Works matching DE "COOLING of electronic appliances"
Results: 42
Determination of the refrigerating capacity of cryogenic gas machines for cooling current leads containing high-temperature superconductors.
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- Journal of Engineering Physics & Thermophysics, 2011, v. 84, n. 3, p. 678, doi. 10.1007/s10891-011-0521-9
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ZVS - High Frequency Series Resonant Converter with High Performance Power Factor Correction.
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- IUP Journal of Electrical & Electronics Engineering, 2012, v. 5, n. 2, p. 30
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Capture Index: An Airflow-Based Rack Cooling Performance Metric.
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- ASHRAE Transactions, 2007, v. 113, n. 1, p. 126
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Performance of a Rack of Liquid-Cooled Servers.
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- ASHRAE Transactions, 2007, v. 113, n. 1, p. 101
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Low-Temperature Heat Storage for Solar Heating and Cooling Applications.
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- ASHRAE Transactions, 2007, v. 113, n. 1, p. 89
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Designing Sustainable On-Site CHP Systems.
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- ASHRAE Transactions, 2007, v. 113, n. 1, p. 80
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Notebook blower inlet flow and acoustics: Experiments and simulations.
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- Noise Control Engineering Journal, 2009, v. 57, n. 4, p. 348, doi. 10.3397/1.3151971
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A new Geopole™ cooling technique for outdoor electronic enclosures.
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- International Journal of Energy Research, 2006, v. 30, n. 7, p. 459, doi. 10.1002/er.1161
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Design and characterization of a cylindrical, water-cooled heat sink for thermoelectric air-conditioners.
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- International Journal of Energy Research, 2006, v. 30, n. 2, p. 67, doi. 10.1002/er.1124
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- Article
Comparative analysis of different cooling fin types for countering LED luminaires' heat problems.
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- Turkish Journal of Electrical Engineering & Computer Sciences, 2018, v. 26, n. 1, p. 454, doi. 10.3906/elk-1602-121
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- Article
Thermal Optimization of Horizontal Tubes with Tilted Rectangular Fins under Free Convection for the Cooling of Electronic Devices.
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- Applied Sciences (2076-3417), 2017, v. 7, n. 4, p. 352, doi. 10.3390/app7040352
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Thermodynamic Analysis and Optimization of a Scramjet Engine with Thermal Management System.
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- International Review of Aerospace Engineering, 2010, v. 3, n. 3, p. 162
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Experimental Investigation of Heated Horizontal Rectangular Fin Array Under Mixed Convection.
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- International Review of Mechanical Engineering, 2012, v. 6, n. 1, p. 104
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CAA of an Air-Cooling System for Electronic Devices.
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- Advances in Acoustics & Vibration, 2016, p. 1, doi. 10.1155/2016/4785389
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Optimization and Thermal Performance Assessment of Pin-Fin Heat Sinks.
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- Energy Sources Part A: Recovery, Utilization & Environmental Effects, 2009, v. 31, n. 1, p. 51, doi. 10.1080/15567030701468118
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- Article
Reduction of heat sink common-mode currents in switching mode power supply circuits.
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- Advances in Radio Science, 2011, v. 9, p. 317, doi. 10.5194/ars-9-317-2011
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- Article
OPTIMIZATION OF PIN-FIN HEAT SINKS USING ANISOTROPIC LOCAL THERMAL NONEQUILIBRIUM POROUS MODEL IN A JET IMPINGING CHANNEL.
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- Numerical Heat Transfer: Part A -- Applications, 2003, v. 44, n. 8, p. 771, doi. 10.1080/716100528
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Normalization of Various Phase Functions for Radiative Heat Transfer Analysis in a Solar Absorber Tube.
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- Heat Transfer Engineering, 2014, v. 35, n. 6-8, p. 791, doi. 10.1080/08832323.2013.838104
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A One-Dimensional Heat Transfer Model Analysis of Heat Sinks.
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- Heat Transfer Engineering, 2014, v. 35, n. 6-8, p. 764, doi. 10.1080/01457632.2013.838082
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A Three-Dimensional Study of Electronic Component Cooling Using a Flat Heat Pipe.
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- Heat Transfer Engineering, 2013, v. 34, n. 7, p. 596, doi. 10.1080/01457632.2013.730426
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Selected Papers from the Thirteenth Brazilian Congress of Thermal Sciences and Engineering—ENCIT 2010.
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- Heat Transfer Engineering, 2013, v. 34, n. 5/6, p. 399, doi. 10.1080/01457632.2013.721306
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Enhanced Transient Heat Transfer From Arrays of Jets Impinging on a Moving Plate.
