Works matching DE "ALUMINUM nitride"

Results: 1249

Design of AlN-Based PMUT with High Electromechanical Coupling Efficiency for Breast Cancer Diagnosis.

Published in:

International Journal of Engineering & Technology Innovation, 2025, v. 15, n. 2, p. 210, doi. 10.46604/ijeti.2024.14017

By:

Chang Liu;
Yijun Cheng;
Chenyang Xue

Publication type:

Article

Optimal Selection and Experimental Verification of Wide-Bandgap Semiconductor for Betavoltaic Battery.

Published in:

Nanomaterials (2079-4991), 2025, v. 15, n. 9, p. 635, doi. 10.3390/nano15090635

By:

Zhang, Jiachen;
Lv, Kunlun;
Yin, Yuan;
Gao, Yuqian;
Tian, Ye;
Han, Yuncheng;
Tang, Jun

Publication type:

Article

AlCoCrFeNiTi0.2 High-Entropy Alloy Under Plasma Nitriding: Complex Microstructure Transformation, Mechanical and Tribological Enhancement.

Published in:

Metallurgical & Materials Transactions. Part A, 2025, v. 56, n. 6, p. 2040, doi. 10.1007/s11661-025-07752-1

By:

Włoczewski, Mateusz;
Jasiewicz, Kinga;
Jenczyk, Piotr;
Gadalińska, Elżbieta;
Kulikowski, Krzysztof;
Zhang, Yong;
Li, Rui Xuan;
Jarząbek, Dariusz M.

Publication type:

Article

The Effects of Ceramic Substrate Materials on Thermoelectric Generator Performance.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 6, p. 4449, doi. 10.1007/s11664-025-11855-1

By:

Fagehi, Hassan

Publication type:

Article

Evaluation of plasma nitriding process in the wear resistance of 7075 aluminum alloy.

Published in:

Tecnologia em Metalurgia, Materiais e Mineração, 2024, v. 21, p. 1, doi. 10.4322/2176-1523.20243029

By:

Galvão Camarinha, Maria Gabriela;
Oliveira Rocha, Leticia;
Ribeiro Barboza, Miguel Justino;
Valdete Martins, Gislene;
Massi, Marcos;
Soares Silva, Argemiro;
Gonçalves Leite, Douglas Marcel;
Pereira Reis, Danieli Aparecida

Publication type:

Article

Plasmonic Metamaterial's Light Trapping Enhancement of Ultrathin PbS-CQD Solar Thermal PV Cells.

Published in:

Plasmonics, 2025, v. 20, n. 5, p. 2443, doi. 10.1007/s11468-024-02458-3

By:

Baitiche, Oussama;
Bendelala, Fathi;
Cheknane, Ali;
Costa, Filippo;
Hilal, Hikmat S.;
Nunzi, Jean-Michel;
Younes, Khadidja

Publication type:

Article

Unprecedented enhancement of piezoelectricity of wurtzite nitride semiconductors via thermal annealing.

Published in:

Nature Communications, 2025, v. 15, n. 1, p. 1, doi. 10.1038/s41467-025-59179-2

By:

Mondal, Shubham;
Tanim, Md Mehedi Hasan;
Baucom, Garrett;
Dabas, Shaurya S.;
Gao, Jinghan;
Liu, Jiangnan;
Ye, Zhengwei;
Gaddam, Venkateswarlu;
Ross, Aiden;
Chen, Long-Qing;
Kim, Honggyu;
Tabrizian, Roozbeh;
Mi, Zetian

Publication type:

Article

Thermally Conductive EMC (Epoxy Molding Compound) for Microelectronic Encapsulation.

Published in:

Polymer Engineering & Science, 1999, v. 39, n. 4, p. 756, doi. 10.1002/pen.11464

By:

Kim, Wonho;
Bae, Jong-Woo

Publication type:

Article

Tribological CCF-PEEK transfer film growth on cutting tool coating.

Published in:

Surface Engineering, 2022, v. 38, n. 4, p. 402, doi. 10.1080/02670844.2022.2095955

By:

Dong, Xin;
Dong, Chaoyang;
Zhao, Chunyue;
Wu, Bo

Publication type:

Article

Effects of coating cycles on spin-coated indium nitride thin films.

Published in:

Surface Engineering, 2018, v. 34, n. 7, p. 554, doi. 10.1080/02670844.2017.1376832

By:

Lee, Zhi Yin;
Ng, Sha Shiong;
Yam, Fong Kwong;
Hassan, Zainuriah

Publication type:

Article

Effects of temperature on PO and resistivity of ScAlN film.

