Works matching DE "COPPER plating"
Results: 478
Mechanical characterization of functional Cu-GnP composite coatings for lubricant applications.
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- Surface Engineering, 2022, v. 38, n. 1, p. 72, doi. 10.1080/02670844.2022.2040187
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Effect of shot blasting on droplet contact angle of carbon aided phase change nanocomposites.
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- Surface Engineering, 2021, v. 37, n. 8, p. 1002, doi. 10.1080/02670844.2021.1873898
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On the kinetics of copper electroless plating with hypophosphite reductant.
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- Surface Engineering, 2016, v. 32, n. 5, p. 363, doi. 10.1179/1743294415Y.0000000066
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Electrodeposition and characterisation of copper deposits from non-cyanide electrolytes.
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- Surface Engineering, 2015, v. 31, n. 6, p. 433, doi. 10.1179/1743294414Y.0000000400
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Electroless copper plating on particulate reinforcements and effects on mechanical properties of SiC<sub>p</sub>/Fe composite.
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- Surface Engineering, 2015, v. 31, n. 3, p. 232, doi. 10.1179/1743294414Y.0000000370
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- Article
New electroless copper plating bath using sodium hypophosphite as reductant.
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- Surface Engineering, 2012, v. 28, n. 5, p. 377, doi. 10.1179/1743294411Y.0000000049
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Surface characterisation of electroless copper plated polyester fibres.
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- Surface Engineering, 2009, v. 25, n. 2, p. 101, doi. 10.1179/174329408X326489
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Surface characterisation of daguerreotypes with the optical metrological technique of confocal microscopy.
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- Surface Engineering, 2008, v. 24, n. 2, p. 138, doi. 10.1179/174329408X298175
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Selecting the proper material for a grain loss sensor based on DEM simulation and structure optimization to improve monitoring ability.
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- Precision Agriculture, 2021, v. 22, n. 4, p. 1120, doi. 10.1007/s11119-020-09772-w
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- Article
Research on deep drawing process with electro-permanent magnetic blank holder for non-ferromagnetic materials.
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- International Journal of Advanced Manufacturing Technology, 2024, v. 133, n. 3/4, p. 1145, doi. 10.1007/s00170-024-13672-y
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- Article
Characterizations of laser transmission welding of glass and copper using nanosecond pulsed laser.
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- International Journal of Advanced Manufacturing Technology, 2024, v. 130, n. 5/6, p. 2755, doi. 10.1007/s00170-023-12838-4
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A study on the tribological behavior of water-based nanolubricant during corrugated rolling of copper plates.
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- International Journal of Advanced Manufacturing Technology, 2023, v. 129, n. 3/4, p. 1513, doi. 10.1007/s00170-023-12286-0
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- Article
Improving the stability of the friction stir channelling technology via a cooled copper backing plate.
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- International Journal of Advanced Manufacturing Technology, 2023, v. 129, n. 1/2, p. 525, doi. 10.1007/s00170-023-12211-5
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- Article
A simulation method for the optimization of cooling water slot structure in slab continuous casting mold combined with submerged entry nozzle.
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- International Journal of Advanced Manufacturing Technology, 2023, v. 127, n. 7/8, p. 3221, doi. 10.1007/s00170-023-11671-z
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- Article
Investigation modes for production technology of wire from the Pd5Ni alloy for catchment gauzes of the chemical industry.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 11/12, p. 7229, doi. 10.1007/s00170-022-09821-w
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A three-dimensional stress model for the non-uniform mechanical behavior of a continuous casting mold.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 9/10, p. 6837, doi. 10.1007/s00170-022-09782-0
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Micro-EDM of 3D microstructure on micro-shaft based on the rotation of micro-shaft.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 7/8, p. 5537, doi. 10.1007/s00170-022-09772-2
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Research on improving the discharge cutting efficiency of N-type high-resistance silicon based on electroless plating.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 119, n. 9/10, p. 5839, doi. 10.1007/s00170-021-08240-7
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A numerical strategy to identify the FSW process optimal parameters of a butt-welded joint of quasi-pure copper plates: modeling and experimental validation.
