION HEAT TRANSFER ON SUPERHYDROPHOBIC COPPER SURFACE.

Published in:

Thermal Science, 2021, v. 25, n. 1B, p. 653, doi. 10.2298/TSCI190126089Y

By:

YUVARAJ, R.;
KUMAR, D. SENTHKIL

Publication type:

Article

Highly efficient and photostable photocathodes based on CuWO4/Cu2O nanostructured thin films.

Published in:

Journal of the Iranian Chemical Society, 2020, v. 17, n. 3, p. 701, doi. 10.1007/s13738-019-01807-y

By:

Momeni, Mohamad Mohsen;
Ghayeb, Yousef;
Menati, Majid

Publication type:

Article

Cyclic Biaxial Stress Measurement Method Using the Grain Growth Direction in Electrodeposited Copper Foil.

Published in:

EURASIP Journal on Advances in Signal Processing, 2010, p. 1, doi. 10.1155/2010/928216

By:

Ono, Yuichi;
Cheng Li;
Hino, Daisuke

Publication type:

Article

Değişik şekilde tasarlanan ısıtılmış yüzeylerin hava jeti çarpmalı soğutulmasının araştırılması.

Published in:

Pamukkale University Journal of Engineering Sciences, 2020, v. 26, n. 1, p. 88, doi. 10.5505/pajes.2019.58812

By:

KARABULUT, Koray;
ALNAK, Doğan Engin

Publication type:

Article

The origins of engraved marine shell cups, copper repoussé plates, and ritual centers: disentangling early Cahokia symbolism from post–AD 1200 SECC iconography.

Published in:

Southeastern Archaeology, 2023, v. 42, n. 2, p. 83, doi. 10.1080/0734578X.2022.2155357

By:

Emerson, Thomas E.

Publication type:

Article

PIRANESI'S CIRCUSES AND CARCERES : THE NEWLY DISCOVERED FIRST STATE OF THE CAMPUS MARTIUS PLAN AND ITS ANTIQUARIAN CONTEXT.

Published in:

Papers of the British School at Rome, 2024, v. 92, p. 187, doi. 10.1017/S0068246224000060

By:

Hornsby, Clare

Publication type:

Article

Low‐cost graphite coated copper as bipolar plates of proton exchange membrane fuel cells for corrosion protection.

Published in:

Fuel Cells, 2021, v. 21, n. 6, p. 502, doi. 10.1002/fuce.202100031

By:

Wu, Sida;
Yan, Hua;
Zuo, Xiahua;
Cao, Zibo;
Li, Haoyang;
Yang, Weimin;
Zhan, Jin

Publication type:

Article

Latest advancement of fully additive process for 8 µm ultra-fine pitch chip-on-film (COF) by nano-size Ni-P metallization.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 8, p. 6937, doi. 10.1007/s10854-018-8680-5

By:

Pun, Kelvin P. L.;
Ali, Lafir;
Kohtoku, Makoto;
Cheung, Chee-Wah;
Chan, Alan H. S.;
Wong, C. P.

Publication type:

Article

Fabrication of copper-coated glass fabric composites through electroless plating process.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 1, p. 798, doi. 10.1007/s10854-016-5592-0

By:

Chen, Huiyu;
Tai, Yu;
Xu, Chunju

Publication type:

Article

Fabrication of conductive soybean protein fiber for electromagnetic interference shielding through electroless copper plating.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 12, p. 13300, doi. 10.1007/s10854-016-5479-0

By:

Zhao, Hang;
Hou, Lei;
Lan, Bijian;
Lu, Yinxiang

Publication type:

Article

Investigation of copper plated-through-holes in glass fiber reinforced epoxy substrates using AC impedance spectroscopy.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 4, p. 2563, doi. 10.1007/s10854-015-2723-y

By:

Ramachandran, Koushik;
Pruyn, Timothy;
Huang, Timothy;
Wang, Yushu;
Singh, Preet;
Jud Ready, W.;
Gerhardt, Rosario;
Sundaram, Venky;
Tummala, Rao

Publication type:

Article

Electroless copper plating on 1,2-ethylenediamine grafted poly(ethyleneterepthalate) for the fabrication of flexible copper clad laminate.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 7, p. 2211, doi. 10.1007/s10854-013-1081-x

By:

Xue, Longlong;
liang, Qian;
Lu, Yinxiang

Publication type:

Article

An alternative process for electroless copper plating on polyester fabric.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 1, p. 33, doi. 10.1007/s10854-008-9594-4

By:

Guo, R. H.;
Jiang, S. Q.;
Yuen, C. W. M.;
Ng, M. C. F.

Publication type:

Article

铜精炼过程中镍元素的迁移转化-有效控制及综合回收.

