Advanced IC packaging: Markets and trends.
- Published in:
- Solid State Technology, 2001, v. 44, n. 4, p. 44
- By:
- Publication type:
- Article
Works matching DE "BALL grid array technology"
Results: 115
1
2
A method to determine the slip systems in BGA lead-free solder joints during thermal fatigue.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 9, p. 7501, doi. 10.1007/s10854-018-8741-9
- By:
- Publication type:
- Article
3
Effects of β-Sn grain c-axis on electromigration behavior in BGA Sn3.0Ag0.5Cu solder interconnects.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 15, p. 10785, doi. 10.1007/s10854-017-6952-0
- By:
- Publication type:
- Article
4
Column-grid-array (CGA) versus ball-grid-array (BGA): board-level drop test and the expected dynamic stress in the solder material.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 11, p. 11572, doi. 10.1007/s10854-016-5288-5
- By:
- Publication type:
- Article
5
Degradation behaviors of micro ball grid array (μBGA) solder joints under the coupled effects of electromigration and thermal stress.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 11, p. 11583, doi. 10.1007/s10854-016-5289-4
- By:
- Publication type:
- Article
6
Microstructure, mechanical and electrical performances of zirconia nanoparticles-doped tin-silver-copper solder alloys.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 7, p. 7524, doi. 10.1007/s10854-016-4732-x
- By:
- Publication type:
- Article
7
Expected stress relief in a bi-material inhomogeneously bonded assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at the ends.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 6, p. 5563, doi. 10.1007/s10854-016-4461-1
- By:
- Publication type:
- Article
8
Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with an epoxy adhesive at its ends.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4399, doi. 10.1007/s10854-016-4310-2
- By:
- Publication type:
- Article
9
The formation and conversion of intermetallic compounds in the Cu pillar Sn-Ag micro-bump with ENEPIG Cu substrate under current stressing.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 3, p. 2201, doi. 10.1007/s10854-015-4011-2
- By:
- Publication type:
- Article
10
Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package design.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 3, p. 2430, doi. 10.1007/s10854-015-4042-8
- By:
- Publication type:
- Article
11
Could thermal stresses in a BGA/CGA-system be evaluated from a model intended for a homogeneously bonded assembly?
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 1, p. 570, doi. 10.1007/s10854-015-3790-9
- By:
- Publication type:
- Article
12
Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with a low modulus solder at its ends.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 9680, doi. 10.1007/s10854-015-3635-6
- By:
- Publication type:
- Article
13
Could application of column-grid-array (CGA) technology result in inelastic-strain-free state-of-stress in solder material?
- Published in:
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 10062, doi. 10.1007/s10854-015-3688-6
- By:
- Publication type:
- Article
14
Size effect on interfacial reactions of Sn-3.0Ag-0.5Cu solder balls on Cu and Ni-P pads.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 2, p. 933, doi. 10.1007/s10854-014-2485-y
- By:
- Publication type:
- Article
15
Failure behaviors of BGA solder joints under various loading conditions of high-speed shear test.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 1, p. 17, doi. 10.1007/s10854-008-9588-2
- By:
- Publication type:
- Article
16
Electrical properties and interfacial reaction of BGA package with underfill.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 1, p. 75, doi. 10.1007/s10854-007-9282-9
- By:
- Publication type:
- Article
17
AN OVERALL LTCC PACKAGE SOLUTION FOR X-BAND TILE T/R MODULE.
- Published in:
- Progress in Electromagnetics Research Letters, 2013, v. 38, p. 181, doi. 10.2528/pierl13011009
- By:
- Publication type:
- Article
18
PRODUCT PICKS.
- Published in:
- 2012
- Publication type:
- Product Review
19
Application of Contactless Testing to PCBs with BGAs and Open Sockets.
- Published in:
- Journal of Electronic Testing, 2015, v. 31, n. 4, p. 339, doi. 10.1007/s10836-015-5535-3
- By:
- Publication type:
- Article
20
SIMULTANEOUS ESCAPE ROUTING USING NETWORK FLOW OPTIMIZATION.
- Published in:
- Malaysian Journal of Computer Science, 2016, v. 29, n. 2, p. 86, doi. 10.22452/mjcs.vol29no2.2
- By:
- Publication type:
- Article
21
Detection of ball grid array solder joints based on adaptive template matching.
- Published in:
- International Journal of Heat & Technology, 2018, v. 36, n. 1, p. 189, doi. 10.18280/ijht.360125
- By:
- Publication type:
- Article
22
Experimental determination of the cyclic strength of brazed joints.
- Published in:
- Welding International, 2011, v. 25, n. 4, p. 326, doi. 10.1080/09507116.2010.540889
- By:
- Publication type:
- Article
23
The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing.
- Published in:
- Journal of Electronic Materials, 2019, v. 48, n. 5, p. 2770, doi. 10.1007/s11664-018-06907-8
- By:
- Publication type:
- Article
24
Superior Reliability of SAC105 Solder on BGA Package Pad with NiPdAu Coating.
