Works matching DE "ANTIMONY-tin alloys"
Results: 11
Nanoparticles of IrO or Sb-SnO increase the performance of iridium oxide DSA electrodes.
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- Journal of Materials Science, 2012, v. 47, n. 3, p. 1135, doi. 10.1007/s10853-011-5958-x
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Enhanced Electrochemical Performance of a Tin−antimony Alloy/N‐Doped Carbon Nanocomposite as a Sodium‐Ion Battery Anode.
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- ChemElectroChem, 2018, v. 5, n. 2, p. 391, doi. 10.1002/celc.201700828
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Effects of annealing temperature on structural, optical, and electrical properties of antimony-doped tin oxide thin films.
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- Philosophical Magazine Letters, 2010, v. 90, n. 5, p. 337, doi. 10.1080/09500831003662529
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Effect of Homogenization on the Indentation Creep of Cast Lead-Free Sn-5%Sb Solder Alloy.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1703, doi. 10.1007/s11664-007-0275-5
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Preparation of electrically conductive fibres by new surface coating method.
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- Materials Science & Technology, 2006, v. 22, n. 12, p. 1469, doi. 10.1179/174328406X109195
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The Effects of Antimony Addition on the Microstructural, Mechanical, and Thermal Properties of Sn-3.0Ag-0.5Cu Solder Alloy.
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- Metallurgical & Materials Transactions. Part A, 2018, v. 49, n. 2, p. 652, doi. 10.1007/s11661-017-4439-5
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Electrical conductivity and viscosity of liquid Sn-Sb-Cu alloys.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 6, p. 631, doi. 10.1007/s10854-010-0188-6
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- Article
Microstructural Evolution and Mechanical Properties of an Advanced γ-TiAl Based Alloy Processed by Spark Plasma Sintering.
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- Materials (1996-1944), 2019, v. 12, n. 9, p. 1523, doi. 10.3390/ma12091523
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Effect of Multi-Directional Forging on the Microstructure and Mechanical Properties of β-Solidifying TiAl Alloy.
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- Materials (1996-1944), 2019, v. 12, n. 9, p. 1381, doi. 10.3390/ma12091381
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Interfacial Bonding Energy on the Interface between ZChSnSb/Sn Alloy Layer and Steel Body at Microscale.
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- Materials (1996-1944), 2017, v. 10, n. 10, p. 1128, doi. 10.3390/ma10101128
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Viscosity of Sb-Sn melts.
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- Inorganic Materials, 2010, v. 46, n. 8, p. 833, doi. 10.1134/S0020168510080054
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- Article