Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 41, doi. 10.1007/s10854-011-0402-1
- By:
- Publication type:
- Article
Works matching DE "BONDING of semiconductors"
Results: 15
1
2
Crystallographic and structural characterization of heterometallic platinum clusters Part VIII. Heteronona- and heterodecanuclear clusters.
- Published in:
- Open Chemistry, 2015, v. 13, n. 1, p. -1, doi. 10.1515/chem-2015-0053
- By:
- Publication type:
- Article
3
Large-area wafer bonding of GaAs using hydrogen and ultrahigh vacuum atmospheres.
- Published in:
- Applied Physics A: Materials Science & Processing, 2000, v. 70, n. 1, p. 13
- By:
- Publication type:
- Article
4
On the theory of adsorption on graphene-like compounds.
- Published in:
- Semiconductors, 2017, v. 51, n. 2, p. 217, doi. 10.1134/S1063782617020051
- By:
- Publication type:
- Article
5
Patents.
- Published in:
- Chemistry & Industry, 2004, n. 20, p. 18
- Publication type:
- Article
6
Investigation and Effects of Wafer Bow in 3D Integration Bonding Schemes.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2605, doi. 10.1007/s11664-010-1341-y
- By:
- Publication type:
- Article
7
COMPOSITIONAL AND ELECTRICAL RESISTIVITY STUDIES ON THERMAL EVAPORATION COPPER INDIUM DISELENIDE THIN FILMS.
- Published in:
- Journal of Ovonic Research, 2009, v. 5, n. 6, p. 207
- By:
- Publication type:
- Article
8
Effect of increased manganese addition and mould type on the slurry erosion characteristics of Cr-Mn iron systems.
- Published in:
- Bulletin of Materials Science, 2008, v. 31, n. 7, p. 1001, doi. 10.1007/s12034-008-0157-3
- By:
- Publication type:
- Article
9
Untangling electronic, elastic and bonding properties of the ThGeO host material from first principles calculation.
- Published in:
- European Physical Journal B: Condensed Matter, 2017, v. 90, n. 8, p. 1, doi. 10.1140/epjb/e2017-80159-7
- By:
- Publication type:
- Article
10
Light-induced bone cement-philic titanium surface.
- Published in:
- Journal of Materials Science, 2008, v. 43, n. 5, p. 1552, doi. 10.1007/s10853-007-2353-8
- By:
- Publication type:
- Article
11
Non-stoichiometry and electronic properties of interfaces.
- Published in:
- Journal of Materials Science, 2007, v. 42, n. 6, p. 1890, doi. 10.1007/s10853-006-1322-y
- By:
- Publication type:
- Article
12
Surprising movements in solids.
- Published in:
- Nature, 2000, v. 408, n. 6808, p. 38, doi. 10.1038/35040672
- By:
- Publication type:
- Article
13
Micro-printing of patterned diamond-like carbon coatings on glass by anodic bonding.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2019, v. 55, n. 8, p. 483, doi. 10.1049/el.2018.8041
- By:
- Publication type:
- Article
14
N−N Bond Forming Reductive Elimination via a Mixed-Valent Nickel(II)-Nickel(III) Intermediate.
- Published in:
- Angewandte Chemie International Edition, 2016, v. 55, n. 26, p. 7534, doi. 10.1002/anie.201602566
- By:
- Publication type:
- Article
15
Synthesis and structure of solution-stable one-dimensional palladium wires.
- Published in:
- Nature Chemistry, 2011, v. 3, n. 12, p. 949, doi. 10.1038/nchem.1197
- By:
- Publication type:
- Article