Published in:

Surface Engineering, 2015, v. 31, n. 10, p. 775, doi. 10.1179/1743294415Y.0000000040

By:

Yang, YX.;
Li, XM.;
Zhou, D.;
Yang, CT.;
Feng, F.;
Yang, JS.;
Hu, QJ.

Publication type:

Article

Deposition of AlN on Nimonic 75 by PFD device.

Published in:

Surface Engineering, 2015, v. 31, n. 4, p. 265, doi. 10.1179/1743294415Y.0000000008

By:

Laktarashi, A.;
Habibi, M.;
Bordbar, S.

Publication type:

Article

Tribological improvement of titanium alloy surfaces through texturing and TiAlN coating.

Published in:

Surface Engineering, 2014, v. 30, n. 10, p. 758, doi. 10.1179/1743294414Y.0000000293

By:

Prem Ananth, M.;
Ramesh, R.

Publication type:

Article

Studies on thermal shock resistance of TiN and TiAlN coatings under pulsed laser irradiation.

Published in:

Surface Engineering, 2014, v. 30, n. 3, p. 195, doi. 10.1179/1743294413Y.0000000236

By:

Deng, J.;
Li, S.;
Xing, Y.;
Li, Y.

Publication type:

Article

Multiphase films bearing Ti2AlN by pulse plasma hollow cathode nitriding.

Published in:

Surface Engineering, 2013, v. 29, n. 5, p. 336, doi. 10.1179/1743294413Y.0000000124

By:

Cong, T;
Yan, M F;
Liu, R L

Publication type:

Article

Effect of deposition parameters on TiAlN coating using pulsed DC CFUBMS.

Published in:

Surface Engineering, 2013, v. 29, n. 4, p. 287, doi. 10.1179/1743294412Y.0000000091

By:

Mandal, P;
Beake, B D;
Paul, S

Publication type:

Article

Tribological behaviour of CrAlN coatings at 600°C.

Published in:

Surface Engineering, 2013, v. 29, n. 4, p. 318, doi. 10.1179/1743294412Y.0000000100

By:

Yu, C Y;
Wang, S B;
Li, T B;
Zhang, Z X

Publication type:

Article

Microstructure and nanoindentation hardness of TiN/AlN multilayer films prepared by pulsed laser deposition.

Published in:

Surface Engineering, 2012, v. 28, n. 3, p. 165, doi. 10.1179/026708410X12786785573238

By:

Tang, P H;
Song, R G;
Chai, G Z;
Mao, J

Publication type:

Article

Morphological investigation of aluminium nitride films on various substrates for MEMS applications.

Published in:

Surface Engineering, 2009, v. 25, n. 7, p. 526, doi. 10.1179/174329408X326407

By:

Kar, J. P.;
Bose, G.;
Tuli, S.;
Myoung, J. M.;
Mukherjee, S.

Publication type:

Article

Process–microstructure–properties relationship during formation of AlN layers by physical vapour deposition.

Published in:

Surface Engineering, 2006, v. 22, n. 2, p. 109, doi. 10.1179/174329406X98449

By:

Figueroa, U.;
Salas, O.;
Oseguera, J.

Publication type:

Article

Miniaturization of CPW‐Fed Patch Antenna by Using Dielectric Materials for 2.4 GHz (WLAN/ISM) Applications.

Published in:

Macromolecular Symposia, 2021, v. 397, n. 1, p. 1, doi. 10.1002/masy.202100008

By:

Singh, Sandeep Kr.;
Sharan, Tripurari;
Singh, Arvind Kr.

Publication type:

Article

High Dielectric Thermal Conductivity Polyvinylidene Fluoride Composites Based on Surface‐Modified Graphene Nanosheets and Aluminum Nitride.

Published in:

Macromolecular Chemistry & Physics, 2024, v. 225, n. 18, p. 1, doi. 10.1002/macp.202400020

By:

Zhao, Mengen;
Wang, Haijun;
Liu, Kun;
Wu, Yao;
Yuan, Chunlei

Publication type:

Article

High-Speed and Low-Energy Nitride Memristors.

