Works matching DE "COPPER diffusion rate"
Results: 24
Microstructure evolution and elemental diffusion of SiCp/Al-Cu-Mg composites prepared from elemental powder during hot pressing.
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- Journal of Materials Science, 2011, v. 46, n. 21, p. 6783, doi. 10.1007/s10853-011-5636-z
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- Article
Cu redistribution during sintering of Fe-2Cu and Fe-2Cu-0·5C compacts.
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- Powder Metallurgy, 2014, v. 57, n. 5, p. 373, doi. 10.1179/1743290114Y.0000000085
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Antibacterial Activity of Cu Nanoparticles against E. coli, Staphylococcus aureus and Pseudomonas aeruginosa.
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- Nano Biomedicine & Engineering, 2017, v. 9, n. 1, p. 9, doi. 10.5101/nbe.v9i1.p9-14
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Comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the Cu/TaN/SiO2/Si multilayer structure.
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- Journal of Materials Science, 2001, v. 36, n. 23, p. 5705, doi. 10.1023/A:1012590305144
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- Article
Effect of Intermetallic on Electromigration and Atomic Diffusion in Cu/SnAg<sub>3.0</sub>Cu<sub>0.5</sub>/Cu Joints: Experimental and First-Principles Study.
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- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 866, doi. 10.1007/s11664-009-0760-0
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The Effect of Intermetallic Compound Morphology on Cu Diffusion in Sn-Ag and Sn-Pb Solder Bump on the Ni/Cu Under-Bump Metallization.
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- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 68, doi. 10.1007/s11664-005-0182-6
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The formation and evolution of intermetallic compounds formed between Sn–Ag–Zn–In lead-free solder and Ni/Cu substrate.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 675, doi. 10.1007/s10854-008-9785-z
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- Article
Rapid Na, Cu exchange between synthetic fluid inclusions and external aqueous solutions: evidence from LA-ICP-MS analysis.
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- Geofluids, 2009, v. 9, n. 4, p. 321, doi. 10.1111/j.1468-8123.2009.00255.x
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Phase diagram of Au-Al-Cu at 500 °C.
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- Gold Bulletin, 2014, v. 47, n. 3, p. 167, doi. 10.1007/s13404-014-0140-2
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Erratum to: Copper diffusion in cable-insulating materials by chemiluminescence and DSC techniques.
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- 2016
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- Erratum
Co-W nanocrystalline electrodeposits as barrier for interconnects.
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- Journal of Solid State Electrochemistry, 2014, v. 18, n. 11, p. 3057, doi. 10.1007/s10008-014-2488-x
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- Article
Investigation of Cu Diffusivity in Fe by a Combination of Atom Probe Experiments and Kinetic Monte Carlo Simulation.
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- Materials Transactions, 2021, v. 62, n. 7, p. 929, doi. 10.2320/matertrans.MT-M2021028
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Failure Analysis of Cracks Formed at Extrados of Bend Pipe of API 5L X65M Grade.
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- Journal of Failure Analysis & Prevention, 2013, v. 13, n. 5, p. 531, doi. 10.1007/s11668-013-9721-2
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- Article
Effect of Post Treatment For Cu-Cr Source/Drain Electrodes on a-IGZO TFTs.
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- Materials (1996-1944), 2016, v. 9, n. 8, p. 623, doi. 10.3390/ma9080623
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- Article
A Method for the Estimation of the Interface Temperature in Ultrasonic Joining.
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- Metallurgical & Materials Transactions. Part A, 2014, v. 45, n. 5, p. 2545, doi. 10.1007/s11661-014-2203-7
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Discussion of “The Development of the Concept of Vacancy-Mediated Substitutional Diffusion: The Important Contribution from Fredrick Seitz”.
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- Metallurgical & Materials Transactions. Part A, 2013, v. 44, n. 12, p. 5622, doi. 10.1007/s11661-013-1922-5
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Influence of light on interstitial copper inp-type silicon.
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- Applied Physics A: Materials Science & Processing, 2005, v. 80, n. 2, p. 201, doi. 10.1007/s00339-004-3038-7
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- Article
Atomic Flux of Cu Diffusion into Sn During Interfacial Interactions Between Cu and Sn Nanoparticles.
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- Journal of Electronic Materials, 2017, v. 46, n. 1, p. 602, doi. 10.1007/s11664-016-4957-8
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- Article
Growth Mechanism of a Ternary (Cu,Ni)Sn Compound at the Sn(Cu)/Ni(P) Interface.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2382, doi. 10.1007/s11664-010-1339-5
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Stabilization of Oxidized Copper Nanoclusters in Confined Spaces.
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- Topics in Catalysis, 2018, v. 61, n. 5/6, p. 419, doi. 10.1007/s11244-017-0879-9
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- Article
LOW STRESS TaN THIN FILM DEVELOPMENT FOR MEMS/SENSOR ELECTRODE APPLICATION.
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- Journal of Circuits, Systems & Computers, 2013, v. 22, n. 9, p. 1, doi. 10.1142/S0218126613400173
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- Article
Mechanism of Copper Diffusion over the Si(110) Surface.
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- Semiconductors, 2002, v. 36, n. 9, p. 958, doi. 10.1134/1.1507271
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- Article
A study of dynamical evolution of small two-dimensional Copper islands' diffusion on Ag(111) surface and observed surface effects.
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- Modern Physics Letters B, 2017, v. 31, n. 33, p. -1, doi. 10.1142/S021798491750316X
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Ehrlich-Schwöbel barriers and adsorption of Au, Cu and Ag stepped (100) surfaces.
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- Modern Physics Letters B, 2017, v. 31, n. 5, p. -1, doi. 10.1142/S0217984917500373
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- Article