- Published in:
- Journal of Electronic Materials, 2019, v. 48, n. 1, p. 1, doi. 10.1007/s11664-018-6515-z
- By:
- Publication type:
- Article
25
Effects of System Design on Fatigue Life of Solder Joints in BGA Packages Under Vibration at Random Frequencies.
- Published in:
- Journal of Electronic Materials, 2018, v. 47, n. 11, p. 6781, doi. 10.1007/s11664-018-6600-3
- By:
- Publication type:
- Article
26
Recrystallization Behavior in Mixed Solder Joints of BGA Components during Thermal Shock.
- Published in:
- Journal of Electronic Materials, 2018, v. 47, n. 7, p. 4156, doi. 10.1007/s11664-018-6124-x
- By:
- Publication type:
- Article
27
Recrystallization Behavior in SAC305 and SAC305 + 3.0POSS Solder Joints Under Thermal Shock.
- Published in:
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2479, doi. 10.1007/s11664-017-6032-5
- By:
- Publication type:
- Article
28
The Influence of Primary CuSn Size on the Shear Impact Properties of Sn-Cu/Cu BGA Joints.
- Published in:
- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 84, doi. 10.1007/s11664-017-5763-7
- By:
- Publication type:
- Article
29
Impact of Isothermal Aging and Testing Temperature on Large Flip-Chip BGA Interconnect Mechanical Shock Performance.
- Published in:
- Journal of Electronic Materials, 2017, v. 46, n. 10, p. 6224, doi. 10.1007/s11664-017-5650-2
- By:
- Publication type:
- Article
30
Effects of Micro Solder Joint Geometry on Interfacial IMC Growth Rate.
- Published in:
- Journal of Electronic Materials, 2017, v. 46, n. 7, p. 4034, doi. 10.1007/s11664-017-5344-9
- By:
- Publication type:
- Article
31
Effect of Electromigration on the Type of Drop Failure of Sn-3.0Ag-0.5Cu Solder Joints in PBGA Packages.
- Published in:
- Journal of Electronic Materials, 2015, v. 44, n. 10, p. 3927, doi. 10.1007/s11664-015-3856-8
- By:
- Publication type:
- Article
32
Effect of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Sn-Ag-Cu and Sn-Ag Solder Interconnects With and Without Board-Side Ni Surface Finish.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4126, doi. 10.1007/s11664-014-3315-y
- By:
- Publication type:
- Article
33
Interfacial Reaction Between Sn3.0Ag0.5Cu Solder and ENEPIG for Fine Pitch BGA by Stencil Printing.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 9, p. 3341, doi. 10.1007/s11664-014-3236-9
- By:
- Publication type:
- Article
34
Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 671, doi. 10.1007/s11664-013-2669-x
- By:
- Publication type:
- Article
35
Fracture Behaviors of Sn-Cu Intermetallic Compound Layer in Ball Grid Array Induced by Thermal Shock.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 2, p. 567, doi. 10.1007/s11664-013-2845-z
- By:
- Publication type:
- Article
36
Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections. Part 1: Effects of Test Parameters.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1171, doi. 10.1007/s11664-013-2551-x
- By:
- Publication type:
- Article
37
Impact of Electrical Current on the Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 4, p. 599, doi. 10.1007/s11664-012-2292-2
- By:
- Publication type:
- Article
38
Effects of Surface Finishes and Current Stressing on Interfacial Reaction Characteristics of Sn-3.0Ag-0.5Cu Solder Bumps.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 791, doi. 10.1007/s11664-011-1888-2
- By:
- Publication type:
- Article
39
Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 253, doi. 10.1007/s11664-011-1732-8
- By:
- Publication type:
- Article
40
Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 390, doi. 10.1007/s11664-011-1763-1
- By:
- Publication type:
- Article
41
Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 273, doi. 10.1007/s11664-011-1775-x
- By:
- Publication type:
- Article
42
Localized Recrystallization Induced by Subgrain Rotation in Sn-3.0Ag-0.5Cu Ball Grid Array Solder Interconnects During Thermal Cycling.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2470, doi. 10.1007/s11664-011-1782-y
- By:
- Publication type:
- Article
43
Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2425, doi. 10.1007/s11664-011-1760-4
- By:
- Publication type:
- Article
44
A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2314, doi. 10.1007/s11664-011-1738-2
- By:
- Publication type:
- Article
45
Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1967, doi. 10.1007/s11664-011-1702-1
- By:
- Publication type:
- Article
46
Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2588, doi. 10.1007/s11664-010-1348-4
- By:
- Publication type:
- Article
47
Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2564, doi. 10.1007/s11664-010-1352-8
- By:
- Publication type:
- Article
48
Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2669, doi. 10.1007/s11664-010-1380-4
- By:
- Publication type:
- Article
49
Microstructural Analysis of Reballed Tin-Lead, Lead-Free, and Mixed Ball Grid Array Assemblies Under Temperature Cycling Test.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 8, p. 1218, doi. 10.1007/s11664-010-1209-1
- By:
- Publication type:
- Article
50
Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 200, doi. 10.1007/s11664-009-0959-0
- By:
- Publication type:
- Article