Works matching DE "COPPER films"
Results: 767
Mechanism and Structural Defects of Zinc Film Deposited on a Copper Substrate: A Study via Molecular Dynamics Simulations.
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- Coatings (2079-6412), 2025, v. 15, n. 2, p. 174, doi. 10.3390/coatings15020174
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Nanostructured Chromium PVD Thin Films Fabricated Through Copper–Chromium Selective Dissolution.
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- Materials (1996-1944), 2025, v. 18, n. 4, p. 894, doi. 10.3390/ma18040894
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Innenrücktitelbild: N‐Heterocyclic Carbene Based Nanolayer for Copper Film Oxidation Mitigation (Angew. Chem. 25/2022).
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- Angewandte Chemie, 2022, v. 134, n. 25, p. 1, doi. 10.1002/ange.202206016
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N‐Heterocyclic Carbene Based Nanolayer for Copper Film Oxidation Mitigation.
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- Angewandte Chemie, 2022, v. 134, n. 25, p. 1, doi. 10.1002/ange.202201093
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Reactive Extrusion Printing for Simultaneous Crystallization‐Deposition of Metal–Organic Framework Films.
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- Angewandte Chemie, 2022, v. 134, n. 15, p. 1, doi. 10.1002/ange.202117240
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Large‐Area Crystalline Zeolitic Imidazolate Framework Thin Films.
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- Angewandte Chemie, 2021, v. 133, n. 25, p. 14243, doi. 10.1002/ange.202104366
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Electrochemical Synthesis of Large Area Two‐Dimensional Metal–Organic Framework Films on Copper Anodes.
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- Angewandte Chemie, 2021, v. 133, n. 6, p. 2923, doi. 10.1002/ange.202012971
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Nondestructive Characterization of Graphene Defects.
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- Advanced Functional Materials, 2014, v. 23, n. 41, p. 5183, doi. 10.1002/adfm.201300493
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Combined effect of texture and nanotwins on mechanical properties of the nanostructured Cu and Cu-Al films prepared by magnetron sputtering.
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- Journal of Materials Science, 2015, v. 50, n. 4, p. 1901, doi. 10.1007/s10853-014-8753-7
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Ultrasonic cavitation test applied to thin metallic films for assessing their adhesion with mercaptosilanes and surface roughness.
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- Journal of Materials Science, 2014, v. 49, n. 19, p. 6750, doi. 10.1007/s10853-014-8369-y
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Impact dynamics of water droplets on Cu films with three-level hierarchical structures.
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- Journal of Materials Science, 2014, v. 49, n. 9, p. 3379, doi. 10.1007/s10853-014-8046-1
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Surface‐enhanced resonance Raman scattering in partially oxidized thin copper film.
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- Journal of Raman Spectroscopy, 2020, v. 51, n. 8, p. 1286, doi. 10.1002/jrs.5905
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- Article
Optical Measurement of the Stoichiometry of Thin-Film Compounds Synthetized From Multilayers: Example of Cu(In,Ga)Se<sub>2</sub>.
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- Microscopy & Microanalysis, 2023, v. 29, n. 6, p. 1847, doi. 10.1093/micmic/ozad105
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Nano-Sized Copper Films Prepared by Magnetron Sputtering.
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- Journal of Structural Chemistry, 2023, v. 64, n. 12, p. 2438, doi. 10.1134/S0022476623120156
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Structure and thermal properties of heterometallic complexes for chemical vapor deposition of Cu-Pd films.
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- Journal of Structural Chemistry, 2017, v. 58, n. 8, p. 1522, doi. 10.1134/S0022476617080078
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Nanovoid formation mechanism in nanotwinned Cu.
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- Discover Nano, 2024, v. 19, n. 1, p. 1, doi. 10.1186/s11671-024-03984-z
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A copper foam-based surface-enhanced Raman scattering substrate for glucose detection.
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- Discover Nano, 2023, v. 18, n. 1, p. 1, doi. 10.1186/s11671-023-03776-x
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- Article
磨料混合对硅通孔铜膜抛光效果的影响.
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- Lubrication Engineering (0254-0150), 2023, v. 48, n. 3, p. 117, doi. 10.3969/j.issn.0254-0150.2022.12.016
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磨料混合对硅通孔铜膜抛光效果的影响.
