Works matching DE "BONDING of semiconductors"
Results: 15
Light-induced bone cement-philic titanium surface.
- Published in:
- Journal of Materials Science, 2008, v. 43, n. 5, p. 1552, doi. 10.1007/s10853-007-2353-8
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- Article
Non-stoichiometry and electronic properties of interfaces.
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- Journal of Materials Science, 2007, v. 42, n. 6, p. 1890, doi. 10.1007/s10853-006-1322-y
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Untangling electronic, elastic and bonding properties of the ThGeO host material from first principles calculation.
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- European Physical Journal B: Condensed Matter, 2017, v. 90, n. 8, p. 1, doi. 10.1140/epjb/e2017-80159-7
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- Article
COMPOSITIONAL AND ELECTRICAL RESISTIVITY STUDIES ON THERMAL EVAPORATION COPPER INDIUM DISELENIDE THIN FILMS.
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- Journal of Ovonic Research, 2009, v. 5, n. 6, p. 207
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- Article
On the theory of adsorption on graphene-like compounds.
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- Semiconductors, 2017, v. 51, n. 2, p. 217, doi. 10.1134/S1063782617020051
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- Article
Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders.
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- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 41, doi. 10.1007/s10854-011-0402-1
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- Article
Micro-printing of patterned diamond-like carbon coatings on glass by anodic bonding.
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- Electronics Letters (Wiley-Blackwell), 2019, v. 55, n. 8, p. 483, doi. 10.1049/el.2018.8041
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Effect of increased manganese addition and mould type on the slurry erosion characteristics of Cr-Mn iron systems.
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- Bulletin of Materials Science, 2008, v. 31, n. 7, p. 1001, doi. 10.1007/s12034-008-0157-3
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- Article
Large-area wafer bonding of GaAs using hydrogen and ultrahigh vacuum atmospheres.
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- Applied Physics A: Materials Science & Processing, 2000, v. 70, n. 1, p. 13
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- Article
Investigation and Effects of Wafer Bow in 3D Integration Bonding Schemes.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2605, doi. 10.1007/s11664-010-1341-y
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Surprising movements in solids.
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- Nature, 2000, v. 408, n. 6808, p. 38, doi. 10.1038/35040672
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Crystallographic and structural characterization of heterometallic platinum clusters Part VIII. Heteronona- and heterodecanuclear clusters.
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- Open Chemistry, 2015, v. 13, n. 1, p. -1, doi. 10.1515/chem-2015-0053
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Synthesis and structure of solution-stable one-dimensional palladium wires.
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- Nature Chemistry, 2011, v. 3, n. 12, p. 949, doi. 10.1038/nchem.1197
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- Article
N−N Bond Forming Reductive Elimination via a Mixed-Valent Nickel(II)-Nickel(III) Intermediate.
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- Angewandte Chemie International Edition, 2016, v. 55, n. 26, p. 7534, doi. 10.1002/anie.201602566
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Patents.
- Published in:
- Chemistry & Industry, 2004, n. 20, p. 18
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- Article