Published in:

Nonferrous Metals, 2025, v. 15, n. 4, p. 607, doi. 10.20242/j.issn.2097-5384.2025.04.009

By:

沐亚玲;
曾文斌;
秦树辰;
杨必文;
江克怀;
罗福扬

Publication type:

Article

High-adhesive electroless copper plating on polyethylene surface modified with primer.

Published in:

Journal of Solid State Electrochemistry, 2017, v. 21, n. 6, p. 1559, doi. 10.1007/s10008-016-3503-1

By:

Huang, Junjun;
Chen, Zhenming;
Zhou, Fang;
Wang, Hui;
Yuan, Yuan;
Chen, Wei;
Gao, Min;
Zhan, Yanhu

Publication type:

Article

Feedback effect on pitting corrosion dynamics.

Published in:

Journal of Solid State Electrochemistry, 2015, v. 19, n. 11, p. 3219, doi. 10.1007/s10008-015-2991-8

By:

Naganuma, Tomoya;
Singh, Harpartap;
Nakabayashi, Seiichiro

Publication type:

Article

Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects.

Published in:

Molecules, 2023, v. 28, n. 6, p. 2783, doi. 10.3390/molecules28062783

By:

Peng, Chuan;
Zhai, Yuehui;
Chen, Xianming;
Wang, Chong;
Hong, Yan;
Chen, Yuanming;
He, Wei;
Zhou, Guoyun;
Liu, Binyun

Publication type:

Article

Experimental Studies on Heat Transfer between Dissociated Air Flow and a Flat Plate at an Angle of Attack in an HF-Plasmatron.

Published in:

Fluid Dynamics, 2022, v. 57, p. S117, doi. 10.1134/S0015462822601206

By:

Gordeev, A. N.;
Chaplygin, A. V.

Publication type:

Article

Microstructure and Properties of Electroless Ni-P/Sn2.5Ag0.7Cu0.1RE Micro-solder Joints during Thermal Aging Process.

Published in:

Journal of Henan University of Science & Technology, Natural Science, 2024, v. 45, n. 5, p. IV

By:

ZHANG Keke;
HOU Ruiqing;
ZHAO Wenjia;
ZHANG Haizhou;
ZHANG Chao

Publication type:

Article

Atomic Force Microscopy Analysis of Aluminum Layer Properties and Correlation to Masking Functionality in Copper Plating Metallization for Solar Cells.

Published in:

Solar RRL, 2023, v. 7, n. 18, p. 1, doi. 10.1002/solr.202300335

By:

Hatt, Thibaud;
Morawietz, Tobias;
Bartsch, Jonas;
Tutsch, Leonard;
Glatthaar, Markus

Publication type:

Article

Experimental analysis of a pulse tube based new prototype for cells cryopreservation.

Published in:

International Journal of Energy Research, 2020, v. 44, n. 7, p. 5905, doi. 10.1002/er.5367

By:

Cipri, Katiuscia;
Cioccolanti, Luca;
Naldi, Roberto

Publication type:

Article

Thermal performance augmentation of a solar flat plate collector using the shot peening technique.

Published in:

Science & Technology for the Built Environment, 2020, v. 26, n. 3, p. 437, doi. 10.1080/23744731.2019.1633889

By:

Poongavanam, Ganesh Kumar;
Sakthivadivel, D.;
Meikandan, M.;
Balaji, K.;
Vigneswaran, V. S.

Publication type:

Article

Ag基电接触材料的制备及其抗电弧侵蚀性能.

Published in:

Journal of Xi'an Polytechnic University, 2024, v. 38, n. 4, p. 49, doi. 10.13338/j.issn.1674-649x.2024.04.007

By:

付翀;
路杨;
满生博;
刘宇昕;
李旭;
周雄飞

Publication type:

Article

纳米碳管化学镀铜复合浆料的制备及性能.

Published in:

Journal of Xi'an Polytechnic University, 2021, v. 35, n. 5, p. 92, doi. 10.13338/ji.ssn.1674-649x.2021.05.014

By:

王钰凡;
屈银虎;
梅超;
高浩斐;
张红;
田港旗;
曹天宇;
马敏静

Publication type:

Article

New approach for efficient condensation heat transfer.

Published in:

National Science Review, 2019, v. 6, n. 2, p. 185, doi. 10.1093/nsr/nwy161

By:

Cheng, Yaqi;
Wang, Zuankai

Publication type:

Article

盘式永磁涡流驱动器的涡流软测量方法.

Published in:

Electric Machines & Control / Dianji Yu Kongzhi Xuebao, 2016, v. 20, n. 11, p. 18, doi. 10.15938/j.emc.2016.11.003

By:

时统宇;
王大志;
石松宁;
郑迪;
李召

Publication type:

Article