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Study the Optical Properties of Noble Metal (Au, Ag, and Cu) Thin Film Biosensors Based on Surface Plasmon Resonance Performance by a Simulation Program.
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- International Journal of Nanoscience, 2024, v. 23, n. 3, p. 1, doi. 10.1142/S0219581X23500795
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- Article
The Potential of Spot Size Control in Shaping the Thickness Distribution in Ultrashort Laser Deposition.
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- Materials (1996-1944), 2024, v. 17, n. 11, p. 2712, doi. 10.3390/ma17112712
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- Article
Adhesion and Transparency Enhancement between Flexible Polyimide-PDMS Copolymerized Film and Copper Foil for LED Transparent Screen.
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- Polymers (20734360), 2024, v. 16, n. 11, p. 1591, doi. 10.3390/polym16111591
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- Article
High‐Sensitivity Flexible Thermocouple Sensor Arrays Via Printing and Photonic Curing.
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- Advanced Functional Materials, 2024, v. 34, n. 20, p. 1, doi. 10.1002/adfm.202301681
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- Article
Effects of HiPIMS Duty Cycle on Plasma Discharge and the Properties of Cu Film.
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- Materials (1996-1944), 2024, v. 17, n. 10, p. 2311, doi. 10.3390/ma17102311
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- Article
Influence of HiPIMS Pulse Widths on the Structure and Properties of Copper Films.
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- Materials (1996-1944), 2024, v. 17, n. 10, p. 2342, doi. 10.3390/ma17102342
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- Article
Porous and Ag-, Cu-, Zn-Doped Al 2 O 3 Fabricated via Barrier Anodizing of Pure Al and Alloys.
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- Coatings (2079-6412), 2024, v. 14, n. 5, p. 576, doi. 10.3390/coatings14050576
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- Article
The Influence of Variations in Synthesis Conditions on the Phase Composition, Strength and Shielding Characteristics of CuBi 2 O 4 Films.
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- Crystals (2073-4352), 2024, v. 14, n. 5, p. 453, doi. 10.3390/cryst14050453
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- Article
Effect of Cu Film Thickness on Cu Bonding Quality and Bonding Mechanism.
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- Materials (1996-1944), 2024, v. 17, n. 9, p. 2150, doi. 10.3390/ma17092150
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- Article
Impact of Hydrogen Voiding in Chip-to-Chip Electroless All-Copper Interconnections.
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- Micromachines, 2024, v. 15, n. 5, p. 612, doi. 10.3390/mi15050612
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- Article
Interfacing Langmuir–Blodgett and Pickering Emulsions for the Synthesis of 2D Nanostructured Films: Applications in Copper Ion Adsorption.
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- Nanomaterials (2079-4991), 2024, v. 14, n. 9, p. 809, doi. 10.3390/nano14090809
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- Article
Advanced morphological characterization of DC sputtered copper thin films.
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- Modern Physics Letters B, 2024, v. 38, n. 10, p. 1, doi. 10.1142/S0217984924500532
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- Article
Significantly Enhanced Conformal Contact by the Functional Layers on a Copper Film for Thermal Interface Materials.
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- Advanced Engineering Materials, 2024, v. 26, n. 7, p. 1, doi. 10.1002/adem.202301823
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- Article
Optimization of Cu<sub>2</sub>O Thickness to Enhance Photocatalytic Properties of Electrodeposited Cu<sub>2</sub>O/FTO Photoanode.
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- Bulletin of Chemical Reaction Engineering & Catalysis, 2024, v. 19, n. 1, p. 108, doi. 10.9767/bcrec.20081
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- Article
Cross-linked polymer film on copper stubs as a reusable substrate enabling imaging and quantitative analyses of aluminosilicate particles.
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- Canadian Journal of Chemistry, 2024, v. 102, n. 4, p. 223, doi. 10.1139/cjc-2023-0145
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- Article
Potentiometric Phosphate Ion Sensor Based on Electrochemically Modified All-Solid-State Copper Electrode for Phosphate Ions' Detection in Real Water.
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- Chemosensors, 2024, v. 12, n. 4, p. 53, doi. 10.3390/chemosensors12040053
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- Article
Emerging Non-Noble-Metal Atomic Layer Deposited Copper as Seeds for Electroless Copper Deposition.
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- Materials (1996-1944), 2024, v. 17, n. 7, p. 1620, doi. 10.3390/ma17071620
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- Article
Nanovoid formation mechanism in nanotwinned Cu.
