Works matching DE "BREWER Science Inc."

ZoneBOND Thin Wafer Support Process for Wafer Bonding Applications.

Published in:

Journal of Microelectronic & Electronic Packaging, 2010, v. 7, n. 3, p. 138, doi. 10.4071/imaps.269

By:

• McCutcheon, Jeremy;
• Brown, Robert;
• Dachsteiner, JoElle

Publication type:

Article