Works about ALLOY plating
1
- 2025
- Tang, Yaqi;
- Luo, Gang;
- Liu, Huashu;
- Wan, Hao;
- Pan, Silin
- Case Study
2
- Russian Physics Journal, 2025, v. 68, n. 2, p. 229, doi. 10.1007/s11182-025-03423-1
- Zelepugin, S. A.;
- Skripnyak, V. V.;
- Skripnyak, V. A.;
- Kirushkin, A. E.
- Article
3
- Surface Engineering, 2022, v. 38, n. 6, p. 633, doi. 10.1080/02670844.2022.2151335
- Nguyen, Yen Ngoc;
- Yoon, Jisun;
- Shin, Jiyeon;
- Son, Injoon
- Article
4
- Surface Engineering, 2020, v. 36, n. 9, p. 990, doi. 10.1080/02670844.2020.1730628
- Article
5
- Surface Engineering, 2019, v. 35, n. 12, p. 1048, doi. 10.1080/02670844.2019.1598024
- Ning, Dongdong;
- Zhang, Ao;
- Wu, Hui
- Article
6
- Surface Engineering, 2019, v. 35, n. 12, p. 1088, doi. 10.1080/02670844.2019.1644914
- Jesmani, Seyed Mohammad;
- Amini, Rasool;
- Abdollah-Pour, Hassan;
- Mohammadian-Semnani, Hamidreza
- Article
7
- Surface Engineering, 2019, v. 35, n. 12, p. 1081, doi. 10.1080/02670844.2019.1639320
- Manolova, Mila;
- Böck, Reinhard;
- Scharf, Ingolf;
- Mehner, Thomas;
- Lampke, Thomas
- Article
8
- Surface Engineering, 2019, v. 35, n. 10, p. 854, doi. 10.1080/02670844.2018.1495415
- Katırcı, Ramazan;
- Walls, John Michael
- Article
9
- Surface Engineering, 2019, v. 35, n. 7, p. 578, doi. 10.1080/02670844.2018.1547246
- Zhang, Ruiyu;
- Li, Zili;
- Yu, Xin;
- Cui, Gan
- Article
10
- Surface Engineering, 2017, v. 33, n. 2, p. 94, doi. 10.1080/02670844.2015.1122140
- Sajjadnejad, M.;
- Omidvar, H.;
- Javanbakht, M.
- Article
11
- Surface Engineering, 2015, v. 31, n. 6, p. 406, doi. 10.1179/1743294414Y.0000000392
- Sun, J.;
- Du, D. X.;
- Lv, H. F.;
- Zhou, L.;
- Wang, Y. G.;
- Qi, C. G.
- Article
12
- Surface Engineering, 2015, v. 31, n. 6, p. 439, doi. 10.1179/1743294414Y.0000000404
- Rafiee, A.;
- Raeissi, K.;
- Golozar, M. A.
- Article
13
- Surface Engineering, 2014, v. 30, n. 9, p. 643, doi. 10.1179/1743294414Y.0000000302
- Zieliński, A.;
- Antoniuk, P.;
- Krzysztofowicz, K.
- Article
14
- Surface Engineering, 2014, v. 30, n. 1, p. 59, doi. 10.1179/1743294413Y.0000000198
- Gao, Y.;
- Hu, W.;
- Gao, X.;
- Duan, B.
- Article
15
- Surface Engineering, 2013, v. 29, n. 10, p. 743, doi. 10.1179/1743294413Y.0000000159
- Yu, Y. D.;
- Zhao, X. X.;
- Li, M. G.;
- Wei, G. Y.;
- Sun, L. X.;
- Fu, Y.
- Article
16
- Surface Engineering, 2013, v. 29, n. 1, p. 6, doi. 10.1179/1743294412Y.0000000079
- Wang, H Z;
- Song, Y;
- Zhang, Z X;
- Yao, S W;
- Zhang, W G
- Article
17
- Surface Engineering, 2012, v. 28, n. 10, p. 725, doi. 10.1179/1743294412Y.0000000054
- Chang, L M;
- Liu, W;
- Duan, X Y;
- Xu, J Q
- Article
18
- Surface Engineering, 2012, v. 28, n. 8, p. 590, doi. 10.1179/1743294412Y.0000000023
- Gao, Y S;
- Hu, W C;
- Gao, X Q;
- Duan, B X
- Article
19
- Surface Engineering, 2012, v. 28, n. 1, p. 17, doi. 10.1179/1743294411Y.0000000029
- Yan, P;
- Deng, J X;
- Lian, Y S;
- Zhao, J;
- Chen, Z;
- Ai, X
- Article
20
- Surface Engineering, 2012, v. 28, n. 1, p. 30, doi. 10.1179/1743294411Y.0000000055
- Yu, Y D;
- Wei, G Y;
- Guo, H F;
- Lou, J W;
- Ge, H L
- Article
21
- Surface Engineering, 2011, v. 27, n. 7, p. 519, doi. 10.1179/026708410X12786785573472
- Article
22
- Surface Engineering, 2011, v. 27, n. 1, p. 42, doi. 10.1179/026708409X12490360426089
- Zhu, H;
- Huang, J F;
- Wang, Y;
- Cao, L Y;
- He, H Y;
- Wu, J P
- Article
23
- Surface Engineering, 2011, v. 27, n. 1, p. 51, doi. 10.1179/026708410X12506870724271
- Article
24
- Surface Engineering, 2011, v. 27, n. 1, p. 32, doi. 10.1179/174329409X446322
- Article
25
- Surface Engineering, 2011, v. 27, n. 1, p. 37, doi. 10.1179/174329409X451191
- Wang, Y;
- Huang, J F;
- Cao, L Y;
- Zhu, H;
- He, H Y;
- Wu, J P
- Article
26
- Surface Engineering, 2011, v. 27, n. 1, p. 1, doi. 10.1179/026708410X12736782825858
- Article
27
- Surface Engineering, 2011, v. 27, n. 1, p. 71, doi. 10.1179/174329409X433867
- Dai, P Q;
- Zhong, Y H;
- Zhou, X
- Article
28
- Surface Engineering, 2009, v. 25, n. 8, p. 597, doi. 10.1179/026708408X330649
- Article
29
- Surface Engineering, 2008, v. 24, n. 3, p. 204, doi. 10.1179/174329408X277484
- Hu, F.;
- Chan, K. C.;
- Zhou, J. E.
