Works matching DE "CIRCUIT board manufacturing"

Results: 128

A HIGH-SPEED MICRO-IMPACT TESTING SYSTEM FOR EVALUATING THE PROPERTIES OF LEAD-FREE SOLDER JOINTS.

Published in:

Experimental Techniques, 2010, v. 34, n. 3, p. 68, doi. 10.1111/j.1747-1567.2009.00480.x

By:

Liu, D.-S.;
Kuo, C.-Y.;
Hsu, C.-L.;
Chung, C.-L.

Publication type:

Article

Effect of solder flux residue on the performance of silicone conformal coatings on printed circuit board assemblies.

Published in:

Corrosion Engineering, Science & Technology, 2013, v. 48, n. 6, p. 436, doi. 10.1179/1743278213Y.0000000096

By:

Rathinavelu, U.;
Jellesen, M. S.;
Ambat, R.

Publication type:

Article

某电路板企业生产废水处理与回用工程实例及分析.

Published in:

Industrial Water Treatment, 2024, v. 44, n. 8, p. 205, doi. 10.19965/j.cnki.iwt.2023-1210

By:

王志强

Publication type:

Article

Detection of Banned and Restricted Ozone-Depleting Chemicals in Printed Circuit Boards.

Published in:

Environmental Forensics, 2008, v. 9, n. 4, p. 320, doi. 10.1080/15275920802502083

By:

Lee, RichardN.;
Wright, BobW.

Publication type:

Article

Transcriptome Analysis of Cyanide-Treated Rice Seedlings: Insights into Gene Functional Classifications.

Published in:

Life (2075-1729), 2022, v. 12, n. 11, p. 1701, doi. 10.3390/life12111701

By:

Li, Cheng-Zhi;
Lin, Yu-Juan;
Yu, Xiao-Zhang

Publication type:

Article

Wideband Branch Line Coupler with Open Circuit Coupled Lines.

Published in:

International Journal of Electrical & Computer Engineering (2088-8708), 2017, v. 7, n. 2, p. 888, doi. 10.11591/ijece.v7i2.pp888-893

By:

Sabri, Muataz Watheq;
Murad, N. A.;
Rahim, M. K. A.

Publication type:

Article

Reduction of the Fused Filament Fabrication Process Time in the Manufacturing of Printed Circuit Board Slots.

Published in:

International Journal of Combinatorial Optimization Problems & Informatics, 2020, v. 11, n. 1, p. 59

By:

Aguilar-Duque, Julian I.;
Hernández-Arellano, Juan L.;
Balderrama-Armendariz, Cesar O.;
Avelar-Sosa, Liliana

Publication type:

Article

A heuristic approach for component scheduling on a high-speed PCB assembly machine.

Published in:

Production Planning & Control, 2007, v. 18, n. 8, p. 655, doi. 10.1080/09537280701602683

By:

Ho, W.;
Ji, P.;
Wu, Y.

Publication type:

Article

Burn-in Test Detection Method for Electronic Products based on VFSA--ELM.

Published in:

Journal of Engineering Science & Technology Review, 2018, v. 11, n. 4, p. 40, doi. 10.25103/jestr.114.05

By:

Yanming Lee;
Hong-yi Zhang;
Jiangshui Hong;
Weiqi Lee;
Jimmi Rosa

Publication type:

Article

Margin analysis emerges as imperative validation technique.

Published in:

EE: Evaluation Engineering, 2014, v. 53, n. 8, p. 28

By:

Caffee, Tim

Publication type:

Article

Approaching Board Test Nonintrusively.

Published in:

EE: Evaluation Engineering, 2009, v. 48, n. 12, p. 23

By:

Sguigna, Alan

Publication type:

Article

AOI-AXI Duo Improves Product Yield.

Published in:

EE: Evaluation Engineering, 2009, v. 48, n. 3, p. 60

By:

Upton, David

Publication type:

Article

Making Test Lean Again.

Published in:

EE: Evaluation Engineering, 2009, v. 48, n. 3, p. 32

By:

VanNewkirk, John

Publication type:

Article

Implementing Change On the Test Floor.