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- International Journal of Advanced Manufacturing Technology, 2021, v. 115, n. 7/8, p. 2505, doi. 10.1007/s00170-021-07296-9
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A 3D model coupled inverse algorithm for the non-uniform thermal behavior of a continuous casting mold.
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- International Journal of Advanced Manufacturing Technology, 2020, v. 109, n. 9-12, p. 2431, doi. 10.1007/s00170-020-05780-2
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- Article
Investigation on the roll-to-plate microforming of riblet features with the consideration of grain size effect.
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- International Journal of Advanced Manufacturing Technology, 2020, v. 109, n. 7/8, p. 2055, doi. 10.1007/s00170-020-05687-y
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- Article
Arc discharge and pressure characteristics in pulsed plasma gas of PAW.
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- International Journal of Advanced Manufacturing Technology, 2019, v. 102, n. 1-4, p. 695, doi. 10.1007/s00170-018-3198-9
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- Article
Factors Influencing the Characteristics of Wetting of Parts of a Vapor Chamber.
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- Journal of Engineering Physics & Thermophysics, 2020, v. 93, n. 5, p. 1089, doi. 10.1007/s10891-020-02209-1
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- Article
“Anionic effect” in copper plating from sulfate aqueous-ethanolic electrolyte containing cyclic polyester.
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- Protection of Metals, 2005, v. 41, n. 2, p. 149, doi. 10.1007/s11124-005-0021-4
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- Article
Copper Electroplating from Sulfate Electrolytes Containing Crown Ethers.
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- Protection of Metals, 2003, v. 39, n. 2, p. 145, doi. 10.1023/A:1022994827528
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- Article
Students’ perception of community as classroom for learning Geography in middle secondary school.
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- International Research Journal of Science, Technology, Education, & Management (IRJSTEM), 2023, v. 3, n. 3, p. 88, doi. 10.5281/zenodo.8435269
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- Article
Environmental friendly decorative electroless copper plating on Acrylonitrile Butadiene Styrene plastics.
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- International Research Journal of Science, Technology, Education, & Management (IRJSTEM), 2023, v. 3, n. 3, p. 79, doi. 10.5281/zenodo.8435182
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- Article
Thermal performance augmentation of a solar flat plate collector using the shot peening technique.
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- Science & Technology for the Built Environment, 2020, v. 26, n. 3, p. 437, doi. 10.1080/23744731.2019.1633889
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- Article
Development and Investigation of a Slow-Wave Structure for a Miniature Multiple-Beam W-Band Traveling Wave Tube.
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- Journal of Communications Technology & Electronics, 2023, v. 68, n. 10, p. 1209, doi. 10.1134/S1064226923100182
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- Article
Enhancement of electric properties of polypyrrole by copper electrodeposition.
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- Canadian Journal of Chemical Engineering, 2015, v. 93, n. 6, p. 1076, doi. 10.1002/cjce.22197
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- Article
Two Coupled Analysis Strategies for Melt-Ablation Modeling of Thermal Protection Material in Supersonic Gas-Particle Two-Phase Impingement Flow.
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- Aerospace (MDPI Publishing), 2023, v. 10, n. 7, p. 583, doi. 10.3390/aerospace10070583
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Prints as communication of power: Cardinal Carlo Barberini and the synods of his abbeys.
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- Renaissance Studies, 2021, v. 35, n. 2, p. 255, doi. 10.1111/rest.12669
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- Article
Lead Contamination Differences in the Muscle of Wild Turkeys Harvested with Lead and Copper-Plated Lead Shot.