- Article
30
- Surface Engineering, 2008, v. 24, n. 3, p. 226, doi. 10.1179/174329408X282613
- Article
31
- Surface Engineering, 2005, v. 21, n. 2, p. 151, doi. 10.1179/174329405X40858
- Subramanian, B.;
- Jayakumar, S.;
- Jayachandran, M.;
- Jayakrishnan, S.
- Article
32
- Surface Engineering, 2004, v. 20, n. 2, p. 113, doi. 10.1179/026708404225014942
- Article
33
- Surface Engineering, 2004, v. 20, n. 2, p. 121, doi. 10.1179/026708404225010748
- Alexis, J.;
- Adrian, D.;
- Masri, T.;
- Petit, J. A.
- Article
34
- Surface Engineering, 2003, v. 19, n. 5, p. 345, doi. 10.1179/026708403225007608
- YuanGang, L.;
- Wei, Z.;
- JiuQing, L.
- Article
35
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 24, p. 28373, doi. 10.1007/s10854-021-07217-2
- Wu, Xiaoshuai;
- Xu, Jiaxiong;
- Zhuang, Chunan
- Article
36
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 21, p. 19332, doi. 10.1007/s10854-020-04467-4
- Kanthiah, Antonyraj;
- Manimaran, Ezhil Inban;
- Pactulingam, Rajesh
- Article
37
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 17, p. 14055, doi. 10.1007/s10854-020-03960-0
- Basit, Sercan;
- Birinci, Semih;
- Maraşlı, Necmettin
- Article
38
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 9, p. 6937, doi. 10.1007/s10854-020-03257-2
- Liu, Fei;
- Zhu, Kaifang;
- Cheng, Jinke
- Article
39
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 24, p. 21064, doi. 10.1007/s10854-019-02476-6
- Zhang, Qi;
- Ning, Liping;
- Wang, Caiyun;
- Wang, Min;
- Shen, Yingzhou;
- Yan, Yurong
- Article
40
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 13895, doi. 10.1007/s10854-019-01707-0
- Zhang, Junjun;
- Zhang, Dongming;
- Liu, Youzhi
- Article
41
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 6, p. 4046, doi. 10.1007/s10854-015-2943-1
- Kuru, Hilal;
- Kockar, Hakan;
- Demirbas, Ozen;
- Alper, Mursel
- Article
42
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 3, p. 1969, doi. 10.1007/s10854-014-2636-1
- Heidari, G.;
- Mousavi Khoie, S.;
- Abrishami, M.;
- Javanbakht, M.
- Article
43
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 10, p. 4483, doi. 10.1007/s10854-014-2191-9
- Karpuz, Ali;
- Kockar, Hakan;
- Alper, Mursel
- Article
44
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 414, doi. 10.1007/s10854-013-1603-6
- Peng, J.;
- Zheng, X.;
- Dai, Z.
- Article
45
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 39, doi. 10.1007/s10854-013-1546-y
- Article
46
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 6, p. 2052, doi. 10.1007/s10854-012-1055-4
- Goh, Yingxin;
- Lee, Seen;
- Haseeb, A.
- Article
47
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 12, p. 2110, doi. 10.1007/s10854-012-0709-6
- Sarac, Umut;
- Öksüzoğlu, R.;
- Baykul, M.
- Article
48
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 9, p. 1372, doi. 10.1007/s10854-011-0316-y
- Haseeb, A. S. M. A.;
- Chew, C. S.;
- Johan, Mohd Rafie
- Article
49
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 6, p. 614, doi. 10.1007/s10854-010-0186-8
- Crozier, B.;
- Liu, Q.;
- Ivey, D. G.
- Article
50
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 2, p. 193, doi. 10.1007/s10854-010-0113-z
- Huang, M.;
- Liu, Y.;
- Gao, J.
- Article