Published in:

EE: Evaluation Engineering, 2007, v. 46, n. 5, p. 16

By:

VanNewkirk, John

Publication type:

Article

Modeling and Analysis Strategies for Failure Amplification Method.

Published in:

Journal of Quality Technology, 2008, v. 40, n. 2, p. 128, doi. 10.1080/00224065.2008.11917720

By:

Shuen-Lin Jeng;
Joseph, V. Roshan;
Wu, C. F. Jeff

Publication type:

Article

Frontispiz: Electrochemical Redox Synergism‐Enhanced Liquid Metal Locomotion for Unrestricted Circuit Substrate Patterning.

Published in:

Angewandte Chemie, 2025, v. 137, n. 17, p. 1, doi. 10.1002/ange.202581761

By:

Fan, Yi;
Shen, Yigang;
Zhang, Wenli;
Zeng, Guochao;
Liu, Tete;
Wang, Yilan;
Wang, Shuli;
Zheng, Jing;
Hou, Xu

Publication type:

Article

Reliability behavior of lead-free solder joints in electronic components.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 1, p. 172, doi. 10.1007/s10854-012-0720-y

By:

Zhang, Liang;
Han, Ji-guang;
He, Cheng-wen;
Guo, Yong-huan

Publication type:

Article

Effects of torrefaction and water washing on the properties and combustion reactivity of various wastes.

Published in:

International Journal of Energy Research, 2021, v. 45, n. 6, p. 8125, doi. 10.1002/er.5458

By:

Chen, Chia‐Yang;
Chen, Wei‐Hsin;
Ilham, Zul

Publication type:

Article

Reflection Phase Shift for PWB and PCBA Production Testing.

Published in:

Journal of Microelectronic & Electronic Packaging, 2012, v. 9, n. 1, p. 1, doi. 10.4071/imaps.315

By:

Renbi, Abdelghani;
Delsing, Jerker

Publication type:

Article

Is data mining of manufacturing data beyond first order analysis of value? A case study.

Published in:

Journal of Decision Systems, 2016, v. 25, p. 572, doi. 10.1080/12460125.2016.1187407

By:

Munro, David L.;
Madan, Manohar S.

Publication type:

Article

Surface and Electrical Characterization of Ag/AgCl Pseudo-Reference Electrodes Manufactured with Commercially Available PCB Technologies.

Published in:

Sensors (14248220), 2015, v. 15, n. 8, p. 18102, doi. 10.3390/s150818102

By:

Moschou, Despina;
Trantidou, Tatiana;
Regoutz, Anna;
Carta, Daniela;
Morgan, Hywel;
Prodromakis, Themistoklis

Publication type:

Article

Liquid Metal‐Based High‐Density Interconnect Technology for Stretchable Printed Circuits.

Published in:

Advanced Functional Materials, 2024, v. 34, n. 31, p. 1, doi. 10.1002/adfm.202309707

By:

Wang, Bei;
Prasad, Sonal;
Hellman, Oskar;
Li, Hao;
Fridberger, Anders;
Hjort, Klas

Publication type:

Article

Small-size printed loop-type antenna integrated with two stacked coupled-fed shorted strip monopoles for eight-band LTE/GSM/UMTS operation in the mobile phone.

Published in:

Microwave & Optical Technology Letters, 2010, v. 52, n. 7, p. 1471, doi. 10.1002/mop.25257

By:

Kin-Lu Wong;
Wei-Yu Chen

Publication type:

Article

A Study on the Fabrication Parameters and Dielectric Properties of PTFE Composites Filled with Al2O3 and SiO2 Nanoparticles.

Published in:

Journal of Industrial Textiles, 2011, v. 40, n. 4, p. 361, doi. 10.1177/1528083710379448

By:

Tsai, I-Shou;
Kuo, Ya-Chen

Publication type:

Article

End-to-end deep learning framework for printed circuit board manufacturing defect classification.

Published in:

Scientific Reports, 2022, v. 12, n. 1, p. 1, doi. 10.1038/s41598-022-16302-3

By:

Bhattacharya, Abhiroop;
Cloutier, Sylvain G.

Publication type:

Article

COMPACT RECONFIGURABLE HMSIW BANDPASS FILTER LOADED BY CSRR.

