Works matching DE "CERAMIC packaging (Electronics)"
Results: 7
Kinetic Migration of Chemical Elements from Ceramic Packaging into Simulated Foods and Mature Vinegar.
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- Packaging Technology & Science, 2014, v. 27, n. 1, p. 59, doi. 10.1002/pts.2007
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Research on the Green Design of the Online Shopping Ceramic Packaging in the Background of the Economical Society.
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- International Journal of Simulation: Systems, Science & Technology, 2015, v. 16, n. 3B, p. 19.1, doi. 10.5013/IJSSST.a.16.3B.19
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Stackable SiC-Embedded Ceramic Packages for High-Voltage and High-Temperature Power Electronic Applications.
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- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 4, p. 176, doi. 10.4071/imaps.952440
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Sixty Earth-Day Test of a Prototype Pt/HTCC Alumina Package in a Simulated Venus Environment.
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- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 2, p. 78, doi. 10.4071/imaps.873073
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Electrical Performance of a 32-I/O HTCC Alumina Package for High-Temperature Microelectronics.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 11, doi. 10.4071/imaps.529
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Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate.
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- Journal of Microelectronic & Electronic Packaging, 2012, v. 9, n. 3, p. 113, doi. 10.4071/imaps.334
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MEMS Wafer-Level Packaging Technology Using LTCC Wafer.
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- Electronics & Communications in Japan, 2014, v. 97, n. 9, p. 42, doi. 10.1002/ecj.11720
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- Article