Published in:

Advanced Functional Materials, 2016, v. 26, n. 29, p. 5290, doi. 10.1002/adfm.201600680

By:

Choi, Byung Joon;
Torrezan, Antonio C.;
Strachan, John Paul;
Kotula, P. G.;
Lohn, A. J.;
Marinella, Matthew J.;
Li, Zhiyong;
Williams, R. Stanley;
Yang, J. Joshua

Publication type:

Article

High-quality AlN growth: a detailed study on ammonia flow.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 4, p. 1, doi. 10.1007/s10854-022-09556-0

By:

Yolcu, Gamze;
Koçak, Merve Nur;
Ünal, Dudu Hatice;
Altuntas, Ismail;
Horoz, Sabit;
Demir, Ilkay

Publication type:

Article

Electrical and structural comparison of (100) and (002) oriented AlN thin films deposited by RF magnetron sputtering.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 15, p. 12271, doi. 10.1007/s10854-022-08186-w

By:

Bakri, A. S.;
Nafarizal, N.;
Abu Bakar, A. S.;
Megat Hasnan, M. M. I.;
Raship, N. A.;
Wan Omar, W. I.;
Azman, Z.;
Mohamed Ali, R. A.;
Majid, W. H. Abd;
Ahmad, M. K.;
Aldalbahi, A.

Publication type:

Article

A new transient liquid phase bonding method using magnesium foil to bond copper plates to aluminum nitride substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10486, doi. 10.1007/s10854-022-08035-w

By:

Takakuwa, Satoshi;
Terasaki, Nobuyuki;
Kon, Naochika;
Ohashi, Touyou;
Nita, Nobuyasu;
Nagatomo, Yoshiyuki;
Kuromitsu, Yoshirou

Publication type:

Article

Influence of composition ratio on the thermal performance of AlNB nanocomposite for an efficient heat spreading in solid-state lighting package (LED).

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 4, p. 2183, doi. 10.1007/s10854-021-07425-w

By:

El-ladan, Abdulkarim Hamza;
Subramani, Shanmugan

Publication type:

Article

Study of the radiation disordering mechanisms of AlN ceramic structure as a result of helium swelling.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 16, p. 21658, doi. 10.1007/s10854-021-06684-x

By:

Kozlovskiy, A. L.;
Zdorovets, M. V.

Publication type:

Article

Study of radiation resistance to helium swelling of AlN ceramics in case of irradiation with low-energy He2+ ions with energy of 40 keV.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 11, p. 14347, doi. 10.1007/s10854-021-05997-1

By:

Kozlovskiy, A. L.;
Kenzhina, I. E.;
Zdorovets, M. V.

Publication type:

Article

Microstructure and bending piezoelectric characteristics of AlN film for high-frequency flexible SAW devices.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 10, p. 13146, doi. 10.1007/s10854-021-05830-9

By:

Li, Kaixuan;
Wang, Fang;
Deng, Meng;
Hu, Kai;
Song, Dianyou;
Hao, Yaowu;
Di, Huanhuan;
Dong, Kaifei;
Yan, Shuo;
Song, Zhitang;
Zhang, Kailiang

Publication type:

Article

Development of AlNB alloy in (Al/AlN/B) stacking sequence using RF reactive sputtering towards thermal management application.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 1, p. 577, doi. 10.1007/s10854-020-04840-3

By:

El-ladan, Abdulkarim Hamza;
Subramani, Shanmugan

Publication type:

Article

Effect of growth and residual stress in AlN (0002) thin films on MEMS accelerometer design.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 20, p. 17281, doi. 10.1007/s10854-020-04282-x

By:

Gupta, Nidhi;
Dutta, Shankar;
Pandey, Akhilesh;
Vanjari, Siva Rama Krishna;
Kaur, Davinder

Publication type:

Article

Study of hydrogenation processes in radiation-resistant nitride ceramics.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 14, p. 11227, doi. 10.1007/s10854-020-03671-6

By:

Kozlovskiy, A. L.;
Zdorovets, M. V.

Publication type:

Article

Silver diffusion effects in aluminum nitride/silver films on polydimethylsiloxane gratings via nitrogen–argon sputtering.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 9, p. 6861, doi. 10.1007/s10854-020-03246-5

By:

Loh, Joel Yi Yang;
Kherani, Nazir P.

Publication type:

Article

Microstructure characterization of Al2O3–Mullite–AlN multiphase ceramic film on Cr/WCu substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 8, p. 5941, doi. 10.1007/s10854-020-03162-8

By:

Zhu, Jiandong;
Zheng, Zhen;
Wang, Chunqing;
Liu, Jianguo

Publication type:

Article

Thermal annealing of AlN films for piezoelectric applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 6, p. 4473, doi. 10.1007/s10854-020-02984-w

By:

Herth, Etienne;
Fall, Dame;
Rauch, Jean-Yves;
Mourtalier, Virginie;
Guisbiers, Grégory

Publication type:

Article

Researches on silane coupling agent treated AlN ceramic powder and fabrication of AlN/PTFE composites for microwave substrate applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 22, p. 20189, doi. 10.1007/s10854-019-02402-w

By:

Wang, Hanyu;
Yuan, Ying;
Chi, Zhifeng;
Yang, Zhengyi;
Li, Enzhu;
Tang, Bin

Publication type:

Article

The investigation of various type irradiation effects on aluminum nitride ceramic.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 9, p. 8777, doi. 10.1007/s10854-019-01202-6

By:

Dukenbayev, K.;
Kozlovskiy, A.;
Alyamova, Z. A.;
Gladkikh, T.;
Kenzhina, I.;
Zdorovets, M.