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- Heat Transfer Engineering, 2013, v. 34, n. 4, p. 361, doi. 10.1080/01457632.2013.717046
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Modeling of a Microchannel Evaporator for Space Electronics Cooling: Entropy Generation Minimization Approach.
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- Heat Transfer Engineering, 2013, v. 34, n. 4, p. 303, doi. 10.1080/01457632.2012.715069
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Ultralightweight Compact Heat Sinks With Metal Foams Under Axial Fan Flow Impingement.
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- Heat Transfer Engineering, 2012, v. 33, n. 7, p. 642, doi. 10.1080/01457632.2012.630270
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Design and Operation of a Novel Capillary Pumped Two-Loop System for Cooling of Electronic Devices.
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- Heat Transfer Engineering, 2012, v. 33, n. 1, p. 12, doi. 10.1080/01457632.2011.584809
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A Honeycomb Microchannel Cooling System for Microelectronics Cooling.
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- Heat Transfer Engineering, 2011, v. 32, n. 7/8, p. 616, doi. 10.1080/01457632.2010.509755
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- Article
Experimental Studies of Nanofluid Droplets in Spray Cooling.
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- Heat Transfer Engineering, 2009, v. 30, n. 13, p. 1108, doi. 10.1080/01457630902922467
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- Article
Comparison of Fluid Flow and Thermal Characteristics of Plate-Fin and Pin-Fin Heat Sinks Subject to a Parallel Flow.
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- Heat Transfer Engineering, 2008, v. 29, n. 2, p. 169, doi. 10.1080/01457630701686669
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Evaluation of Jet Impingement, Spray and Microchannel Chip Cooling Options for High Heat Flux Removal.
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- Heat Transfer Engineering, 2007, v. 28, n. 11, p. 911, doi. 10.1080/01457630701421703
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Cooling of Laser Slab by Forced Convection through a Heat Sink.
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- Heat Transfer Engineering, 2007, v. 28, n. 11, p. 931, doi. 10.1080/01457630701421737
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Performance and Optimization of Composed Fin Arrays.
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- Heat Transfer Engineering, 2004, v. 25, n. 4, p. 4, doi. 10.1080/01457630490443596
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Methods for Thermal Optimization of Microchannel Heat Sinks.
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- Heat Transfer Engineering, 2004, v. 25, n. 1, p. 37, doi. 10.1080/01457630490248359
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Thermal Analysis and Optimum Fin Length of a Heat Sink.
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- Heat Transfer Engineering, 2003, v. 24, n. 2, p. 18, doi. 10.1080/01457630304083
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- Article
5.8 GHz orientation-specific extruded-fin heatsink antennas for 3D RF system integration.
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- Microwave & Optical Technology Letters, 2008, v. 50, n. 7, p. 1826, doi. 10.1002/mop.23478
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- Article
A parametric investigation of a PCM-based pin fin heat sink.
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- Mechanical Sciences, 2015, v. 6, n. 1, p. 65, doi. 10.5194/ms-6-65-2015
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- Article
Two-Phase Closed-Loop Thermosyphon for Electronic Cooling.
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- Experimental Heat Transfer, 2010, v. 23, n. 2, p. 144, doi. 10.1080/08916150903402807
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- Article
Electrohydrodynamic Convective Heat Transfer in a Square Duct.
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- Annals of the New York Academy of Sciences, 2009, v. 1161, p. 452, doi. 10.1111/j.1749-6632.2008.04330.x
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Performance Improvement and Parametric Optimisation of a Parallel Plate Heat Sink.
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- CURIE Journal, 2009, v. 1, n. 4, p. 49
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Frequency bandwidth and conversion loss of a semiconductor heterodyne receiver with phonon cooling of two-dimensional electrons.
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- Semiconductors, 2010, v. 44, n. 11, p. 1427, doi. 10.1134/S1063782610110096
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Thermal performance of a vapor chamber for electronic cooling applications.
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- Journal of Mechanical Science & Technology, 2017, v. 31, n. 4, p. 1995, doi. 10.1007/s12206-017-0349-0
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- Article
Effects of Variable Thermal Conductivity and Heat Source/Sink on MHD Flow Near a Stagnation Point on a Linearly Stretching Sheet.
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- Journal of Applied Fluid Mechanics, 2009, v. 2, n. 1, p. 13
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- Article
Effects of Varying Viscosity and Thermal Conductivity on Steady Free Convective Flow and Heat Transfer Along an Isothermal Vertical Plate in the Presence of Heat Sink.
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- Journal of Applied Fluid Mechanics, 2009, v. 2, n. 1, p. 23, doi. 10.36884/jafm.2.01.11852
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- Article