Works matching DE "COPPER foil"

Results: 479

Effects of 2-aminothiazoline and benzotriazole on copper foil etching.

Published in:

Transactions of the Institute of Metal Finishing, 2025, v. 103, n. 3, p. 125, doi. 10.1080/00202967.2025.2485551

By:

Jin, Lei;
Li, Ke;
Wang, Zhao-Yun

Publication type:

Article

Study on the influence of copper foil current collector roughness on lithium-ion battery performance.

Published in:

Journal of Materials Science, 2025, v. 60, n. 18, p. 7641, doi. 10.1007/s10853-025-10848-z

By:

Yang, Lei;
Lu, Xige;
Zhong, Shuiping;
Zhu, Huanlin;
Weng, Wei;
Tan, Wen;
Chi, Xiaopeng

Publication type:

Article

The Use of TEMPO-oxidized Nanofibrillated Cellulose as Anode Binder for Lithium-ion Batteries.

Published in:

BioResources, 2025, v. 20, n. 2, p. 3732, doi. 10.15376/biores.20.2.3732-3748

By:

Soojin Kwon;
Ju Yoon Moon;
Sang Yun Kim;
Kyudeok Oh

Publication type:

Article

钨酸钠添加剂对超薄电解铜箔结构与性能的影响.

Published in:

Journal of Tiangong University, 2024, v. 43, n. 6, p. 36, doi. 10.3969/j.issn.1671-024x.2024.06.006

By:

李建新;
高中琦;
黄港;
陈小平;
李衔洋;
谢长江

Publication type:

Article

Preparation of CuO nanostructures coating on copper as supercapacitor materials.

Published in:

Surface Engineering, 2014, v. 30, n. 11, p. 775, doi. 10.1179/1743294414Y.0000000318

By:

Momeni, M. M.;
Nazari, Z.;
Kazempour, A.;
Hakimiyan, M.;
Mirhoseini, S. M.

Publication type:

Article

Optimization of Graphene Layers Grown on Pt/Ti/SiO2 by Hot Filament Chemical Vapor Deposition.

Published in:

Macromolecular Symposia, 2024, v. 413, n. 1, p. 1, doi. 10.1002/masy.202300040

By:

Matos, Angela Luis;
Limbu, Tej B.;
Castillo, Ivan;
Sultan, Muhammad Shehzad;
Tripathi, Balram;
Katiyar, Ram S.;
Weiner, Brad R.;
Morell, Gerardo

Publication type:

Article

Microstructural Characteristics of ECR Plasma Etched and Heat Treated Commercial Copper Foil.

Published in:

Macromolecular Symposia, 2023, v. 407, n. 1, p. 1, doi. 10.1002/masy.202100355

By:

Karmakar, Samit;
Kundu, Soumik Kumar;
Bandyopadhyay, Sujit Kumar;
Taki, Gouranga Sundar

Publication type:

Article

One‐Step Fabrication of High‐Performance Energetic Metal‐Organic Framework [Cu(atrz)3[NO3]2]n Films and its Tunable Crystal Structure.

Published in:

Propellants, Explosives, Pyrotechnics, 2021, v. 46, n. 11, p. 1746, doi. 10.1002/prep.202100054

By:

Su, Hui;
Yan, Shi;
Zhao, Chaofeng;
Peng, Panpan;
Jin, Liang;
Li, Shenghua;
Pang, Siping

Publication type:

Article

Regulating Top-Surface Multilayer/Single-Crystal Graphene Growth by 'Gettering' Carbon Diffusion at Backside of the Copper Foil.

Published in:

Advanced Functional Materials, 2017, v. 27, n. 23, p. n/a, doi. 10.1002/adfm.201700121

By:

Abidi, Irfan H.;
Liu, Yuanyue;
Pan, Jie;
Tyagi, Abhishek;
Zhuang, Minghao;
Zhang, Qicheng;
Cagang, Aldrine A.;
Weng, Lu‐Tao;
Sheng, Ping;
Goddard, William A.;
Luo, Zhengtang

Publication type:

Article

Transfer of graphene thin film obtained by PECVD method to Au/p-Si rectifier junction as interfacial layer and analysis of its barrier characteristics depending on sample temperature.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 18, p. 14627, doi. 10.1007/s10854-022-08382-8

By:

Özakın, O.;
Sağlam, M.;
Güzeldir, B.

Publication type:

Article

Correction to: Opto-electronic response from Wrightia tinctoria (Roxb.) R Br. sensitized titanium dioxide grown on flexible copper foil.

Published in:

2022

By:

Jayakrishnan, R.;
Raj, Aruna;
Salam, Jishad A.;
Lekshmi, Malavika U.;
Priji, S.;
Gangaprasad, A.

