Works matching DE "BALL grid array technology"
Results: 116
Advanced IC packaging: Markets and trends.
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- Solid State Technology, 2001, v. 44, n. 4, p. 44
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- Article
Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization.
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- Journal of Materials Science, 2007, v. 42, n. 13, p. 5239, doi. 10.1007/s10853-006-1234-x
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Measurements and Stochastic FEA with Application in Thermomechanical Characterization of Electronic Packages.
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- Journal of Engineering & Technological Sciences, 2016, v. 48, n. 6, p. 700, doi. 10.5614/j.eng.technol.sci.2016.48.6.5
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Broadband packaging solution in embedded wafer level ball grid array technology for D-band PMCW radar.
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- International Journal of Microwave & Wireless Technologies, 2024, v. 16, n. 5, p. 1, doi. 10.1017/S1759078724000266
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- Article
Experimental determination of the cyclic strength of brazed joints.
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- Welding International, 2011, v. 25, n. 4, p. 326, doi. 10.1080/09507116.2010.540889
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- Article
FAILURE ANALYSIS ON SOLDERED BALL GRID ARRAYS: PART II.
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- Electronic Device Failure Analysis, 2017, v. 19, n. 2, p. 4, doi. 10.31399/asm.edfa.2017-2.p004
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- Article
FAILURE ANALYSIS ON SOLDERED BALL GRID ARRAYS: PART I.
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- Electronic Device Failure Analysis, 2017, v. 19, n. 1, p. 4, doi. 10.31399/asm.edfa.2017-1.p004
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- Article
Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study.
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- International Journal of Damage Mechanics, 2014, v. 23, n. 2, p. 203, doi. 10.1177/1056789513488396
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- Article
Microstructure, Defects, and Reliability of Mixed Pb-Free/Sn-Pb Assemblies.
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- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 292, doi. 10.1007/s11664-008-0592-3
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- Article
Interfacial Reactions Between Pb-Free Solders and In/Ni/Cu Multilayer Substrates.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 93, doi. 10.1007/s11664-008-0575-4
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- Article
Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 880, doi. 10.1007/s11664-008-0400-0
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- Article
Joule Heating Enhanced Phase Coarsening in Sn37Pb and Sn3.5Ag0.5Cu Solder Joints during Current Stressing.
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- Journal of Electronic Materials, 2008, v. 37, n. 4, p. 469, doi. 10.1007/s11664-006-0014-3
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- Article
Failure Morphology after the Drop Impact Test of the Ball Grid Array Package with Lead-Free Sn-3.8Ag-0.7Cu on Cu and Ni Under-Bump Metallurgies.
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- Journal of Electronic Materials, 2007, v. 36, n. 3, p. 207, doi. 10.1007/s11664-007-0089-5
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- Article
Solder Joint Reliability Assessment for Flip Chip Ball Grid Array Components with Various Designs in Lead-Free Solder Materials and Solder Mask Dimensions.
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- Journal of Electronic Materials, 2007, v. 36, n. 1, p. 6, doi. 10.1007/s11664-006-0026-z
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- Article
Electromigration Effect on Intermetallic Growth and Young's Modulus in SAC Solder Joint.
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2116, doi. 10.1007/s11664-006-0321-8
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- Article
Abnormal Growth of Tin Whiskers in a Sn3Ag0.5Cu0.5Ce Solder Ball Grid Array Package.
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- Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1621, doi. 10.1007/s11664-006-0208-8
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Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Immersion Ag Surface Finish.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 310, doi. 10.1007/BF02692451
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- Article
Intermetallic Reactions in Reflowed and Aged Sn-9Zn Solder Ball Grid Array Packages with Au/Ni/Cu and Ag/Cu Pads.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 154, doi. 10.1007/s11664-006-0198-6
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- Article
Intermetallic Reactions in a Sn-20In-2.8Ag Solder Ball-Grid-Array Package with Au/Ni/Cu Pads.
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- Journal of Electronic Materials, 2005, v. 34, n. 11, p. 1385, doi. 10.1007/s11664-005-0195-1
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- Article
Effect of Volume in Interfacial Reaction between Eutectic Sn-3.5% Ag-0.5% Cu Solder and Cu Metallization in Microelectronic Packaging.
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- Journal of Electronic Materials, 2005, v. 34, n. 2, p. 143, doi. 10.1007/s11664-005-0225-z
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- Article
Reliability Investigation and Interfacial Reaction of Ball-Grid-Array Packages Using the Lead-Free Sn-Cu Solder.
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- Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1190, doi. 10.1007/s11664-004-0122-x
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- Article
Effect of high temperature storage test on reliability of eutectic Sn–Cu/ENIG solder joint.
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- Materials Science & Technology, 2007, v. 23, n. 4, p. 411, doi. 10.1179/174328407X177009
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- Article
Failure behaviors of BGA solder joints under various loading conditions of high-speed shear test.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 1, p. 17, doi. 10.1007/s10854-008-9588-2
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- Article
Electrical properties and interfacial reaction of BGA package with underfill.
