Advances in WLCSP Technologies to Enable Cost Reduction.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2010, v. 7, n. 3, p. 160, doi. 10.4071/imaps.268
- By:
- Publication type:
- Article
Works matching DE "AMKOR Technology Inc."
Results: 11
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Amkor knocks down back-end operation costs.
- Published in:
- Solid State Technology, 2001, v. 44, n. 11, p. 24
- By:
- Publication type:
- Article
3
Higher-density packaging innovations continue.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 28
- By:
- Publication type:
- Article
4
Amkor's experiences with factory opportunities in China.
- Published in:
- Solid State Technology, 2001, v. 44, n. 8, p. S25
- By:
- Publication type:
- Article
5
Chipmakers to compete with assembly houses for SiP.
- Published in:
- Solid State Technology, 2001, v. 44, n. 7, p. 51
- Publication type:
- Article
6
Japan.
- Published in:
- Solid State Technology, 2001, v. 44, n. 2, p. 26
- Publication type:
- Article
7
Tech Briefs.
- Published in:
- Solid State Technology, 2000, v. 43, n. 5, p. 36
- Publication type:
- Article
8
ASIA PACIFIC.
- Published in:
- Solid State Technology, 2000, v. 43, n. 5, p. 28
- Publication type:
- Article
9
Quarterly Briefs.
- Published in:
- Solid State Technology, 1999, v. 42, n. 10, p. 20
- Publication type:
- Article
10
Asia/Pacific.
- Published in:
- Solid State Technology, 1999, v. 42, n. 2, p. 16
- Publication type:
- Article
11
Industry Updates.
- Published in:
- Journal of Failure Analysis & Prevention, 2012, v. 12, n. 1, p. 41, doi. 10.1007/s11668-011-9529-x
- Publication type:
- Article