Publication type:

Correction Notice

Opto-electronic response from Wrightia tinctoria R.Br. sensitized titanium dioxide grown on flexible copper foil.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 17, p. 13462, doi. 10.1007/s10854-022-08255-0

By:

Jayakrishnan, R.;
Raj, Aruna;
Salam, Jishad A.;
Lekshmi, Malavika U.;
Priji, P.;
Gangaprasad, A.

Publication type:

Article

A new transient liquid phase bonding method using magnesium foil to bond copper plates to aluminum nitride substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10486, doi. 10.1007/s10854-022-08035-w

By:

Takakuwa, Satoshi;
Terasaki, Nobuyuki;
Kon, Naochika;
Ohashi, Touyou;
Nita, Nobuyasu;
Nagatomo, Yoshiyuki;
Kuromitsu, Yoshirou

Publication type:

Article

CeO2 nanoparticles based extended gate field effect transistor for enzyme free detection of glucose.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 12, p. 9483, doi. 10.1007/s10854-021-07441-w

By:

Shanmugam, Punitha;
Kuppuswamy, Guru Prasad;
Pushparaj, Kishore;
Arumugam, Balamurugan;
Sundaramurthy, Anandhakumar;
Sivalingam, Yuvaraj

Publication type:

Article

Low-temperature bonding of surface-activated polyimide to Cu Foil in Pt-catalyzed formic acid atmosphere.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 5, p. 2582, doi. 10.1007/s10854-021-07463-4

By:

Meng, Ying;
Xu, Yang;
Gao, Runhua;
Wang, Xinhua;
Chen, Xiaojuan;
Huang, Sen;
Wei, Ke;
Wang, Dahai;
Yin, Haibo;
Takeuchi, Kai;
Suga, Tadatomo;
Mu, Fengwen;
Liu, Xinyu

Publication type:

Article

Adlayer-free large-area single-crystal CVD graphene growth on copper.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 24, p. 21821, doi. 10.1007/s10854-020-04706-8

By:

Arya, Chaitanya;
De Silva, K. Kanishka H.;
Yoshimura, Masamichi

Publication type:

Article

MP as a current collector to prepare high-performance SnO2–GO/MP electrode.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 12, p. 9242, doi. 10.1007/s10854-020-03455-y

By:

Zou, Jingyi;
Sun, Xiaogang;
Li, Rui;
He, Qiang

Publication type:

Article

Photo catalytic property of Pt-CuO nanostructure films prepared by wet-chemical route and photochemical deposition method.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 10, p. 10147, doi. 10.1007/s10854-016-5091-3

By:

Momeni, Mohamad;
Mohammadi, Narjes;
Mirhosseini, Mahboubeh

Publication type:

Article

Dielectric properties of BaTiO/epoxy composites by lamination process for embedded capacitor application.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 8996, doi. 10.1007/s10854-016-4931-5

By:

Bai, Xiaofei

Publication type:

Article

Efficient photo catalytic degradation of methyl orange over Ag-CuO nanostructures grown on copper foil under visible light irradiation.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 6, p. 6542, doi. 10.1007/s10854-016-4598-y

By:

Momeni, Mohamad;
Mirhosseini, Mahboubeh;
Mohammadi, Narjes

Publication type:

Article

Temperature dependence of Raman spectra of graphene on copper foil substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3888, doi. 10.1007/s10854-015-4238-y

By:

Wang, Weihui;
Peng, Qing;
Dai, Yiquan;
Qian, Zhengfang;
Liu, Sheng

Publication type:

Article

Structural influence of copper substrate on magnetic properties of electrodeposited CoPtP films for MEMS applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 9821, doi. 10.1007/s10854-015-3655-2

By:

Manimaran, Ezhil;
Navaneetha, Emerson

Publication type:

Article

A novel high-performance electrode: in-situ growth of copper sulfide film on copper foil for the application of supercapacitor.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 6, p. 4185, doi. 10.1007/s10854-015-2964-9

By:

Wei, Jiatong;
Xing, Shuangxi;
Yan, Bo;
He, Dong;
Suo, Hui;
Zhao, Chun

Publication type:

Article

Comprehensive study of graphene grown by chemical vapor deposition.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 10, p. 4333, doi. 10.1007/s10854-014-2170-1

By:

Fan, Jincheng;
Li, Tengfei;
Gao, Yuanhong;
Wang, Jianguo;
Ding, Hanlin;
Heng, Hang

Publication type:

Article

Leakage current suppression in solution-deposited barium titanate films on copper foils.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 4, p. 901, doi. 10.1007/s10854-011-0518-3

By:

Raj, P.;
Xiang, Shu;
Kumar, Manish;
Abothu, Isaac;
Hwang, Jin-Hyun;
Liu, Yuzi;
Yamamoto, Hiroshi;
Tummala, Rao

Publication type:

Article

Poly(ester imide)s with low coefficients of thermal expansion (CTEs) and low water absorption (VI): an attempt to reduce the modulus while maintaining low CTEs and other desired properties.