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- Lubrication Engineering (0254-0150), 2022, v. 47, n. 12, p. 117, doi. 10.3969/j.issn.0254-0150.2022.12.0116
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Large-area borophene sheets on sacrificial Cu(111) films promoted by recrystallization from subsurface boron.
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- NPJ Quantum Materials, 2019, v. 4, n. 1, p. N.PAG, doi. 10.1038/s41535-019-0181-0
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Sulfur Dioxide and Sulfolane as Additives in Organic Electrolytes to Develop Room-Temperature Sodium Batteries.
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- Batteries, 2022, v. 8, n. 9, p. 127, doi. 10.3390/batteries8090127
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Detwinning through migration of twin boundaries in nanotwinned Cu films under in situ ion irradiation.
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- Science & Technology of Advanced Materials, 2018, v. 19, n. 1, p. 212, doi. 10.1080/14686996.2018.1428877
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Створення елементів рентґенівської оптики із застосуванням протонно-променевої літографії
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- Nanosistemi, Nanomateriali, Nanotehnologii, 2018, v. 16, n. 4, p. 645
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Analog Memristor of Lead‐Free Cs<sub>4</sub>CuSb<sub>2</sub>Cl<sub>12</sub> Layered Double Perovskite Nanocrystals as Solid‐State Electronic Synapse for Neuromorphic Computing.
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- Advanced Materials Interfaces, 2022, v. 9, n. 30, p. 1, doi. 10.1002/admi.202200562
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- Article
Metallic Interface Induced Ionic Redistribution within Amorphous MoO<sub>3</sub> Films.
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- Advanced Materials Interfaces, 2022, v. 9, n. 23, p. 1, doi. 10.1002/admi.202200453
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A Microfiber Sensor for the Trace Copper Ions Detection Based on Ternary Sensitive film.
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- Advanced Materials Interfaces, 2022, v. 9, n. 22, p. 1, doi. 10.1002/admi.202200491
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- Article
Influence of Polymer Interfacial Protective Layer Thickness on the Stability of Lithium‐Metal Batteries.
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- Advanced Materials Interfaces, 2022, v. 9, n. 10, p. 1, doi. 10.1002/admi.202102428
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Electrochemical Thin Film Deposition of Copper(I) Halides in Aqueous Solution: Substrate Extension and Structure Transformation.
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- Advanced Materials Interfaces, 2022, v. 9, n. 10, p. 1, doi. 10.1002/admi.202102239
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Electrochemical Thin Film Deposition of Copper(I) Halides in Aqueous Solution: Substrate Extension and Structure Transformation.
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- Advanced Materials Interfaces, 2022, v. 9, n. 10, p. 1, doi. 10.1002/admi.202102239
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A New Allotrope of Carbon—Graphdiyne (g‐C<sub>n</sub>H<sub>2</sub><sub>n</sub><sub>−2</sub>) Boosting with Mn<sub>0.2</sub>Cd<sub>0.8</sub>S form S‐Scheme Heterojunction for Efficient Photocatalytic Hydrogen Evolution.
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- Advanced Materials Interfaces, 2021, v. 8, n. 15, p. 1, doi. 10.1002/admi.202100630
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Highly Material Selective and Self‐Aligned Photo‐assisted Atomic Layer Deposition of Copper on Oxide Materials.
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- Advanced Materials Interfaces, 2021, v. 8, n. 11, p. 1, doi. 10.1002/admi.202100014
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The Hallmarks of Copper Single Atom Catalysts in Direct Alcohol Fuel Cells and Electrochemical CO<sub>2</sub> Fixation.
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- Advanced Materials Interfaces, 2021, v. 8, n. 8, p. 1, doi. 10.1002/admi.202001822
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Well‐Controlled Decomposition of Copper Complex Inks Enabled by Metal Nanowire Networks for Highly Compact, Conductive, and Flexible Copper Films.
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- Advanced Materials Interfaces, 2020, v. 7, n. 1, p. N.PAG, doi. 10.1002/admi.201901550
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A Critical Review: The Impact of the Battery Electrode Material Substrate on the Composition and Properties of Atomic Layer Deposition (ALD) Coatings.
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- Advanced Materials Interfaces, 2019, v. 6, n. 24, p. N.PAG, doi. 10.1002/admi.201901455
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- Article
Enhanced Interface Stability of Multilayer Bi<sub>2</sub>Te<sub>3</sub>/Ti/Cu Films after Heat Treatment via the Insertion of a Ti Layer.
