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Some Physical Properties of Pure and Cu, Fe-doped CdS Thin Films.
- Published in:
- International Journal of Nanoscience, 2022, v. 21, n. 4, p. 1, doi. 10.1142/S0219581X22500314
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- Article
Radiative Recombination in the Cu(In,Ga)Se<sub>2</sub> Thin Films Irradiated with Hydrogen Ions.
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- International Journal of Nanoscience, 2019, v. 18, n. 3/4, p. N.PAG, doi. 10.1142/S0219581X19400337
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- Article
Crystallinity Study of Cu Thin Film Deposited by Indigenously Developed DC Magnetron Sputtering Setup.
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- Macromolecular Symposia, 2023, v. 407, n. 1, p. 1, doi. 10.1002/masy.202100356
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- Article
High‐Sensitivity Flexible Thermocouple Sensor Arrays Via Printing and Photonic Curing.
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- Advanced Functional Materials, 2024, v. 34, n. 20, p. 1, doi. 10.1002/adfm.202301681
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- Article
Spiral‐Shape Fast‐Moving Soft Robots.
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- Advanced Functional Materials, 2023, v. 33, n. 35, p. 1, doi. 10.1002/adfm.202300516
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- Article
Enhanced Heat Transport Capability across Boron Nitride/Copper Interface through Inelastic Phonon Scattering.
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- Advanced Functional Materials, 2022, v. 32, n. 40, p. 1, doi. 10.1002/adfm.202206545
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- Article
Thermal incompatibility analysis of Cu-etching solution in a metal-etching system using adiabatic calorimetry.
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- Journal of Thermal Analysis & Calorimetry, 2023, v. 148, n. 11, p. 4681, doi. 10.1007/s10973-022-11650-8
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- Article
Measuring the viscosity of films by thermomechanical analysis: application to metal organic precursor films of functional oxides.
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- Journal of Thermal Analysis & Calorimetry, 2023, v. 148, n. 9, p. 3427, doi. 10.1007/s10973-023-11964-1
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- Article
Synthesis of entropy generation in Cu–Al<sub>2</sub>O<sub>3</sub> water-based thin film nanofluid flow.
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- Journal of Thermal Analysis & Calorimetry, 2022, v. 147, n. 23, p. 13509, doi. 10.1007/s10973-022-11540-z
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- Article
Direct observation of the thickness effect on critical crack tip opening displacement in freestanding copper submicron-films by in situ electron microscopy fracture toughness testing.
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- International Journal of Fracture, 2015, v. 192, n. 2, p. 203, doi. 10.1007/s10704-015-0003-8
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- Article
Optical Measurement of the Stoichiometry of Thin-Film Compounds Synthetized From Multilayers: Example of Cu(In,Ga)Se<sub>2</sub>.
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- Microscopy & Microanalysis, 2023, v. 29, n. 6, p. 1847, doi. 10.1093/micmic/ozad105
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- Article
Probing Dynamic Processes of the Initial Stages of Cu(100) Surface Oxidation by in situ Environmental TEM and Multiscale Simulations.
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- 2019
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- Abstract
Hierarchically rough superhydrophobic copper sheets fabricated by a sandblasting and hot water treatment process.
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- International Journal of Advanced Manufacturing Technology, 2017, v. 93, n. 1-4, p. 1107, doi. 10.1007/s00170-017-0584-7
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- Article
Nano-Sized Copper Films Prepared by Magnetron Sputtering.
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- Journal of Structural Chemistry, 2023, v. 64, n. 12, p. 2438, doi. 10.1134/S0022476623120156
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- Article
Structure and thermal properties of heterometallic complexes for chemical vapor deposition of Cu-Pd films.
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- Journal of Structural Chemistry, 2017, v. 58, n. 8, p. 1522, doi. 10.1134/S0022476617080078
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- Article
Large-area borophene sheets on sacrificial Cu(111) films promoted by recrystallization from subsurface boron.
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- NPJ Quantum Materials, 2019, v. 4, n. 1, p. N.PAG, doi. 10.1038/s41535-019-0181-0
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- Article
Understanding Substrate Mechanics and Chemo‐Mechanical Behavior of Columnar Silicon Films to Enable Deformation Free Anodes for High‐Energy Li‐Ion Batteries.
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- Advanced Materials Interfaces, 2023, v. 10, n. 7, p. 1, doi. 10.1002/admi.202202314
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- Article
Analog Memristor of Lead‐Free Cs<sub>4</sub>CuSb<sub>2</sub>Cl<sub>12</sub> Layered Double Perovskite Nanocrystals as Solid‐State Electronic Synapse for Neuromorphic Computing.
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- Advanced Materials Interfaces, 2022, v. 9, n. 30, p. 1, doi. 10.1002/admi.202200562
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- Article
Metallic Interface Induced Ionic Redistribution within Amorphous MoO<sub>3</sub> Films.