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- Journal of Fish & Wildlife Management, 2021, v. 12, n. 1, p. 250, doi. 10.3996/JFWM-20-084
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- Article
Effect of Multiwalled Carbon Nanotubes and Electroless Copper Plating on the Tensile Behavior of Carbon Fiber Reinforced Polymers.
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- Advances in Materials Science & Engineering, 2018, p. 1, doi. 10.1155/2018/8264138
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- Article
Functionalization of polyamide 6 nanofibers by electroless deposition of copper.
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- Journal of Coatings Technology & Research, 2008, v. 5, n. 3, p. 399, doi. 10.1007/s11998-008-9118-4
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- Article
Preparation and properties of carbon fiber reinforced silver based electrical contact materials.
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- Basic Sciences Journal of Textile Universities / Fangzhi Gaoxiao Jichu Kexue Xuebao, 2024, v. 37, n. 5, p. 55, doi. 10.13338/j.issn.1006-8341.2024.05.008
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- Article
Highly efficient and photostable photocathodes based on CuWO4/Cu2O nanostructured thin films.
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- Journal of the Iranian Chemical Society, 2020, v. 17, n. 3, p. 701, doi. 10.1007/s13738-019-01807-y
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- Article
EFFECT OF CURRENT DENSITY ON STRUCTURAL AND OPTICAL PROPERTIES OF In DOPED ZnO THIN FILMS GROWN ON COPPER SUBSTRATE BY ELECTRODEPOSITION METHOD.
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- Chalcogenide Letters, 2013, v. 10, n. 3, p. 113
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- Article
Peeter Stas: an Antwerp coppersmith and his marks (1587-1610).
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- Studies in Conservation, 1998, v. 43, p. 140, doi. 10.1179/sic.1998.43.Supplement-1.140
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- Article
Antwerp artists and the practice of painting on copper.
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- Studies in Conservation, 1998, v. 43, p. 136, doi. 10.1179/sic.1998.43.Supplement-1.136
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- Article
DIRECT PLATED COPPER METALLIZED SUBSTRATE AND ITS APPLICATION ON MICROWAVE CIRCUITS.
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- Microwave Journal, 2010, v. 53, n. 10, p. 84
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- Article
Incorporating pre-stretching into electroless copper plating for conductivity improvement of elastic nylon fabric: application in ECG electrode.
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- Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 14, p. 1, doi. 10.1007/s10854-024-12538-z
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- Article
Compound additives and stress study of EDTA-2Na chemical copper plating system in printed circuit boards.
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- Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 7, p. 1, doi. 10.1007/s10854-024-12283-3
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- Article
Investigation on the microstructure, phase formation and properties of aluminium alloy coatings by stud spraying.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 28, p. 22256, doi. 10.1007/s10854-022-09004-z
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- Article
An accessible strategy for high-performance copper layer fabrication on polyphenylene oxide substrates via polydopamine functionalization and electroless deposition.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 16, p. 13012, doi. 10.1007/s10854-022-08243-4
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- Article
A new transient liquid phase bonding method using magnesium foil to bond copper plates to aluminum nitride substrates.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10486, doi. 10.1007/s10854-022-08035-w
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- Article
Highly stretchable, sensitive, and flexible strain sensors based on Ag@Cu/PDMS composites.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 8104, doi. 10.1007/s10854-022-07960-0
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- Article
Fabrication of silver plated copper powders to apply in flexible conductive films for strain sensor.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 8096, doi. 10.1007/s10854-022-07959-7
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- Article
Effects of accelerator in a copper plating bath on interfacial microstructure and mechanical properties of SAC305/Cu solder joints.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 24, p. 22810, doi. 10.1007/s10854-020-04806-5
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- Article
Bakır Sac Levhaların "V" Bükme Yöntemi İle Şekillendirilmesiyle Oluşan Geri Esneme Miktarının Deneysel Olarak İncelenmesi.
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- International Journal of Technological Sciences / Uluslararasi Teknolojik Bilimler Dergisi, 2019, v. 11, n. 3, p. 147
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- Article