Works matching DE "CONDUCTIVE adhesives"
Results: 33
Conventional and microwave-assisted processing of Cu-loaded ICAs for electronic interconnect applications.
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- Journal of Materials Science, 2013, v. 48, n. 20, p. 7204, doi. 10.1007/s10853-013-7537-9
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- Article
The effect of flow on the physical properties of polyurethane/carbon nanotubes nanocomposites: Repercussions on their use as electrically conductive Hot-Melt adhesives.
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- Polymer Composites, 2015, v. 36, n. 4, p. 704, doi. 10.1002/pc.22989
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- Article
Thermally Conductive Adhesive from Chemically Modified Cellulose and Nanoparticle of Surfactant-Doped Polypyrrole.
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- Macromolecular Symposia, 2015, v. 353, n. 1, p. 24, doi. 10.1002/masy.201550303
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- Article
Effect of Tetraethylenepentamine on Silver Conductive Adhesive.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2018, v. 70, n. 9, p. 1800, doi. 10.1007/s11837-018-2939-4
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- Article
Towards Practical Application of Paper based Printed Circuits: Capillarity Effectively Enhances Conductivity of the Thermoplastic Electrically Conductive Adhesives.
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- Scientific Reports, 2014, p. 1, doi. 10.1038/srep06275
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- Article
Facile and Green Synthesis of Graphene-Based Conductive Adhesives via Liquid Exfoliation Process.
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- Nanomaterials (2079-4991), 2019, v. 9, n. 1, p. 38, doi. 10.3390/nano9010038
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- Article
Production and morphological characterization of low resistance polyimide/silver nanowire nanocomposites: potential application in nanoconductive adhesives.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 4, p. 3897, doi. 10.1007/s10854-016-6003-2
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- Article
Effect of in-situ oxidative preparation on electrical properties of Epoxy/PANi/MWCNTs nanocomposites.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 10, p. 10364, doi. 10.1007/s10854-016-5122-0
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- Article
A novel connecting material: electrically conductive adhesives based on polyimide resin and conductive ceramic powders.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 10, p. 10405, doi. 10.1007/s10854-016-5127-8
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- Article
Fabrication of silver electrically conductive adhesive to apply in through-hole filling for PCB interconnection.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 9186, doi. 10.1007/s10854-016-4955-x
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- Article
Influence of functionalized graphene on the electrical, mechanical, and thermal properties of solderable isotropic conductive adhesives.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4516, doi. 10.1007/s10854-016-4326-7
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- Article
Green synthesis of AgNPs/reduced graphene oxide nanocomposites and effect on the electrical performance of electrically conductive adhesives.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3540, doi. 10.1007/s10854-015-4189-3
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- Article
Low temperature chip on film bonding technology for 20 µm pitch applications.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3658, doi. 10.1007/s10854-015-4205-7
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- Article
Synthesis of epoxy acrylate and preparation of dual-curable ECAs based on conductive ceramic powders.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 8, p. 6266, doi. 10.1007/s10854-015-3213-y
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- Article
Recent progresses on hybrid micro-nano filler systems for electrically conductive adhesives (ECAs) applications.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 7, p. 4730, doi. 10.1007/s10854-015-3016-1
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- Article
Highly electrically conductive adhesives using silver nanoparticle (Ag NP)-decorated graphene: the effect of NPs sintering on the electrical conductivity improvement.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 1, p. 590, doi. 10.1007/s10854-014-2440-y
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- Article
Effect of dispersion condition of multi-walled carbon nanotube (MWNT) on bonding properties of solderable isotropic conductive adhesives (ICAs).
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 12, p. 5208, doi. 10.1007/s10854-014-2290-7
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- Article
One step synthesis of silver nanowires used in preparation of conductive silver paste.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 7, p. 2929, doi. 10.1007/s10854-014-1961-8
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- Article
Recent Development of Joining and Conductive Materials for Electronic Components.
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- Materials Transactions, 2021, v. 62, n. 8, p. 1270, doi. 10.2320/matertrans.MT-M2021060
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- Article
Self-Assembly Synthesis of Silver Nanowires/Graphene Nanocomposite and Its Effects on the Performance of Electrically Conductive Adhesive.
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- Materials (1996-1944), 2018, v. 11, n. 10, p. 2028, doi. 10.3390/ma11102028
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- Article
Development of an Improved Response Ultra-Wideband Antenna Based on Conductive Adhesive of Carbon Composite.
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- Progress in Electromagnetics Research C, 2017, v. 79, p. 199, doi. 10.2528/pierc17091809
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- Article
Electrical Conductive Adhesives Enhanced with High- Aspect- Ratio Silver Nanobelts.
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- Macromolecular Materials & Engineering, 2014, v. 299, n. 6, p. 739, doi. 10.1002/mame.201300295
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- Article
NANOTECHNOLOGY.
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- Advanced Materials & Processes, 2016, v. 174, n. 3, p. 15
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- Article
Rheology and Processability of Diglycidylether of bisphenol-A (DGEBA) and Polyurethane (PU) based Isotropic Conductive Adhesives Filled with Different Size-distributed Silver Flakes and Silver Particles.
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- Engineering Letters, 2013, v. 21, n. 3, p. 143
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- Article
PREPARATION AND PROPERTY OF Ni/Ag-Cu POWDER COMPOSITE CONDUCTIVE PASTE.
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- Materials & Technologies / Materiali in Tehnologije, 2022, v. 56, n. 3, p. 245, doi. 10.17222/mit.2022.360
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- Publication type:
- Article
Roll-to-roll printed and assembled large area LED lighting element.
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- International Journal of Advanced Manufacturing Technology, 2015, v. 81, n. 1-4, p. 529, doi. 10.1007/s00170-015-7244-6
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- Article
Resistance Analysis of Spherical Metal Thin Films Combining Van Der Pauw and Electromechanical Nanoindentation Methods.
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- Journal of Electronic Materials, 2018, v. 47, n. 11, p. 6378, doi. 10.1007/s11664-018-6613-y
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- Publication type:
- Article
Effects of Silver Microparticles and Nanoparticles on Thermal and Electrical Characteristics of Electrically Conductive Adhesives.
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- Journal of Electronic Materials, 2017, v. 46, n. 11, p. 6727, doi. 10.1007/s11664-017-5690-7
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- Article
Room-Temperature Curing and Grain Growth at High Humidity in Conductive Adhesives with Ultra-Low Silver Content.
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- Journal of Electronic Materials, 2017, v. 46, n. 7, p. 4256, doi. 10.1007/s11664-017-5376-1
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- Article
Effect of Silver Flakes in Silver Paste on the Joining Process and Properties of Sandwich Power Modules (IGBTs Chip/Silver Paste/Bare Cu).
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- Journal of Electronic Materials, 2016, v. 45, n. 11, p. 5789, doi. 10.1007/s11664-016-4739-3
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- Article
Contact Resistance and Metallurgical Connections Between Silver Coated Polymer Particles in Isotropic Conductive Adhesives.
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- Journal of Electronic Materials, 2016, v. 45, n. 7, p. 3734, doi. 10.1007/s11664-016-4498-1
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- Publication type:
- Article
Highly Conductive and Reliable Copper-Filled Isotropically Conductive Adhesives Using Organic Acids for Oxidation Prevention.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2479, doi. 10.1007/s11664-015-3798-1
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- Article
Thermal and electrical heating treatments of conductive acrylonitrile butadiene/butyl rubber blends.
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- Journal of Thermoplastic Composite Materials, 2016, v. 29, n. 1, p. 92, doi. 10.1177/0892705715583177
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- Article