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- Advanced Materials Interfaces, 2022, v. 9, n. 23, p. 1, doi. 10.1002/admi.202200453
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- Article
A Microfiber Sensor for the Trace Copper Ions Detection Based on Ternary Sensitive film.
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- Advanced Materials Interfaces, 2022, v. 9, n. 22, p. 1, doi. 10.1002/admi.202200491
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- Article
Electrochemical Thin Film Deposition of Copper(I) Halides in Aqueous Solution: Substrate Extension and Structure Transformation.
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- Advanced Materials Interfaces, 2022, v. 9, n. 10, p. 1, doi. 10.1002/admi.202102239
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- Article
Influence of Polymer Interfacial Protective Layer Thickness on the Stability of Lithium‐Metal Batteries.
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- Advanced Materials Interfaces, 2022, v. 9, n. 10, p. 1, doi. 10.1002/admi.202102428
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- Publication type:
- Article
Electrochemical Thin Film Deposition of Copper(I) Halides in Aqueous Solution: Substrate Extension and Structure Transformation.
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- Advanced Materials Interfaces, 2022, v. 9, n. 10, p. 1, doi. 10.1002/admi.202102239
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- Article
A New Allotrope of Carbon—Graphdiyne (g‐C<sub>n</sub>H<sub>2</sub><sub>n</sub><sub>−2</sub>) Boosting with Mn<sub>0.2</sub>Cd<sub>0.8</sub>S form S‐Scheme Heterojunction for Efficient Photocatalytic Hydrogen Evolution.
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- Advanced Materials Interfaces, 2021, v. 8, n. 15, p. 1, doi. 10.1002/admi.202100630
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- Article
Highly Material Selective and Self‐Aligned Photo‐assisted Atomic Layer Deposition of Copper on Oxide Materials.
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- Advanced Materials Interfaces, 2021, v. 8, n. 11, p. 1, doi. 10.1002/admi.202100014
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- Article
The Hallmarks of Copper Single Atom Catalysts in Direct Alcohol Fuel Cells and Electrochemical CO<sub>2</sub> Fixation.
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- Advanced Materials Interfaces, 2021, v. 8, n. 8, p. 1, doi. 10.1002/admi.202001822
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- Article
Well‐Controlled Decomposition of Copper Complex Inks Enabled by Metal Nanowire Networks for Highly Compact, Conductive, and Flexible Copper Films.
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- Advanced Materials Interfaces, 2020, v. 7, n. 1, p. N.PAG, doi. 10.1002/admi.201901550
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- Article
A Critical Review: The Impact of the Battery Electrode Material Substrate on the Composition and Properties of Atomic Layer Deposition (ALD) Coatings.
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- Advanced Materials Interfaces, 2019, v. 6, n. 24, p. N.PAG, doi. 10.1002/admi.201901455
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- Article
Enhanced Interface Stability of Multilayer Bi<sub>2</sub>Te<sub>3</sub>/Ti/Cu Films after Heat Treatment via the Insertion of a Ti Layer.
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- Advanced Materials Interfaces, 2019, v. 6, n. 20, p. N.PAG, doi. 10.1002/admi.201900682
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- Article
Highly Conductive and Fatigue‐Free Flexible Copper Film Electrode Fabricated by a Facile Dry Transfer Technique.
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- Advanced Materials Interfaces, 2018, v. 5, n. 1, p. 1, doi. 10.1002/admi.201701038
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- Article
Island Coalescence during Film Growth: An Underestimated Limitation of Cu ALD.
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- Advanced Materials Interfaces, 2017, v. 4, n. 18, p. n/a, doi. 10.1002/admi.201700274
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- Article
Recycled Superwetting Nanostructured Copper Mesh Film: Toward Bidirectional Separation of Emulsified Oil/Water Mixtures.
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- Advanced Materials Interfaces, 2016, v. 3, n. 17, p. n/a, doi. 10.1002/admi.201600370
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- Article
Ablation replacement of iron with Co, Mn, Ni, and Cu during growth of iron-based superconductor films in the Fe MSe system.
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- Crystallography Reports, 2014, v. 59, n. 5, p. 739, doi. 10.1134/S1063774514050174
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- Article
Optically Transparent Honeycomb Mesh Antenna Integrated into OLED Light Source.
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- Electronics (2079-9292), 2024, v. 13, n. 2, p. 289, doi. 10.3390/electronics13020289
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- Article
Study of an Attenuator Supporting Meander-Line Slow Wave Structure for Ka-Band TWT.
