Works matching DE "CERAMIC packaging (Electronics)"
1
- International Journal of Simulation: Systems, Science & Technology, 2015, v. 16, n. 3B, p. 19.1, doi. 10.5013/IJSSST.a.16.3B.19
- Article
2
- Electronics & Communications in Japan, 2014, v. 97, n. 9, p. 42, doi. 10.1002/ecj.11720
- Mohri, Mamoru;
- Esashi, Masayoshi;
- Tanaka, Shuji
- Article
3
- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 4, p. 176, doi. 10.4071/imaps.952440
- Hoang Linh Bach;
- Dirksen, Daniel;
- Blechinger, Christoph;
- Endres, Tobias Maximilian;
- Bayer, Christoph Friedrich;
- Schletz, Andreas;
- März, Martin
- Article
4
- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 2, p. 78, doi. 10.4071/imaps.873073
- Liangyu Chen;
- Neudeck, Philip G.;
- Meredith, Roger D.;
- Lukco, Dorothy;
- Spry, David J.;
- Nakley, Leah M.;
- Phillips, Kyle G.;
- Beheim, Glenn M.;
- Hunter, Gary W.
- Article
5
- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 11, doi. 10.4071/imaps.529
- Liang-Yu Chen;
- Neudeck, Philip G.;
- Spry, David J.;
- Beheim, Glenn M.;
- Hunter, Gary W.
- Article
6
- Journal of Microelectronic & Electronic Packaging, 2012, v. 9, n. 3, p. 113, doi. 10.4071/imaps.334
- Burkhardt, T.;
- Hornaff, M.;
- Acker, A.;
- Peschel, T.;
- Beckert, E.;
- Suphan, K.-H.;
- Mensel, K.;
- Jirak, S.;
- Eberhardt, R.;
- Tünnermann, A.
- Article
7
- Packaging Technology & Science, 2014, v. 27, n. 1, p. 59, doi. 10.1002/pts.2007
- Lin, Qin‐Bao;
- Chen, Yue;
- Song, Huan;
- Wu, Hai‐Jun;
- Wang, Xiao‐Yun
- Article
