Precipitation and coarsening of bismuth plates in Sn-Ag-Cu-Bi and Sn-Cu-Ni-Bi solder joints.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 1, p. 378, doi. 10.1007/s10854-018-0302-8
- By:
- Publication type:
- Article