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- Electronics (2079-9292), 2021, v. 10, n. 19, p. 2372, doi. 10.3390/electronics10192372
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- Article
Impact of Annealing on Structural, Optical, and Electrical Characteristics of Spin Coated Cu<sub>2</sub>ZnSnS<sub>4</sub> Thin Films.
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- Russian Journal of General Chemistry, 2023, v. 93, n. 10, p. 2663, doi. 10.1134/S1070363223100201
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- Article
Properties of High Efficiency Nanostructured Copper Indium Gallium Selenide Thin Film Solar Cells.
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- Electrotehnica, Electronica, Automatica, 2022, v. 70, n. 1, p. 3, doi. 10.46904/eea.22.70.1.1108001
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- Article
CdSe thin films-based photodetector doped with Cu, In and Ga atoms: a comparative work.
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- Applied Physics A: Materials Science & Processing, 2023, v. 129, n. 8, p. 1, doi. 10.1007/s00339-023-06860-2
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- Article
Photoresponse application of the dip-coated Cu<sub>2</sub>ZnSnS<sub>4</sub> thin film.
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- Applied Physics A: Materials Science & Processing, 2023, v. 129, n. 3, p. 1, doi. 10.1007/s00339-023-06507-2
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- Article
Effect of annealing temperature on the microstructural and optical properties of newly developed (Ag,Cu)<sub>2</sub>Zn(Sn,Ge)Se<sub>4</sub> thin films.
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- Applied Physics A: Materials Science & Processing, 2022, v. 128, n. 11, p. 1, doi. 10.1007/s00339-022-06188-3
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- Article
Short and ultrashort pulsed laser-based micro-scribing of copper film on a dielectric substrate for functional devices.
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- Applied Physics A: Materials Science & Processing, 2022, v. 128, n. 11, p. 1, doi. 10.1007/s00339-022-06181-w
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- Article
Effects of partial Cu-doping on the structural, electrical, and dielectric properties of Ca<sub>2</sub>Fe<sub>2 − x</sub>Cu<sub>x</sub>O<sub>5</sub> (x = 0 and 0.05) brownmillerite oxides.
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- Applied Physics A: Materials Science & Processing, 2022, v. 128, n. 10, p. 1, doi. 10.1007/s00339-022-06072-0
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- Publication type:
- Article
Substrate roughness and crystal orientation-controlled growth of ultra-thin BN films deposited on Cu foils.
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- Applied Physics A: Materials Science & Processing, 2022, v. 128, n. 5, p. 1, doi. 10.1007/s00339-022-05536-7
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- Article
Correlation between the structural, magnetic, and dc resistivity properties of Co<sub>0.5</sub>M<sub>0.5-x</sub>Cu<sub>x</sub>Fe<sub>2</sub>O<sub>4</sub> (M = Mg, and Zn) nano ferrites.
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- Applied Physics A: Materials Science & Processing, 2022, v. 128, n. 1, p. 1, doi. 10.1007/s00339-021-05211-3
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- Article
Secondary phases and their influence on optical and electrical properties of electrodeposited Cu<sub>2</sub>FeSnS<sub>4</sub> films.
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- Applied Physics A: Materials Science & Processing, 2021, v. 127, n. 11, p. 1, doi. 10.1007/s00339-021-05038-y
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- Article
CIGS film from selenized of the electrodeposited CuIn alloy and CuGa oxide/hydroxide precursor.
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- Applied Physics A: Materials Science & Processing, 2021, v. 127, n. 11, p. 1, doi. 10.1007/s00339-021-04965-0
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- Publication type:
- Article
Effects of Rapid Thermal Annealing on the Structural, Optical, and Electrical Properties of Au/CuPc/n-Si (MPS)-type Schottky Barrier Diodes.
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- Applied Physics A: Materials Science & Processing, 2021, v. 127, n. 10, p. 1, doi. 10.1007/s00339-021-04945-4
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- Article
Influence of Cu insertion layer on magnetic property of [Co(0.3 nm)/Ni(0.6 nm)]<sub>10</sub>/Cu/[Co(0.3 nm)/Ni(0.6 nm)]<sub>10</sub> spin valve thin films.
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- Applied Physics A: Materials Science & Processing, 2021, v. 127, n. 9, p. 1, doi. 10.1007/s00339-021-04850-w
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- Article
Physicochemical characterization and catalytic performance of Fe doped CuS thin films deposited by the chemical spray pyrolysis technique.
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- Applied Physics A: Materials Science & Processing, 2021, v. 127, n. 6, p. 1, doi. 10.1007/s00339-021-04589-4
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- Article
Structural and optical properties of Se<sub>85−x</sub>Te<sub>15</sub>In<sub>x</sub> chalcogenide thin films for optoelectronics.
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- Applied Physics A: Materials Science & Processing, 2020, v. 126, n. 8, p. N.PAG, doi. 10.1007/s00339-020-03781-2
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- Article