Works matching DE "CONDUCTIVE adhesives"

Results: 36

Production and morphological characterization of low resistance polyimide/silver nanowire nanocomposites: potential application in nanoconductive adhesives.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 4, p. 3897, doi. 10.1007/s10854-016-6003-2

By:

Hatami, Mehdi

Publication type:

Article

A novel connecting material: electrically conductive adhesives based on polyimide resin and conductive ceramic powders.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 10, p. 10405, doi. 10.1007/s10854-016-5127-8

By:

You, Shengjie;
Wu, Yong;
Sun, Tiancheng;
Huang, Xingmai;
Qi, Liying;
Zhang, Jiajing;
Hao, Sue

Publication type:

Article

Effect of in-situ oxidative preparation on electrical properties of Epoxy/PANi/MWCNTs nanocomposites.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 10, p. 10364, doi. 10.1007/s10854-016-5122-0

By:

Imani, Amin;
Arabi, Mahbube;
Farzi, Gholamali

Publication type:

Article

Fabrication of silver electrically conductive adhesive to apply in through-hole filling for PCB interconnection.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 9186, doi. 10.1007/s10854-016-4955-x

By:

Zhou, Guoyun;
Mao, Yingjie;
Wang, Chong;
Wang, Shouxu;
Chen, Yuanming;
He, Wei

Publication type:

Article

Influence of functionalized graphene on the electrical, mechanical, and thermal properties of solderable isotropic conductive adhesives.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4516, doi. 10.1007/s10854-016-4326-7

By:

Yim, Byung-Seung;
Kim, Kiho;
Kim, Jooheon;
Kim, Jong-Min

Publication type:

Article

Green synthesis of AgNPs/reduced graphene oxide nanocomposites and effect on the electrical performance of electrically conductive adhesives.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3540, doi. 10.1007/s10854-015-4189-3

By:

Zeng, Jinfeng;
Tian, Xun;
Song, Jingsi;
Wei, Zhong;
Harrington, Steven;
Yao, Yagang;
Ma, Lei;
Ma, Yanqing

Publication type:

Article

Low temperature chip on film bonding technology for 20 µm pitch applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3658, doi. 10.1007/s10854-015-4205-7

By:

Kim, Sun-Chul;
Kim, Young-Ho

Publication type:

Article

Synthesis of epoxy acrylate and preparation of dual-curable ECAs based on conductive ceramic powders.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 8, p. 6266, doi. 10.1007/s10854-015-3213-y

By:

Zhang, Jiajing;
Hao, Sue;
Shang, Qingyan;
Wang, Fangwei;
Wu, Yong;
You, Shengjie

Publication type:

Article

Recent progresses on hybrid micro-nano filler systems for electrically conductive adhesives (ECAs) applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 7, p. 4730, doi. 10.1007/s10854-015-3016-1

By:

Meschi Amoli, Behnam;
Hu, Anming;
Zhou, Norman;
Zhao, Boxin

Publication type:

Article

Effect of dispersion condition of multi-walled carbon nanotube (MWNT) on bonding properties of solderable isotropic conductive adhesives (ICAs).

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 12, p. 5208, doi. 10.1007/s10854-014-2290-7

By:

Yim, Byung-Seung;
Lee, Byung;
Kim, Jooheon;
Kim, Jong-Min

Publication type:

Article

Highly electrically conductive adhesives using silver nanoparticle (Ag NP)-decorated graphene: the effect of NPs sintering on the electrical conductivity improvement.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 1, p. 590, doi. 10.1007/s10854-014-2440-y

By:

Meschi Amoli, Behnam;
Trinidad, Josh;
Hu, Anming;
Zhou, Y.;
Zhao, Boxin

Publication type:

Article

One step synthesis of silver nanowires used in preparation of conductive silver paste.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 7, p. 2929, doi. 10.1007/s10854-014-1961-8

By:

Tang, Yao;
He, Wei;
Wang, Shouxu;
Tao, Zhihua;
Cheng, Lijuan

Publication type:

Article

Rheology and Processability of Diglycidylether of bisphenol-A (DGEBA) and Polyurethane (PU) based Isotropic Conductive Adhesives Filled with Different Size-distributed Silver Flakes and Silver Particles.

Published in:

Engineering Letters, 2013, v. 21, n. 3, p. 143

By:

Durairaj, R.;
Lam Wai Man;
Liew Jian Ping;
Lim Seow Pheng;
Subramaniam, Ramesh T.

Publication type:

Article

Resistance Analysis of Spherical Metal Thin Films Combining Van Der Pauw and Electromechanical Nanoindentation Methods.