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- Discover Nano, 2024, v. 19, n. 1, p. 1, doi. 10.1186/s11671-024-03984-z
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- Article
Direct Electrochemical Synthesis of Metal‐Organic Frameworks: Cu<sub>3</sub>(BTC)<sub>2</sub> and Cu(TCPP) on Copper Thin films and Copper‐Based Microstructures.
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- ChemPlusChem, 2024, v. 89, n. 3, p. 1, doi. 10.1002/cplu.202300378
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- Article
Cover Feature: Direct Electrochemical Synthesis of Metal‐Organic Frameworks: Cu<sub>3</sub>(BTC)<sub>2</sub> and Cu(TCPP) on Copper Thin films and Copper‐Based Microstructures (ChemPlusChem 3/2024).
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- ChemPlusChem, 2024, v. 89, n. 3, p. 1, doi. 10.1002/cplu.202300378
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- Article
Magnetotelluric Imaging of the Central Himalayan Crust Away From Rift Zones.
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- Geochemistry, Geophysics, Geosystems: G3, 2024, v. 25, n. 3, p. 1, doi. 10.1029/2023GC011132
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- Article
Diamond-like carbon/Cu composite films on stainless steel: synthesis and investigation of heat transfer properties.
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- Journal of Nanoparticle Research, 2024, v. 26, n. 3, p. 1, doi. 10.1007/s11051-024-05964-x
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- Article
Fabrication of patterned transparent conductive glass via laser metal transfer for efficient electrical heating and antibacteria.
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- Nano Research, 2024, v. 17, n. 3, p. 1578, doi. 10.1007/s12274-023-5954-x
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- Article
Enhancing Electrical and Physical Contacts of Copper‐Electroplated Silicon Heterojunction Solar Cells through Chemical Pretreated Seed Layers.
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- Solar RRL, 2024, v. 8, n. 5, p. 1, doi. 10.1002/solr.202300938
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- Article
Exploring the Influence of Copper Chemical Displacement Duration on Nonvolatile Oxide-based Resistive Memory Device Characteristics.
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- Sensors & Materials, 2024, v. 36, n. 3, Part 3, p. 1093, doi. 10.18494/SAM4740
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- Article
Passivating Polycrystalline Copper with an Ultrathin Samarium Layer.
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- Advanced Engineering Materials, 2024, v. 26, n. 3, p. 1, doi. 10.1002/adem.202301052
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- Article
Microstructure and Mechanical Properties of Ti6Al4V to Al 2 O 3 Brazed Joints Using Ti-Ag/Cu-Ti Thin Films.
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- Metals (2075-4701), 2024, v. 14, n. 2, p. 146, doi. 10.3390/met14020146
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- Article
Microfabricated Nitinol Stent Retrievers with a Micro-Patterned Surface.
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- Micromachines, 2024, v. 15, n. 2, p. 213, doi. 10.3390/mi15020213
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- Article
Optically Transparent Honeycomb Mesh Antenna Integrated into OLED Light Source.
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- Electronics (2079-9292), 2024, v. 13, n. 2, p. 289, doi. 10.3390/electronics13020289
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- Article
Effect of Carbon-Doped Cu(Ni) Alloy Film for Barrierless Copper Interconnect.
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- Coatings (2079-6412), 2024, v. 14, n. 1, p. 68, doi. 10.3390/coatings14010068
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- Article
Aluminum Co-Deposition via DC Magnetron Sputtering for Enhanced Pitting Resistance of Copper–Nickel Alloys.
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- Coatings (2079-6412), 2024, v. 14, n. 1, p. 132, doi. 10.3390/coatings14010132
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- Article
Analysis of the Effect of Copper Doping on the Optoelectronic Properties of Indium Oxide Thin Films and the Thermoelectric Properties of an In 2 O 3 /Pt Thermocouple.
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- Crystals (2073-4352), 2024, v. 14, n. 1, p. 78, doi. 10.3390/cryst14010078
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- Article
AUTOMATED CONTROL OF THE THIN FILMS ELECTRICAL CONDUCTIVITY BY THE EDDY CURRENT METHOD.
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- Eurasian Physical Technical Journal, 2024, v. 21, n. 1, p. 74, doi. 10.31489/2024No1/74-83
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- Article
A Spiral Wire_coil Wideband Metasurface Absorber with Ultrathin and Flexible Feature for Microwave Applications.
