Works matching DE "CONTACT resistance (Materials science)"
1
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 11, p. 10630, doi. 10.1007/s10854-019-01408-8
- Raza, Mohsin Ali;
- Westwood, Aidan
- Article
2
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3658, doi. 10.1007/s10854-015-4205-7
- Kim, Sun-Chul;
- Kim, Young-Ho
- Article
3
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 12, p. 5540, doi. 10.1007/s10854-014-2341-0
- Shu, Lufeng;
- Shi, Wei;
- Huang, Wei;
- Yu, Junsheng
- Article
4
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 12, p. 5061, doi. 10.1007/s10854-013-1524-4
- Tokarska, M.;
- Frydrysiak, M.;
- Zięba, J.
- Article
5
- Numerical Methods for Partial Differential Equations, 2017, v. 33, n. 1, p. 354, doi. 10.1002/num.22111
- Ji, Haifeng;
- Wang, Feng;
- Chen, Jinru
- Article
6
- Journal of Solid State Electrochemistry, 2014, v. 18, n. 3, p. 821, doi. 10.1007/s10008-013-2330-x
- Silva, R.;
- Soares, C.;
- Carvalho, M.;
- Rangel, C.;
- Silva Pereira, M.
- Article
7
- Eurasian Physical Technical Journal, 2025, v. 22, n. 1, p. 76, doi. 10.31489/2025N1/76-82
- А. I., Soldatov;
- A. A., Soldatov;
- M. A., Kostina;
- A. A., Abouellail;
- S. I., Bortalevich
- Article
8
- Eurasian Physical Technical Journal, 2024, v. 21, n. 2, p. 38, doi. 10.31489/2024No2/38-48
- Soldatov A. I.;
- Soldatov A. A.;
- Abouellail A. A.;
- Kostina M. A.
- Article
9
- International Journal of Energy Research, 2018, v. 42, n. 2, p. 633, doi. 10.1002/er.3845
- Lamba, Ravita;
- Kaushik, S. C.;
- Tyagi, S. K.
- Article
10
- Temperature, 2019, v. 6, n. 1, p. 85, doi. 10.1080/23328940.2018.1551706
- Article
11
- Physica Status Solidi - Rapid Research Letters, 2018, v. 12, n. 7, p. 1, doi. 10.1002/pssr.201800131
- Li, Meng;
- Lee, Jeongchan;
- Oh, Jungwoo;
- Lee, Hi‐Deok
- Article
12
- Physica Status Solidi - Rapid Research Letters, 2016, v. 10, n. 4, p. 305, doi. 10.1002/pssr.201510443
- Fritz, Susanne;
- Engelhardt, Josh;
- Ebert, Stefanie;
- Hahn, Giso
- Article
13
- Physica Status Solidi - Rapid Research Letters, 2014, v. 8, n. 2, p. 137, doi. 10.1002/pssr.201308252
- Matsumoto, Tsubasa;
- Kato, Hiromitsu;
- Tokuda, Norio;
- Makino, Toshiharu;
- Ogura, Masahiko;
- Takeuchi, Daisuke;
- Okushi, Hideyo;
- Yamasaki, Satoshi
- Article
14
- Journal of Mining & Metallurgy. Section B: Metallurgy, 2013, v. 49, n. 3, p. 279, doi. 10.2298/JMMB130118029P
- Petrič, M.;
- Kastelic, S.;
- Mrvar, P.