Published in:

Journal of Electronic Materials, 2018, v. 47, n. 11, p. 6378, doi. 10.1007/s11664-018-6613-y

By:

Bazilchuk, Molly;
Evenstad, Otto Magnus;
Zhang, Zhiliang;
Kristiansen, Helge;
He, Jianying

Publication type:

Article

Effects of Silver Microparticles and Nanoparticles on Thermal and Electrical Characteristics of Electrically Conductive Adhesives.

Published in:

Journal of Electronic Materials, 2017, v. 46, n. 11, p. 6727, doi. 10.1007/s11664-017-5690-7

By:

Zulkarnain, M.;
Fadzil, M.;
Mariatti, M.;
Azid, I.

Publication type:

Article

Room-Temperature Curing and Grain Growth at High Humidity in Conductive Adhesives with Ultra-Low Silver Content.

Published in:

Journal of Electronic Materials, 2017, v. 46, n. 7, p. 4256, doi. 10.1007/s11664-017-5376-1

By:

Pettersen, Sigurd;
Redford, Keith;
Njagi, John;
Kristiansen, Helge;
Helland, Susanne;
Kalland, Erik;
Goia, Dan;
Zhang, Zhiliang;
He, Jianying

Publication type:

Article

Effect of Silver Flakes in Silver Paste on the Joining Process and Properties of Sandwich Power Modules (IGBTs Chip/Silver Paste/Bare Cu).

Published in:

Journal of Electronic Materials, 2016, v. 45, n. 11, p. 5789, doi. 10.1007/s11664-016-4739-3

By:

Zhao, Su-Yan;
Li, Xin;
Mei, Yun-Hui;
Lu, Guo-Quan

Publication type:

Article

Contact Resistance and Metallurgical Connections Between Silver Coated Polymer Particles in Isotropic Conductive Adhesives.

Published in:

Journal of Electronic Materials, 2016, v. 45, n. 7, p. 3734, doi. 10.1007/s11664-016-4498-1

By:

Pettersen, Sigurd;
Kristiansen, Helge;
Nagao, Shijo;
Helland, Susanne;
Njagi, John;
Suganuma, Katsuaki;
Zhang, Zhiliang;
He, Jianying

Publication type:

Article

Highly Conductive and Reliable Copper-Filled Isotropically Conductive Adhesives Using Organic Acids for Oxidation Prevention.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2479, doi. 10.1007/s11664-015-3798-1

By:

Chen, Wenjun;
Deng, Dunying;
Cheng, Yuanrong;
Xiao, Fei

Publication type:

Article

Roll-to-roll printed and assembled large area LED lighting element.

Published in:

International Journal of Advanced Manufacturing Technology, 2015, v. 81, n. 1-4, p. 529, doi. 10.1007/s00170-015-7244-6

By:

Keränen, K.;
Korhonen, P.;
Rekilä, J.;
Tapaninen, O.;
Happonen, T.;
Makkonen, P.;
Rönkä, K.

Publication type:

Article

Facile and Green Synthesis of Graphene-Based Conductive Adhesives via Liquid Exfoliation Process.

Published in:

Nanomaterials (2079-4991), 2019, v. 9, n. 1, p. 38, doi. 10.3390/nano9010038

By:

Wu, Jhao-Yi;
Lai, Yi-Chin;
Chang, Chien-Liang;
Hung, Wu-Ching;
Wu, Hsiao-Min;
Liao, Ying-Chih;
Huang, Chia-Hung;
Liu, Wei-Ren

Publication type:

Article

Thermal and electrical heating treatments of conductive acrylonitrile butadiene/butyl rubber blends.

Published in:

Journal of Thermoplastic Composite Materials, 2016, v. 29, n. 1, p. 92, doi. 10.1177/0892705715583177

By:

Redhwan, Abdulkareem A.;
El-Gamal, A. A.;
Khairy, S. A.;
Hassan, H. H.

Publication type:

Article

Development of an Improved Response Ultra-Wideband Antenna Based on Conductive Adhesive of Carbon Composite.

Published in:

Progress in Electromagnetics Research C, 2017, v. 79, p. 199, doi. 10.2528/pierc17091809

By:

Reyes-Vera, Erick;
Arias-Correa, Mauricio;
Giraldo-Mu?ñoz, Andrés;
Cata?ño-Ochoa, Daniel;
Santa-Marín, Juan

Publication type:

Article

Electrical Conductive Adhesives Enhanced with High- Aspect- Ratio Silver Nanobelts.

Published in:

Macromolecular Materials & Engineering, 2014, v. 299, n. 6, p. 739, doi. 10.1002/mame.201300295

By:

Amoli, Behnam Meschi;
Marzbanrad, Ehsan;
Hu, Anming;
Zhou, Y. Norman;
Zhao, Boxin

Publication type:

Article

Recent Development of Joining and Conductive Materials for Electronic Components.

