Works matching DE "COPPER bonding"
1
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 21, p. 16433, doi. 10.1007/s10854-017-7554-6
- Khairi Faiz, M.;
- Bansho, Kazuma;
- Suga, Tadatomo;
- Miyashita, Tomoyuki;
- Yoshida, Makoto
- Article
2
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 21, p. 16467, doi. 10.1007/s10854-017-7558-2
- Myung, Woo-Ram;
- Kim, Kyung-Yeol;
- Kim, Yongil;
- Jung, Seung-Boo
- Article
3
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 12, p. 9155, doi. 10.1007/s10854-017-6649-4
- Mei, Yunhui;
- Li, Lin;
- Li, Xin;
- Li, Wanli;
- Yan, Haidong;
- Xie, Yijing
- Article
4
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 11, p. 4786, doi. 10.1007/s10854-014-2234-2
- Article
5
- Image Analysis & Stereology, 2013, v. 32, n. 2, p. 65, doi. 10.5566/ias.v32.p65-75
- ŠEDIVÝ, ONDŘEJ;
- BENEŠ, VIKTOR;
- IŽIL, PETR POŃ;
- KRÁL, PETR;
- SKLENIČKA, VÁCLAV
- Article
6
- Welding International, 2015, v. 29, n. 4, p. 270, doi. 10.1080/09507116.2014.921047
- Tanaka, Yo;
- Fujiwara, Shinichi;
- Ogura, Tomo;
- Sano, Tomokazu;
- Hirose, Akio
- Article
7
- Journal of Thermal Spray Technology, 2015, v. 24, n. 1/2, p. 75, doi. 10.1007/s11666-014-0150-x
- Wang, Kai;
- Kong, Lingyan;
- Tao, Yongshan;
- Li, Tiefan;
- Xiong, Tianying
- Article
8
- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 2, p. 39, doi. 10.4071/imaps.503
- Zheng Chen;
- Yiying Yao;
- Wenli Zhang;
- Boroyevich, Dushan;
- Ngo, Khai;
- Mattavelli, Paolo;
- Burgos, Rolando
- Article
9
- Angewandte Chemie, 2014, v. 126, n. 50, p. 13991, doi. 10.1002/ange.201407817
- Campbell, Christopher J.;
- Leigh, David A.;
- Vitorica-Yrezabal, Inigo J.;
- Woltering, Steffen L.
- Article
10
- European Journal of Inorganic Chemistry, 2013, v. 2013, n. 28, p. 5033, doi. 10.1002/ejic.201300670
- Shcherbakov, Igor N.;
- Levchenkov, Sergey I.;
- Tupolova, Yulia P.;
- Popov, Leonid D.;
- Vlasenko, Valery G.;
- Zubavichus, Yan V.;
- Lukov, Vladimir V.;
- Kogan, Victor A.
- Article
11
- Sensors & Materials, 2018, v. 30, n. 12, Part 2, p. 2897, doi. 10.18494/SAM.2018.1967
- Ryo Takigawa;
- Keiichiro Iwanabe;
- Akihiro Ikeda;
- Takayuki Takao;
- Tanemasa Asano
- Article
12
- Sensors & Materials, 2018, v. 30, n. 12, Part 2, p. 2889, doi. 10.18494/SAM.2018.1948
- Jenn-Ming Song;
- Sin-Yong Liang;
- Zong-Yu Xie;
- Po-Hao Chiang;
- Shang-Kun Huang;
- Ying-Ta Chiu;
- David Tarng;
- Chih-Pin Hung;
- Jing-Yuan Lin
- Article
13
- Journal of Electronic Materials, 2019, v. 48, n. 1, p. 44, doi. 10.1007/s11664-018-6625-7
- Article