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- Journal of Nano- & Electronic Physics, 2024, v. 16, n. 1, p. 1, doi. 10.21272/jnep.16(1).01002
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- Article
Integrated Microfluidic Chip Technology for Copper Ion Detection Using an All-Solid-State Ion-Selective Electrode.
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- Micromachines, 2024, v. 15, n. 1, p. 160, doi. 10.3390/mi15010160
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- Article
Visual Color Change During Spin‐coating Guiding the Quality of Cu<sub>2</sub>ZnSn(S,Se)<sub>4</sub> Films.
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- Small Methods, 2024, v. 8, n. 1, p. 1, doi. 10.1002/smtd.202300971
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- Article
The Rapid Boiling of Thin Liquid Films with Different Thicknesses on Nanochannel Copper Plates: A Molecular Dynamics Study.
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- Coatings (2079-6412), 2023, v. 13, n. 12, p. 2057, doi. 10.3390/coatings13122057
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- Article
High-Power Impulse Magnetron Sputter-Deposited Chromium-Based Coatings for Corrosion Protection.
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- Coatings (2079-6412), 2023, v. 13, n. 12, p. 2101, doi. 10.3390/coatings13122101
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- Article
Micro-Vickers Hardness of Cu and Cu 2 O Dual Phase Composite Films Electrodeposited from Acidic Aqueous Solutions Containing Polyethylene Glycol.
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- Crystals (2073-4352), 2023, v. 13, n. 12, p. 1654, doi. 10.3390/cryst13121654
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- Article
Nano-Sized Copper Films Prepared by Magnetron Sputtering.
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- Journal of Structural Chemistry, 2023, v. 64, n. 12, p. 2438, doi. 10.1134/S0022476623120156
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- Article
Composition-Tunable Properties of Cu(Ag) Alloy for Hybrid Bonding Applications.
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- Materials (1996-1944), 2023, v. 16, n. 23, p. 7481, doi. 10.3390/ma16237481
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- Article
Optical Measurement of the Stoichiometry of Thin-Film Compounds Synthetized From Multilayers: Example of Cu(In,Ga)Se<sub>2</sub>.
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- Microscopy & Microanalysis, 2023, v. 29, n. 6, p. 1847, doi. 10.1093/micmic/ozad105
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- Article
Improving antibacterial ability of Ti-Cu thin films with co-sputtering method.
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- Scientific Reports, 2023, v. 13, n. 1, p. 1, doi. 10.1038/s41598-023-43875-4
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- Article
Copper doping effects on the optical and dielectric properties of amorphous indium selenide thin films.
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- Optical & Quantum Electronics, 2023, v. 55, n. 12, p. 1, doi. 10.1007/s11082-023-05314-6
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- Article
Effect of Cu ratios dopant on ZnSe thin films structural and optical properties.
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- Chalcogenide Letters, 2023, v. 20, n. 11, p. 759, doi. 10.15251/CL.2023.2011.759
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- Article
Synthesis of wittichenite Cu<sub>3</sub>BiS<sub>3</sub> thin films by sulfurizing thermally evaporated Cu-Bi metallic stacks.
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- Chalcogenide Letters, 2023, v. 20, n. 11, p. 797, doi. 10.15251/CL.2023.2011.797
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- Article
Influence of the Gas Preheating Temperature on the Microstructure and Electrical Resistivity of Copper Thin Films Prepared via Vacuum Cold Spraying.
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- Coatings (2079-6412), 2023, v. 13, n. 11, p. 1870, doi. 10.3390/coatings13111870
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- Article
Spectral and Near-Field Scattering Characteristics of Two-Layered Metal-Containing Nanoparticles in Absorbing Matrices.
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- Journal of Applied Spectroscopy, 2023, v. 90, n. 5, p. 1019, doi. 10.1007/s10812-023-01627-2
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- Article
Variation in Refractive Index and Extinction Coefficient of a Very Thin Copper Film by Thermal Annealing: an Ellipsometric Approach.
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- Journal of Applied Spectroscopy, 2023, v. 90, n. 5, p. 1092, doi. 10.1007/s10812-023-01637-0
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- Article
The effects of chloride and sulphate on the growth of sulphide films on copper in anoxic sulphide solutions.
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- Materials & Corrosion / Werkstoffe und Korrosion, 2023, v. 74, n. 11, p. 1665, doi. 10.1002/maco.202313766
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- Article