Works matching DE "COLD plates (Electronics)"
1
- Structural & Multidisciplinary Optimization, 2018, v. 57, n. 6, p. 2223, doi. 10.1007/s00158-017-1852-8
- Qian, Sihao;
- Wang, Wei;
- Ge, Chaoliu;
- Lou, Shunxi;
- Miao, Enming;
- Tang, Baofu
- Article
2
- Energies (19961073), 2018, v. 11, n. 10, p. 2550, doi. 10.3390/en11102550
- Patil, Mahesh Suresh;
- Panchal, Satyam;
- Kim, Namwon;
- Lee, Moo-Yeon
- Article
3
- Scientia Iranica. Transaction B, Mechanical Engineering, 2024, v. 31, n. 20, p. 1916, doi. 10.24200/sci.2023.60327.6739
- Topcu, Gulnaz;
- Ercetin, Umran;
- Timuralp, Cisil
- Article
4
- Heat Transfer Engineering, 2017, v. 38, n. 14/15, p. 1247, doi. 10.1080/01457632.2016.1242954
- Ruiz, Maritza;
- Kunkle, Claire M.;
- Padilla, Jorge;
- Carey, Van P.
- Article
5
- Heat Transfer Engineering, 2009, v. 30, n. 12, p. 918, doi. 10.1080/01457630902837343
- Kandlikar, SatishG.;
- Hayner II, CliffordN.
- Article
6
- Heat Transfer Engineering, 2006, v. 27, n. 7, p. 6, doi. 10.1080/01457630600742308
- Sparrow, EphraimM.;
- Chevalier, PaulW.;
- Abraham, JohnP.
- Article
7
- International Journal of Simulation Modelling (IJSIMM), 2018, v. 17, n. 3, p. 534, doi. 10.2507/IJSIMM17(3)CO13
- Zhang, H. P.;
- Ye, J. H.;
- Yang, X. P.;
- Muruve, N. W.;
- Wang, J. T.
- Article
8
- International Journal of Simulation Modelling (IJSIMM), 2018, v. 17, n. 3, p. 521, doi. 10.2507/IJSIMM17(3)CO12
- Zeng, Q. L.;
- Wang, K.;
- Wan, L. R.
- Article
9
- International Journal of Simulation Modelling (IJSIMM), 2018, v. 17, n. 3, p. 512, doi. 10.2507/IJSIMM17(3)CO11
- Article
10
- International Journal of Simulation Modelling (IJSIMM), 2018, v. 17, n. 3, p. 543, doi. 10.2507/IJSIMM17(3)CO14
- Chen, Q.;
- Deng, L. F.;
- Wang, H. M.
- Article
11
- International Journal of Simulation Modelling (IJSIMM), 2018, v. 17, n. 3, p. 498, doi. 10.2507/IJSIMM17(3)449
- Zhang, X.;
- Wang, T.;
- Jiang, S. B.;
- Xu, H. G.;
- Zhang, Y. N.
- Article