Works matching DE "ACM Research Inc."

Stress-free polishing advances copper integration with ultralow-k dielectrics.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. 101

By:

• Wang, David H.;
• Chiao, Stephen;
• Afnan, Mohammed;
• Yih, Paul;
• Rehayem, Michel

Publication type:

Article