Published in:

Progress in Electromagnetics Research Letters, 2013, v. 40, p. 191, doi. 10.2528/pierl13032115

By:

Zhu-Dan Wang;
Feng Wei;
Li Zhang;
Xiaowei Shi

Publication type:

Article

Separation of transition metals and chelated complexes in wastewaters.

Published in:

Environmental Progress & Sustainable Energy, 2015, v. 34, n. 3, p. 761, doi. 10.1002/ep.12065

By:

Cheung, Philip C.W.;
Williams, Daryl R.

Publication type:

Article

Surface chemistry: Making the right connections.

Published in:

Nature Chemistry, 2012, v. 4, n. 3, p. 149, doi. 10.1038/nchem.1276

By:

Champness, Neil R.

Publication type:

Article

MODELING OF GRINDING PROCESS BY PRINTED CIRCUIT BOARDS RECYCLING.

Published in:

Annals of DAAAM & Proceedings, 2010, p. 475

By:

Charvatova, H.

Publication type:

Article

Effect of recyclate PTFE/GF laminate incorporation on the dielectric and mechanical properties of PTFE/GF composites using a novel manufacturing process.

Published in:

Journal of Applied Polymer Science, 2011, v. 122, n. 4, p. 2467, doi. 10.1002/app.34350

By:

Xi, Zhoutian;
Ghita, Oana R.;
Evans, Ken E.

Publication type:

Article

Recovery and utilisation of non-metallic fraction from waste printed circuit boards in polypropylene composites.

Published in:

Plastics, Rubber & Composites, 2015, v. 44, n. 8, p. 314, doi. 10.1179/1743289815Y.0000000021

By:

Biswal, M.;
Jada, N.;
Mohanty, S.;
Nayak, S. K.

Publication type:

Article

Intelligent parametric design for a multiple-quality-characteristic glue-dispensing process.

Published in:

Journal of Intelligent Manufacturing, 2019, v. 30, n. 5, p. 2291, doi. 10.1007/s10845-017-1389-0

By:

Huang, Chien-Yi;
Ying, Kuo-Ching

Publication type:

Article

A case-based evolutionary model for defect classification of printed circuit board images.

Published in:

Journal of Intelligent Manufacturing, 2008, v. 19, n. 2, p. 203, doi. 10.1007/s10845-008-0074-8

By:

Pei-Chann Chang;
Li-Yuan Chen;
Chin-Yuan Fan

Publication type:

Article

Next-generation printed circuit boards manufacturing: an innovative numerical investigation using electroforming process.

Published in:

International Journal of Advanced Manufacturing Technology, 2025, v. 137, n. 7, p. 4169, doi. 10.1007/s00170-025-15412-2

By:

Boutana, Ilhem;
Mekideche, Mohamed Rachid;
Boultif, Oussama;
Zait, Abdessalam

Publication type:

Article

Thermal degradation kinetics of waste printed circuit boards.

Published in:

Chemical Engineering Research & Design: Transactions of the Institution of Chemical Engineers Part A, 2018, v. 130, p. 87, doi. 10.1016/j.cherd.2017.12.005

By:

Alenezi, Raslan A.;
Al-Fadhli, Fahad M.

Publication type:

Article

Nanotechnology: Etch a circuit sketch.

Published in:: Nature, 2009, v. 457, n. 7233, p. 1061, doi. 10.1038/4571061a
Publication type:: Article

A Novel Double-layer Low-profile Multiband Frequency Selective Surface for 4G Mobile Communication System.

Published in:

Applied Computational Electromagnetics Society Journal, 2022, v. 37, n. 4, p. 420, doi. 10.13052/2022.ACES.J.370407

By:

Balta, Şakir;
Kartal, Mesut

Publication type:

Article

Passively aligned multichannel fiber-pigtailing of planar integrated optical waveguides.

Published in:

Optical Engineering, 2017, v. 56, n. 2, p. 1, doi. 10.1117/1.OE.56.2.026115

By:

Kremmel, Johannes;
Lamprecht, Tobias;
Crameri, Nino;
Michler, Markus

Publication type:

Article

Group-scheduling problems in electronics manufacturing.