Published in:

Materials Transactions, 2021, v. 62, n. 8, p. 1270, doi. 10.2320/matertrans.MT-M2021060

By:

Tatsuya Kobayashi;
Tetsuya Ando

Publication type:

Article

Self-Assembly Synthesis of Silver Nanowires/Graphene Nanocomposite and Its Effects on the Performance of Electrically Conductive Adhesive.

Published in:

Materials (1996-1944), 2018, v. 11, n. 10, p. 2028, doi. 10.3390/ma11102028

By:

Xu, Tao;
Chen, Jiayu;
Yuan, Wenhui;
Liu, Yinhua;
Sun, Yongjun;
Wu, Huijun;
Zhou, Xiaoqing

Publication type:

Article

Towards Practical Application of Paper based Printed Circuits: Capillarity Effectively Enhances Conductivity of the Thermoplastic Electrically Conductive Adhesives.

Published in:

Scientific Reports, 2014, p. 1, doi. 10.1038/srep06275

By:

Haoyi Wu;
Sum Wai Chiang;
Wei Lin;
Cheng Yang;
Zhuo Li;
Jingping Liu;
Xiaoya Cui;
Feiyu Kang;
Ching Ping Wong

Publication type:

Article

Effect of Tetraethylenepentamine on Silver Conductive Adhesive.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2018, v. 70, n. 9, p. 1800, doi. 10.1007/s11837-018-2939-4

By:

Wang, Xiao-Qing;
Gan, Wei-Ping;
Ge, Tian-Tian;
Li, Bi-Yuan

Publication type:

Article

DTT functionalization of Ag particles for conducting adhesives.

Published in:

Journal of Adhesion, 2018, v. 94, n. 6, p. 473, doi. 10.1080/00218464.2017.1288113

By:

de Oliveira, Cristian S.;
Quispe, Luis T.;
Plá Cid, Cristiani C.;
Sierra, Jelver A.;
de Barros, Silvio;
Mello, A.;
Pasa, André A.

Publication type:

Article

On the Use of Silver Plated Nano Aluminum Nitride and Silver Plated Chopped Carbon Fiber to Prepare Electrically Conductive Adhesives with High Thermal Conductivity.

Published in:

Journal of Adhesion, 2016, v. 92, n. 12, p. 982, doi. 10.1080/00218464.2015.1058712

By:

Ma, Huan;
Qi, Shuhua

Publication type:

Article

Properties of Phenolic-Based Ag-Filled Conductive Adhesive Affected by Different Coupling Agents.

Published in:

Journal of Adhesion, 2013, v. 89, n. 11, p. 847, doi. 10.1080/00218464.2013.775039

By:

Ho, Li-Ngee;
Wu, Teng Fei;
Nishikawa, Hiroshi

Publication type:

Article

NANOTECHNOLOGY.

Published in:: Advanced Materials & Processes, 2016, v. 174, n. 3, p. 15
Publication type:: Article

PREPARATION AND PROPERTY OF Ni/Ag-Cu POWDER COMPOSITE CONDUCTIVE PASTE.

Published in:

Materials & Technologies / Materiali in Tehnologije, 2022, v. 56, n. 3, p. 245, doi. 10.17222/mit.2022.360

By:

Fuqi Lian;
Xiaolei Su;
Yi Liu

Publication type:

Article

The effect of flow on the physical properties of polyurethane/carbon nanotubes nanocomposites: Repercussions on their use as electrically conductive Hot-Melt adhesives.

Published in:

Polymer Composites, 2015, v. 36, n. 4, p. 704, doi. 10.1002/pc.22989

By:

Landa, M.;
Fernández, M.;
Muñoz, M.E.;
Santamaría, A.

Publication type:

Article

Thermally Conductive Adhesive from Chemically Modified Cellulose and Nanoparticle of Surfactant-Doped Polypyrrole.

Published in:

Macromolecular Symposia, 2015, v. 353, n. 1, p. 24, doi. 10.1002/masy.201550303

By:

Draman, Sarifah Fauziah Syed;
Daik, Rusli;
El‐Sheikh, Said M.;
Latif, Famiza Abdul

Publication type:

Article

Conventional and microwave-assisted processing of Cu-loaded ICAs for electronic interconnect applications.

Published in:

Journal of Materials Science, 2013, v. 48, n. 20, p. 7204, doi. 10.1007/s10853-013-7537-9

By:

Qi, Siyuan;
Vaidhyanathan, Bala;
Hutt, David

Publication type:

Article