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- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 1, p. 75, doi. 10.1007/s10854-007-9282-9
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- Article
Approach on Thermal Strain Behaviour of PBGA Solder Joints.
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- Strain, 2009, v. 45, n. 6, p. 527, doi. 10.1111/j.1475-1305.2008.00523.x
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- Article
PATTERNED COPPER PLATING LAYER THICKNESS MADE UNIFORM BY PLACEMENT OF AUXILIARY GRID ELECTRODE ABOUT BALL GRID ARRAYS.
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- Chemical Engineering Communications, 2006, v. 193, n. 12, p. 1503, doi. 10.1080/00986440600584052
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- Article
SIMULTANEOUS ESCAPE ROUTING USING NETWORK FLOW OPTIMIZATION.
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- Malaysian Journal of Computer Science, 2016, v. 29, n. 2, p. 86, doi. 10.22452/mjcs.vol29no2.2
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- Article
Assessment of the Fatigue Parameters from Random Vibration Testing: Application to a Rivet Joint.
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- Journal of Mechanical Engineering / Strojniški Vestnik, 2016, v. 62, n. 7/8, p. 471, doi. 10.5545/sv-jme.2016.3774
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PRODUCT PICKS.
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- 2012
- Publication type:
- Product Review
Impact of processing conditions and solder materials on surface mount assembly defects.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2011, v. 63, n. 10, p. 47, doi. 10.1007/s11837-011-0174-3
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Fatigue Life Prediction for PBGA under Random Vibration Using Updated Finite Element Models.
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- Experimental Techniques, 2016, v. 40, n. 5, p. 1421, doi. 10.1007/s40799-016-0141-6
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- Article
Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls.
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- Journal of Microelectronic & Electronic Packaging, 2021, v. 18, n. 4, p. 183, doi. 10.4071/imaps.1501802
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Head-on-Pillow Defect Detection: X-Ray Inspection Limitations.
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- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 2, p. 91, doi. 10.4071/imaps.871613
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Lattice Boltzmann Method of Different BGA Orientations on I-Type Dispensing Method.
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- PLoS ONE, 2016, v. 11, n. 7, p. 1, doi. 10.1371/journal.pone.0159357
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- Article
Topography and field effects in the inner side of microvia hole using ToF-SIMS.
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- Surface & Interface Analysis: SIA, 2014, v. 46, n. 7, p. 429, doi. 10.1002/sia.5569
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- Article
A method to determine the slip systems in BGA lead-free solder joints during thermal fatigue.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 9, p. 7501, doi. 10.1007/s10854-018-8741-9
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- Article
Effects of β-Sn grain c-axis on electromigration behavior in BGA Sn3.0Ag0.5Cu solder interconnects.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 15, p. 10785, doi. 10.1007/s10854-017-6952-0
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- Article
Column-grid-array (CGA) versus ball-grid-array (BGA): board-level drop test and the expected dynamic stress in the solder material.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 11, p. 11572, doi. 10.1007/s10854-016-5288-5
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- Article
Degradation behaviors of micro ball grid array (μBGA) solder joints under the coupled effects of electromigration and thermal stress.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 11, p. 11583, doi. 10.1007/s10854-016-5289-4
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- Article
Microstructure, mechanical and electrical performances of zirconia nanoparticles-doped tin-silver-copper solder alloys.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 7, p. 7524, doi. 10.1007/s10854-016-4732-x
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- Article
Expected stress relief in a bi-material inhomogeneously bonded assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at the ends.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 6, p. 5563, doi. 10.1007/s10854-016-4461-1
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- Article
Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with an epoxy adhesive at its ends.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4399, doi. 10.1007/s10854-016-4310-2
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- Article
The formation and conversion of intermetallic compounds in the Cu pillar Sn-Ag micro-bump with ENEPIG Cu substrate under current stressing.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 3, p. 2201, doi. 10.1007/s10854-015-4011-2
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- Article
Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package design.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 3, p. 2430, doi. 10.1007/s10854-015-4042-8
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- Article
Could thermal stresses in a BGA/CGA-system be evaluated from a model intended for a homogeneously bonded assembly?
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 1, p. 570, doi. 10.1007/s10854-015-3790-9
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- Article
Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with a low modulus solder at its ends.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 9680, doi. 10.1007/s10854-015-3635-6
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Could application of column-grid-array (CGA) technology result in inelastic-strain-free state-of-stress in solder material?
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 10062, doi. 10.1007/s10854-015-3688-6
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- Article
Size effect on interfacial reactions of Sn-3.0Ag-0.5Cu solder balls on Cu and Ni-P pads.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 2, p. 933, doi. 10.1007/s10854-014-2485-y
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Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls.
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- Quality & Reliability Engineering International, 2015, v. 31, n. 4, p. 543, doi. 10.1002/qre.1611
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Re-calibration of Engelmaier's Model for Leadless, Lead-free Solder Attachments.
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- Quality & Reliability Engineering International, 2007, v. 23, n. 4, p. 415, doi. 10.1002/qre.810
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- Article