Publication type:

Article

A new method for liquid-phase bonding of copper plates to aluminum nitride (AlN) substrates used in high-power modules.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 7, p. 6552, doi. 10.1007/s10854-019-00961-6

By:

Terasaki, Nobuyuki;
Ohashi, Touyou;
Nagatomo, Yoshiyuki;
Kuromitsu, Yoshirou;
Shirzadi, Amir A.

Publication type:

Article

Fabrication, characterization and electrochemical simulation of AlN-gate ISFET pH sensor.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 7, p. 7163, doi. 10.1007/s10854-019-01033-5

By:

Sinha, Soumendu;
Mukhiya, Ravindra;
Sharma, Rishi;
Khanna, P. K.;
Khanna, V. K.

Publication type:

Article

X-ray analysis for micro-structure of AlN/GaN multiple quantum well systems.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 1, p. 499, doi. 10.1007/s10854-018-0315-3

By:

Liubchenko, Oleksii I.;
Kladko, Vasyl P.;
Sabov, Tomash M.;
Dubikovskyi, Oleksandr V.

Publication type:

Article

The effect of Mg(NO3)2 addition on the formation of AlN nanowire by direct nitridation.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 24, p. 20688, doi. 10.1007/s10854-018-0208-5

By:

Kurtuldu, Fatih;
Gökçe, Azim;
Kurt, Ali Osman

Publication type:

Article

Electrical characteristics of atomic layer deposited AlN on n-InP.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 20, p. 17508, doi. 10.1007/s10854-018-9851-0

By:

Kim, Hogyoung;
Kim, Nam Do;
An, Sang Chul;
Choi, Byung Joon

Publication type:

Article

Research on hydrophobicity treatment of aluminum nitride powder and the fabrication and characterization of AlN/PTFE composite substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 17, p. 14890, doi. 10.1007/s10854-018-9627-6

By:

Yuan, Ying;
Chi, Zhifeng;
Tang, Bin;
Li, Enzhu;
Zhang, Shuren

Publication type:

Article

Enhanced SAW characteristics of <italic>a</italic>-plane AlN epitaxial films using ZnO buffer layer.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 5, p. 3912, doi. 10.1007/s10854-017-8330-3

By:

Fu, Sulei;
Li, Qi;
Wang, Minjuan;
Song, Cheng;
Zeng, Fei;
Pan, Feng

Publication type:

Article

The sputtering of AlN films on top of on- and off-axis 3C-SiC (111)/Si (111) substrates at various substrate temperatures.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 3, p. 2434, doi. 10.1007/s10854-017-8163-0

By:

Iqbal, A.;
Walker, G.;
Hold, L.;
Fernandes, A.;
Tanner, P.;
Iacopi, A.;
Mohd-Yasin, F.

Publication type:

Article

Comprehensive characterization of PVDF-TrFE thin films for microelectromechanical system applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 21, p. 15877, doi. 10.1007/s10854-017-7482-5

By:

Toprak, Alperen;
Tigli, Onur

Publication type:

Article

Novel single-host AlSiCN: Mn white phosphors for field emission displays.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 12, p. 8405, doi. 10.1007/s10854-017-6558-6

By:

YuWen, Minghua;
Liu, Jiaqing;
Xia, Chao;
Liu, Ze;
Yu, Caiyan;
Li, Huili

Publication type:

Article

Effect of NHF additive on purification of AlN ceramics.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 9, p. 6731, doi. 10.1007/s10854-017-6368-x

By:

Wang, Dandan;
Wang, Chuanbin;
Li, Meijuan;
Shen, Qiang;
Zhang, Lianmeng

Publication type:

Article

Deposition of highly c-axis-oriented ScAlN thin films at different sputtering power.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 7, p. 5512, doi. 10.1007/s10854-016-6213-7

By:

Tang, Jialin;
Niu, Dongwei;
Tai, Zhiwei;
Hu, Xianwei

Publication type:

Article