- Article
15
- Romanian Review Precision Mechanics, Optics & Mecatronics, 2016, n. 50, p. 91, doi. 10.17683/rrpmom.issue.50/paper16
- Obame, Hans Essone;
- Abdi, Rochdi El;
- Benjemâa, Noureddine;
- Carvou, Erwann
- Article
16
- Journal of Superconductivity & Novel Magnetism, 2015, v. 28, n. 2, p. 681, doi. 10.1007/s10948-014-2756-0
- Article
17
- Journal of Superconductivity & Novel Magnetism, 2012, v. 25, n. 8, p. 2749, doi. 10.1007/s10948-011-1256-8
- Article
18
- Journal of Thermal Spray Technology, 2018, v. 27, n. 8, p. 1518, doi. 10.1007/s11666-018-0789-9
- Xing, Ya-Zhe;
- He, Li;
- Liu, Zhang;
- Feng, Xiao;
- Chen, Yongnan;
- Xu, Yiku
- Article
19
- Optical & Quantum Electronics, 2018, v. 50, n. 2, p. 0, doi. 10.1007/s11082-018-1324-4
- Qu, Sheng;
- Ma, Congcong;
- Wang, Shulong;
- Liu, Hongxia;
- Dong, Lu
- Article
20
- International Journal of Mechatronics & Applied Mechanics, 2024, n. 18, p. 138
- Chen Guoqiang;
- Zhang Pengfei;
- Wang Xin;
- Wang Yanpeng;
- Liu Xuhui;
- Kang Jianli
- Article
21
- Journal of Thermal Stresses, 2016, v. 39, n. 4, p. 414, doi. 10.1080/01495739.2016.1152132
- Torabi, Mohsen;
- Zhang, Kaili
- Article
22
- Advances in Materials Science & Engineering, 2018, p. 1, doi. 10.1155/2018/2524748
- Wang, Jingqin;
- Zhang, Ying;
- Kang, Huiling
- Article
24
- EE: Evaluation Engineering, 2016, v. 55, n. 5, p. 22
- Article
25
- Semiconductors, 2018, v. 52, n. 1, p. 131, doi. 10.1134/S1063782618010190
- Sachenko, A.;
- Belyaev, A.;
- Konakova, R.
- Article
26
- Semiconductors, 2017, v. 51, n. 8, p. 996, doi. 10.1134/S1063782617080097
- Drabkin, I.;
- Osvensky, V.;
- Sorokin, A.;
- Panchenko, V.;
- Narozhnaia, O.
- Article
27
- Semiconductors, 2013, v. 47, n. 3, p. 449, doi. 10.1134/S1063782613030238
- Sachenko, A.;
- Belyaev, A.;
- Boltovets, N.;
- Vinogradov, A.;
- Kapitanchuk, L.;
- Konakova, R.;
- Kostylyov, V.;
- Kudryk, Ya.;
- Kladko, V.;
- Sheremet, V.
- Article
28
- Semiconductors, 2012, v. 46, n. 3, p. 330, doi. 10.1134/S1063782612030074
- Belyaev, A.;
- Boltovets, N.;
- Konakova, R.;
- Kudryk, Ya.;
- Sachenko, A.;
- Sheremet, V.;
- Vinogradov, A.
- Article
29
- Semiconductors, 2012, v. 46, n. 3, p. 334, doi. 10.1134/S1063782612030177
- Sachenko, A.;
- Belyaev, A.;
- Bobyl, A.;
- Boltovets, N.;
- Ivanov, V.;
- Kapitanchuk, L.;
- Konakova, R.;
- Kudryk, Ya.;
- Milenin, V.;
- Novitskii, S.;
- Sakseev, D.;
- Tarasov, I.;
- Sheremet, V.;
- Yagovkina, M.
- Article
30
- Journal of Electronic Materials, 2019, v. 48, n. 5, p. 3115, doi. 10.1007/s11664-019-07072-2
- Article
31
- Journal of Electronic Materials, 2019, v. 48, n. 4, p. 1870, doi. 10.1007/s11664-018-6785-5
- Article
32
- Journal of Electronic Materials, 2019, v. 48, n. 1, p. 596, doi. 10.1007/s11664-018-6759-7
- Pang, Dandan;
- Zhang, Aibing;
- Wang, BaoLin;
- Li, Guangyong
- Article
33
- Journal of Electronic Materials, 2018, v. 47, n. 11, p. 6791, doi. 10.1007/s11664-018-6605-y
- Ahmad, Samir Mahmmod;
- Leong, Cheow Siu;
- Winder, Richard W.;
- Sopian, K.;
- Zaidi, Saleem H.