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- Advanced Materials Interfaces, 2019, v. 6, n. 20, p. N.PAG, doi. 10.1002/admi.201900682
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- Article
Highly Conductive and Fatigue‐Free Flexible Copper Film Electrode Fabricated by a Facile Dry Transfer Technique.
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- Advanced Materials Interfaces, 2018, v. 5, n. 1, p. 1, doi. 10.1002/admi.201701038
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- Article
Island Coalescence during Film Growth: An Underestimated Limitation of Cu ALD.
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- Advanced Materials Interfaces, 2017, v. 4, n. 18, p. n/a, doi. 10.1002/admi.201700274
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- Article
Recycled Superwetting Nanostructured Copper Mesh Film: Toward Bidirectional Separation of Emulsified Oil/Water Mixtures.
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- Advanced Materials Interfaces, 2016, v. 3, n. 17, p. n/a, doi. 10.1002/admi.201600370
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- Article
Combined Secondary Ion Mass Spectrometry Depth Profiling and Focused Ion Beam Analysis of Cu Films Electrodeposited under Oscillatory Conditions.
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- ChemElectroChem, 2015, v. 2, n. 5, p. 664, doi. 10.1002/celc.201402427
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Determination of Arsenic in Water by Total Reflection X-Ray Fluorescence Spectrometry (TXRF) by Capture on a Copper Film.
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- Analytical Letters, 2025, v. 58, n. 4, p. 680, doi. 10.1080/00032719.2024.2334914
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Simple Copper Nanoparticle/Polyfurfural Film Modified Electrode for the Determination of 2, 4, 6-Trinitrotoluene (TNT).
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- Analytical Letters, 2020, v. 53, n. 16, p. 2671, doi. 10.1080/00032719.2020.1751182
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APPLICATION OF ANODIC STRIPPING VOLTAMMETRY AT A MERCURY FILM ELECTRODE FOR SIMULTANEOUS DETERMINATION OF ZINC, CADMIUM, LEAD AND COPPER IN WATER AND SOIL SAMPLES.
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- Oxidation Communications, 2020, v. 43, n. 3, p. 452
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- Article
Enhancement of Photoelectrochemical Cathodic Protection of Copper in Marine Condition by Cu-Doped TiO2.
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- Catalysts (2073-4344), 2020, v. 10, n. 2, p. 146, doi. 10.3390/catal10020146
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- Article
Structure and Magnetoresistive Properties of Three-layer Films Сo<sub>(1 – x)</sub>Cr<sub>x</sub>/Cu/Co.
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- Journal of Nano- & Electronic Physics, 2021, v. 13, n. 3, p. 03042-1, doi. 10.21272/jnep.13(3).03042
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The Raman Diagnostics of Carbon Films Obtained by Electron-beam Deposition on Cu, Al and Ni Substrates.
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- Journal of Nano- & Electronic Physics, 2021, v. 13, n. 2, p. 02023-1, doi. 10.21272/jnep.13(2).02023
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Structural-Phase State and Magnetotransport Properties of Thin Film Alloys Based on Permalloy and Copper.
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- Journal of Nano- & Electronic Physics, 2021, v. 13, n. 1, p. 01020-1, doi. 10.21272/jnep.13(1).01020
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Magnetic and Magnetoresistive Properties of Thin Film Alloys Based on Cobalt and Copper.
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- Journal of Nano- & Electronic Physics, 2020, v. 12, n. 5, p. 05030-1, doi. 10.21272/jnep.12(5).05030
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Some Properties and Structural Features of Poly(Vinyl Chloride)/Cu Films with Copper Nanoparticles Obtained by Exploding Wire Method.
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- Journal of Nano- & Electronic Physics, 2020, v. 12, n. 4, p. 1, doi. 10.21272/jnep.12(4).04032
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- Article
Resistive Switching Memory Properties of Electrodeposited Cu<sub>2</sub>O Thin Films.
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- Journal of Nano- & Electronic Physics, 2020, v. 12, n. 2, p. 1, doi. 10.21272/jnep.12(2).02035
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- Article
Structure, Electrical and Corrosion Properties of Quasicrystalline Al-Cu-Fe-Sc Thin Films.
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- Journal of Nano- & Electronic Physics, 2019, v. 11, n. 5, p. 1, doi. 10.21272/jnep.11(5).05020
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