Published in:

Polymer International, 2022, v. 71, n. 10, p. 1164, doi. 10.1002/pi.6393

By:

Hasegawa, Masatoshi;
Hori, Atsushi;
Hosaka, Chisato;
Ishii, Junichi

Publication type:

Article

The corrosion characteristics and solderability of immersion tin coatings on copper.

Published in:

Materials & Corrosion / Werkstoffe und Korrosion, 2013, v. 64, n. 10, p. 914, doi. 10.1002/maco.201106434

By:

Arazna, A.;
Krolikowski, A.;
Koziol, G.;
Bielinski, J.

Publication type:

Article

Investigation on thermal stress–induced bending of copper foil using pulsed arc plasma.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 134, n. 7/8, p. 3385, doi. 10.1007/s00170-024-14349-2

By:

Duan, Xiaoming;
Du, Zongyu;
wang, Jun;
Ayesta, Izaro;
Wang, Yifan;
Deng, Kenan;
Yang, Xiaodong

Publication type:

Article

Processing characteristics and loading principle on micro blanking of cavitation jet.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 133, n. 3/4, p. 1317, doi. 10.1007/s00170-024-13836-w

By:

Wang, Yun;
Zhu, Cong;
Li, Fuzhu;
Yu, Chao;
Chen, Shijian;
Wu, Jingyi

Publication type:

Article

Crystal plasticity–based finite element modeling and experimental study for high strain rate microscale laser shock clinching of copper foil.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 128, n. 7/8, p. 3427, doi. 10.1007/s00170-023-12165-8

By:

Hou, Yaxuan;
Wang, Jianfeng;
Ji, Zhong;
Zhang, Haiming;
Lu, Guoxin;
Zhang, Cunsheng

Publication type:

Article

Forming analysis of T2 copper foil processed by submerged water jet cavitation.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 126, n. 3/4, p. 1497, doi. 10.1007/s00170-023-11241-3

By:

Yu, Chao;
He, Peiyu;
Li, Fuzhu;
Zhang, Kun;
Wang, Yun;
Li, Retao

Publication type:

Article

Accurate temperature characterization and experimental verification in the PCB drilling process.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 120, n. 5/6, p. 3507, doi. 10.1007/s00170-022-08808-x

By:

Shi, Hongyan;
Chen, Zhuangpei;
Lin, Xiaoke;
Zhu, Tao

Publication type:

Article

Relationship between pulsed laser energy and fracture mode in multiple-pulse laser shock bulging process.

Published in:

International Journal of Advanced Manufacturing Technology, 2021, v. 117, n. 1/2, p. 621, doi. 10.1007/s00170-021-07791-z

By:

Li, Yan;
Liu, Zheng;
Zhao, Guoqun;
Ji, Zhong;
Zheng, Chao

Publication type:

Article

Ultrasonic vibration-induced severe plastic deformation of Cu foils: effects of elastic-plastic stress wave bounce, acoustic softening, and size effect.

Published in:

International Journal of Advanced Manufacturing Technology, 2021, v. 115, n. 11/12, p. 3617, doi. 10.1007/s00170-021-07390-y

By:

Chen, Zhihao;
Liu, Chao;
Rani, Ekta;
Singh, Harishchandra;
Huttula, Marko;
Kömi, Jukka;
Cao, Wei

Publication type:

Article

Investigation on grain size effect and forming mechanism of laser shock hydraulic microforming of copper foil.

Published in:

International Journal of Advanced Manufacturing Technology, 2021, v. 114, n. 3/4, p. 1049, doi. 10.1007/s00170-021-06969-9

By:

Gu, Xin;
Wang, Xiao;
Ma, Youjuan;
Zhang, Haokun;
Lu, Jiaxin;
Wang, Keyang;
Liu, Huixia

Publication type:

Article

Mechanical joining behavior of Cu–Fe dissimilar metallic foils in laser shock clinching.

Published in:

International Journal of Advanced Manufacturing Technology, 2020, v. 110, n. 3/4, p. 1001, doi. 10.1007/s00170-020-05920-8

By:

Zheng, Chao;
Pan, Changdong;
Wang, Jilai;
Zhao, Guoqun;
Ji, Zhong

Publication type:

Article

Micro-drilling characteristics of sequential glass fiber-reinforced resin-based/copper foil multi-layer sheets.