- Article
34
- Journal of Electronic Materials, 2018, v. 47, n. 10, p. 5905, doi. 10.1007/s11664-018-6480-6
- Article
35
- Journal of Electronic Materials, 2018, v. 47, n. 10, p. 5825, doi. 10.1007/s11664-018-6456-6
- Boukortt, Nour El Islam;
- Hadri, Baghdad
- Article
36
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 305, doi. 10.1007/s11664-017-5775-3
- Sarkar, Biplab;
- Reddy, Pramod;
- Klump, Andrew;
- Kaess, Felix;
- Rounds, Robert;
- Kirste, Ronny;
- Mita, Seiji;
- Kohn, Erhard;
- Collazo, Ramon;
- Sitar, Zlatko
- Article
37
- Journal of Electronic Materials, 2017, v. 46, n. 6, p. 3390, doi. 10.1007/s11664-016-5276-9
- Article
38
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6323, doi. 10.1007/s11664-016-5002-7
- Ohmi, Shun-ichiro;
- Chen, Mengyi;
- Masahiro, Yasushi
- Article
39
- Journal of Electronic Materials, 2016, v. 45, n. 11, p. 5764, doi. 10.1007/s11664-016-4818-5
- Pfeffer, Michael;
- Kumar, Praveen;
- Eibl, Oliver
- Article
40
- Journal of Electronic Materials, 2016, v. 45, n. 7, p. 3734, doi. 10.1007/s11664-016-4498-1
- Pettersen, Sigurd;
- Kristiansen, Helge;
- Nagao, Shijo;
- Helland, Susanne;
- Njagi, John;
- Suganuma, Katsuaki;
- Zhang, Zhiliang;
- He, Jianying
- Article
41
- Journal of Electronic Materials, 2016, v. 45, n. 4, p. 2142, doi. 10.1007/s11664-016-4358-z
- Wallace, T.;
- Jin, Z.-H.;
- Su, J.
- Article
42
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1296, doi. 10.1007/s11664-015-4003-2
- Vizel, Roi;
- Bargig, Tal;
- Beeri, Ofer;
- Gelbstein, Yaniv
- Article
43
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1301, doi. 10.1007/s11664-015-4014-z
- Article
44
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1321, doi. 10.1007/s11664-015-4022-z
- Sakamoto, Tatsuya;
- Taguchi, Yutaka;
- Kutsuwa, Takeshi;
- Ichimi, Kiyohide;
- Kasatani, Shinichi;
- Inada, Minoru
- Article
45
- Journal of Electronic Materials, 2016, v. 45, n. 3, p. 1711, doi. 10.1007/s11664-015-4182-x
- Brito, F.;
- Figueiredo, L.;
- Rocha, L.;
- Cruz, A.;
- Goncalves, L.;
- Martins, J.;
- Hall, M.
- Article
46
- Journal of Electronic Materials, 2015, v. 44, n. 8, p. 2869, doi. 10.1007/s11664-015-3731-7
- Article
47
- Journal of Electronic Materials, 2015, v. 44, n. 6, p. 1851, doi. 10.1007/s11664-014-3574-7
- Wu, Wenchang;
- Du, Zhengliang;
- Cui, Jiaolin;
- Shi, Zhongtao;
- Deng, Yuan
- Article
48
- Journal of Electronic Materials, 2015, v. 44, n. 6, p. 2192, doi. 10.1007/s11664-015-3761-1
- Romanjek, K.;
- Vesin, S.;
- Aixala, L.;
- Baffie, T.;
- Bernard-Granger, G.;
- Dufourcq, J.
- Article
49
- Journal of Electronic Materials, 2015, v. 44, n. 4, p. 1200, doi. 10.1007/s11664-014-3612-5
- Ha, Yong-Seok;
- Park, Hong-Gyu;
- Seo, Dae-Shik
- Article
50
- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4464, doi. 10.1007/s11664-014-3431-8
- Article