Published in:

Journal of Scheduling, 2010, v. 13, n. 2, p. 177, doi. 10.1007/s10951-009-0147-3

By:

Gelogullari, Cumhur A.;
Logendran, Rasaratnam

Publication type:

Article

ACCURATE AND EFFICIENT ANALYSIS OF PLANAR ELECTROMAGNETIC BAND-GAP STRUCTURES FOR POWER BUS NOISE MITIGATION IN THE GHZ BAND.

Published in:

Progress in Electromagnetics Research B, 2012, v. 37, p. 59, doi. 10.2528/pierb11100402

By:

de Paulis, F.;
Orlandi, A.

Publication type:

Article

Hardware-in-the-Loop Simulation System Based on Unity3D for Winding Machine.

Published in:

Journal of Donghua University (English Edition), 2024, v. 41, n. 3, p. 298, doi. 10.19884/j.1672-5220.202311003

By:

TANG Long;
ZOU Kun

Publication type:

Article

Modeling of Micropores Drilling Force for Printed Circuit Board Micro-holes Based on Energy Method.

Published in:

Journal of Donghua University (English Edition), 2023, v. 40, n. 5, p. 525, doi. 10.19884/j.1672-5220.202209003

By:

ZHENG Xiaohu;
RUAN Hao;
CHEN Hongbo;
LIU Xiaojia;
LIU Zhenghao

Publication type:

Article

Laser Printing Circuit Boards and Electronics.

Published in:

Journal of Imaging Science & Technology, 2012, v. 56, n. 4, p. 1, doi. 10.2352/J.ImagingSci.Technol.2012.56.4.040503

By:

Jones, Jason;
Büttner, Dustin;
Chudasama, Rupesh;
Wimpenny, David;
Krüger, Klaus

Publication type:

Article

Effect of Hydroxyl Group Concentration Generated by Vacuum Ultraviolet Light on the Adhesion Between Epoxy Resin and Copper.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 11, p. 7044, doi. 10.1007/s11664-024-11379-0

By:

Endo, Shinichi;
Ishikawa, Yuki;
Shirakashi, Hina;
Saito, Takeyasu

Publication type:

Article

In situ TEM Characterization of Phase Transformations and Kirkendall Void Formation During Annealing of a Cu–Au–Sn–Cu Diffusion Bonding Joint.

Published in:

Journal of Electronic Materials, 2022, v. 51, n. 4, p. 1568, doi. 10.1007/s11664-021-09390-w

By:

Cornet, L.;
Yedra, L.;
Héripré, É.;
Aubin, V.;
Schmitt, J.-H.;
Giorgi, M.-L.

Publication type:

Article

Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint During Thermal Shock.

Published in:

Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6086, doi. 10.1007/s11664-016-4965-8

By:

Han, Jing;
Tan, Shihai;
Guo, Fu

Publication type:

Article

Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 3, p. 611, doi. 10.1007/s11664-011-1799-2

By:

Hannigan, K.;
Reid, M.;
Collins, M.N.;
Dalton, E.;
Xu, C.;
Wright, B.;
Demirkan, K.;
Opila, R.L.;
Reents, W.D.;
Franey, J.P.;
Fleming, D.A.;
Punch, J.

Publication type:

Article

An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 815, doi. 10.1007/s11664-009-0761-z

By:

Weiqiang Wang;
Choubey, Anupam;
Azarian, Michael;
Pecht, Michael

Publication type:

Article

A compact slot antenna configuration for ultrawideband (UWB) terminals and mobile phones.

Published in:

International Journal of RF & Microwave Computer-Aided Engineering, 2018, v. 28, n. 8, p. 1, doi. 10.1002/mmce.21400

By:

Zong, Wei‐Hua;
Yang, Xiao‐Mei;
Li, Shandong;
Qu, Xiao‐Yun;
Wei, Xiang‐Yang

Publication type:

Article

Millimeter-wave planar high gain SIW antenna using half elliptic radiation slots.

Published in:

International Journal of RF & Microwave Computer-Aided Engineering, 2015, v. 25, n. 8, p. 709, doi. 10.1002/mmce.20913

By:

Hao, Zhang‐Cheng;
Ding, Wenqi;
Fan, Kuikui;
Liu, Xiaoming

Publication type:

Article