Published in:

International Journal of Advanced Manufacturing Technology, 2020, v. 107, n. 1/2, p. 399, doi. 10.1007/s00170-020-05038-x

By:

Tang, Zimin;
Huang, Xin;
Wang, Chengyong;
Liao, Bingmiao;
Lin, Dantian;
Yao, Junxiong;
Zheng, Lijuan

Publication type:

Article

Investigation on initial grain size and laser power density effects in laser shock bulging of copper foil.

Published in:

International Journal of Advanced Manufacturing Technology, 2018, v. 96, n. 1-4, p. 1483, doi. 10.1007/s00170-018-1722-6

By:

Zheng, Chao;
Zhang, Xiu;
Liu, Zheng;
Ji, Zhong;
Yu, Xiao;
Song, Libin

Publication type:

Article

Micro deep drawing of T2 copper foil using proportional decreased tools.

Published in:

International Journal of Advanced Manufacturing Technology, 2018, v. 95, n. 1-4, p. 277, doi. 10.1007/s00170-017-1111-6

By:

Guofeng Wang;
You Li;
Siyu Liu;
Jianlei Yang;
Mo Yang

Publication type:

Article

The Importance of Taking into Account the Heterogeneous Recombination of Atoms when Studying the Kinetics of Copper Etching in Chlorine Plasma.

Published in:

High Temperature, 2022, v. 60, p. S146, doi. 10.1134/S0018151X21050187

By:

Sitanov, D. V.;
Pivovarenok, S. A.;
Murin, D. B.

Publication type:

Article

Research on Optimal Design of High-frequency-density Power Electronics PCB.

Published in:

Electric Drive, 2023, v. 53, n. 1, p. 18, doi. 10.19457/j.1001-2095.dqcd24543

By:

CHEN Zhixiu;
LIU Yang;
ZHANG Hanshu;
XIA Ye;
WANG Hao;
LIU Xin

Publication type:

Article

Effects of PEG and MPS on microstructure and mechanical properties of electrolytic copper foil.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 21, p. 54, doi. 10.19289/j.1004-227x.2023.21.009

By:

ZHAO Zhipeng;
HU Hao;
SONG Kexing;
CHENG Haoyan;
DAI Mingwei;
YU Ningning;
LU Weiwei;
FENG Qing;
YANG Xiangkui

Publication type:

Article

Optimization of process parameters for preparation of low-profile electrolytic copper foil.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 20, p. 11, doi. 10.19289/j.1004-227x.2023.20.002

By:

LING Yu;
ZHANG Shaoqiang;
LU Weiwei;
XU Peng;
ZHU Qianqian;
HU Hao;
SONG Kexing;
YANG Xiangkui;
ZHU Yigang

Publication type:

Article

Design of multidimensional quality control system for manufacturing of high-strength and ultra-thin copper foil.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 20, p. 1, doi. 10.19289/j.1004-227x.2023.20.001

By:

HUANG Kaicheng;
JIANG Hongquan;
MIAO Dong;
ZHOU Zhi;
CHEN Fumin;
MA Fei;
GAO Jianmin;
YANG Xiangkui;
BAO Hongwei;
CHENG Huyue

Publication type:

Article

钼酸钠-钨酸钠复合添加剂对铜箔电解粗化的影响.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 19, p. 74, doi. 10.19289/j.1004-227x.2023.19.011

By:

冯宝鑫;
张杰;
白忠波;
彭肖林;
任伟伟;
蔡辉;
张菁丽;
刘二勇

Publication type:

Article

钼酸钠-HEC-SPS 复合添加剂对电解铜箔粗化效果的影响.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 17, p. 56, doi. 10.19289/j.1004-227x.2023.17.009

By:

彭雪嵩;
由宏伟;
李兰晨;
宋姝嬛;
乐士儒;
张锦秋;
杨培霞;
安茂忠

Publication type:

Article

Effects of organic additives on properties of ultrathin copper foil for lithium batteries.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 7, p. 43, doi. 10.19289/j.1004-227x.2023.07.007

By:

FAN Binfeng;
JI Lin;
WANG Qingfu;
PEI Xiaozhe

Publication type:

Article

低分子蛋白对超薄锂电铜箔性能的影响.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 23, p. 1676, doi. 10.19289/j.1004-227x.2022.23.006

By:

余科淼

Publication type:

Article

巯基乙酸对电解铜箔抗氧化性的影响.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 23, p. 1668, doi. 10.19289/j.1004-227x.2022.23.005

By:

华天宇;
王世颖;
王文昌;
明小强;
王朋举

Publication type:

Article

类硫脲结构添加剂在电解铜箔制备中的应用.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 17, p. 1245, doi. 10.19289/j.1004-227x.2022.17.009

By:

宋言;
朱若林;
代泽宇;
林毅

Publication type:

Article