Traceability validation of a high speed short-pulse testing method used in LED production.
- Published in:
- International Journal of Metrology & Quality Engineering, 2017, v. 8, p. 1, doi. 10.1051/ijmqe/2017024
- By:
- Publication type:
- Article
Works matching DE "CHIP-on-board assembly"
Results: 8
1
2
Integrated passive device fabricated and chip-on-board packaged filter employing mixed electric-magnetic coupling scheme.
- Published in:
- IET Microwaves, Antennas & Propagation (Wiley-Blackwell), 2018, v. 12, n. 14, p. 2191, doi. 10.1049/iet-map.2018.5492
- By:
- Publication type:
- Article
3
A 1.4-Gbps Intra-Panel Interface for Chip-On-Glass TFT-LCD Applications.
- Published in:
- SID Symposium Digest of Technical Papers, 2012, v. 43, n. 1, p. 569, doi. 10.1002/j.2168-0159.2012.tb05844.x
- By:
- Publication type:
- Article
4
LED chip-on-board package with high colour rendering index and high luminous efficacy.
- Published in:
- Lighting Research & Technology, 2018, v. 50, n. 3, p. 482, doi. 10.1177/1477153517701535
- By:
- Publication type:
- Article
5
Junction temperature simulation of multichip module LED package.
- Published in:
- Materials Research Innovations, 2014, v. 18, n. S2, p. 748, doi. 10.1179/1432891714Z.000000000565
- By:
- Publication type:
- Article
6
Advantages and Challenges of 10-Gbps Transmission on High-Density Interconnect Boards.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 6, p. 3134, doi. 10.1007/s11664-016-4423-7
- By:
- Publication type:
- Article
7
Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 6, p. 3208, doi. 10.1007/s11664-016-4427-3
- By:
- Publication type:
- Article
8
Surface Tension Directed Fluidic Self-Assembly of Semiconductor Chips across Length Scales and Material Boundaries.
- Published in:
- Micromachines, 2016, v. 7, n. 4, p. 54, doi. 10.3390/mi7040054
- By:
- Publication type:
- Article