Works matching Bonding

Results: 5000

Thermosonic Bonding of Gold Wire onto Silver Bonding Layer on the Bond Pads of Chips with Copper Interconnects.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1693, doi. 10.1007/s11664-006-0220-z

By:

Cheng-Li Chuang;
Jong-Ning Aoh

Publication type:

Article

Investigation of mycelium film as the adhesive for poplar veneer bonding: insight into interfacial bonding mechanisms.

Published in:

Wood Material Science & Engineering, 2025, v. 20, n. 1, p. 31, doi. 10.1080/17480272.2024.2321602

By:

Cheng, Yongbin;
Long, Chun;
Zhang, Mingchang;
Wang, Wang;
Sun, Wenjing

Publication type:

Article

Hydrogen Bonding vs Dihydrogen Bonding in the Air Stable Primary Phosphine ortho‐Phosphinophenol.

Published in:

European Journal of Inorganic Chemistry, 2024, v. 27, n. 25, p. 1, doi. 10.1002/ejic.202400260

By:

Stone, Alexander M.;
Golden, Andrew R.;
Daniel, Shan M.;
Rheingold, Arnold L.;
Protasiewicz, John D.

Publication type:

Article

Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application.

Published in:

Nanomaterials (2079-4991), 2023, v. 13, n. 17, p. 2490, doi. 10.3390/nano13172490

By:

Huang, Yuan-Chiu;
Lin, Yu-Xian;
Hsiung, Chien-Kang;
Hung, Tzu-Heng;
Chen, Kuan-Neng

Publication type:

Article

No-primer adhesive vs. self-adhesive resin: bonding strength following LED curing.

Published in:

Journal of Orofacial Orthopedics/Fortschritte der Kieferorthopadie, 2022, v. 83, n. 2, p. 141, doi. 10.1007/s00056-021-00340-z

By:

Atik, Ezgi;
Kızılırmak, Mustafa;
Akcan, Cenk Ahmet;
Taner, Tülin

Publication type:

Article

Computational insights into halogen bonding between P&bond;Cl contact and several electron donors.

Published in:

International Journal of Quantum Chemistry, 2010, v. 110, n. 6, p. 1245, doi. 10.1002/qua.22228

By:

Xu, Lin;
Zou, Jian‐Wei;
Yu, Qing‐Sen;
Sang, Peng

Publication type:

Article

Some thoughts on bondability and strength of gold wire bonding.

Published in:

Gold Bulletin, 2012, v. 45, n. 3, p. 115, doi. 10.1007/s13404-012-0060-y

By:

Zulkifli, Muhammad;
Abdullah, Shahrum;
Othman, Norinsan;
Jalar, Azman

Publication type:

Article

Ultrasonic bonding of Cu/Ni and its thermal reliability.

Published in:

Welding International, 2015, v. 29, n. 4, p. 270, doi. 10.1080/09507116.2014.921047

By:

Tanaka, Yo;
Fujiwara, Shinichi;
Ogura, Tomo;
Sano, Tomokazu;
Hirose, Akio

Publication type:

Article

Comparison of shear bond strength and bonding time of a novel flash-free bonding system.

Published in:

Angle Orthodontist, 2016, v. 86, n. 2, p. 265, doi. 10.2319/011715-37.1

By:

Moonyoung Lee;
Kanavakis, Georgios

Publication type:

Article

Comparison of Bonding Time and Shear Bond Strength Between a Conventional and a New Integrated Bonding System.

Published in:

Angle Orthodontist, 2005, v. 75, n. 2, p. 237

By:

Bishara, Samir E.;
Oonsombat, Charuphan;
Soliman, Manal M. A.;
Warren, John J.;
Latfoon, John F.;
Ajiouni, Raed

Publication type:

Article

Highly Active Halogen Bonding and Chalcogen Bonding Chloride Transporters with Non‐Protonophoric Activity.

Published in:

Chemistry - A European Journal, 2021, v. 27, n. 45, p. 11738, doi. 10.1002/chem.202101681

By:

Bickerton, Laura E.;
Docker, Andrew;
Sterling, Alistair J.;
Kuhn, Heike;
Duarte, Fernanda;
Beer, Paul D.;
Langton, Matthew J.

Publication type:

Article

Modelling and analysis of the bonding mechanism of CBN grains for electroplated superabrasive tools-part 1: introduction and application of a novel approach for determining the bonding force and the failure modes.

Published in:

International Journal of Advanced Manufacturing Technology, 2015, v. 76, n. 9-12, p. 2051, doi. 10.1007/s00170-014-6411-5

By:

Li, Xuekun;
Wolf, Sebastian;
Zhu, Tianxing;
Zhi, Geng;
Rong, Yiming (Kevin)

Publication type:

Article

Al-Ge Diffusion Bonding for Hermetic Sealing Application.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2387, doi. 10.1007/s11664-015-3683-y

By:

Chidambaram, Vivek;
Wickramanayaka, Sunil

Publication type:

Article

Diffusion bonding systems.

Published in:

Materialwissenschaft und Werkstoffechnik, 2014, v. 45, n. 9, p. 807, doi. 10.1002/mawe.201400285

By:

Jahn, S.;
Sändig, S.;
Dahms, S.;
Gemse, F.

Publication type:

Article

Development of Bonding Mechanisms for Different Materials During Forming.

Published in:

Metallurgist, 2017, v. 60, n. 11/12, p. 1175, doi. 10.1007/s11015-017-0424-x

By:

Bogatov, A.;
Salikhyanov, D.

Publication type:

Article

Taking the halogen bonding-hydrogen bonding competition one step further: complexes of difluoroiodomethane with trimethylphosphine, dimethyl sulfide and chloromethane.

Published in:

Acta Crystallographica Section B: Structural Science, Crystal Engineering & Materials, 2017, v. 73, n. 2, p. 168, doi. 10.1107/S2052520617001354

By:

Geboes, Yannick;
De Proft, Frank;
Herrebout, Wouter A.

Publication type:

Article

Exploring Chemical Catalytic Mechanisms for Enhancing Bonding Energy in Direct Silicon Dioxide Wafer Bonding.

Published in:

Applied Sciences (2076-3417), 2025, v. 15, n. 7, p. 3883, doi. 10.3390/app15073883

By:

Calvez, Aziliz;
Larrey, Vincent;
Noël, Paul;
Rieutord, François;
Fournel, Frank

Publication type:

Article

The Role of Hydrogen Bonding and Halogen Bonding in the Polymorphic Structures of 3,5-Dibromo-2,6-diaminopyridinium Bromide.

Published in:

Journal of Chemical Crystallography, 2010, v. 40, n. 11, p. 902, doi. 10.1007/s10870-010-9760-4

By:

Haddad, Salim;
Willett, Roger;
Twamley, Brendan

Publication type:

Article

NMR and FTIR studies of coordinate-bonding and intramolecular and intermolecular hydrogen bonding in zinc(II)(3,5-diisopropylsalicylate)2.

Published in:

Journal of Coordination Chemistry, 2008, v. 61, n. 18, p. 2861, doi. 10.1080/00958970802087086

By:

Sedrakyan, Gegham Z.;
Evans, Frederick E.;
Minasyan, Seyran H.;
Tavadyan, Levon A.;
Wangila, Grant W.;
Walker, Richard B.;
Sorenson, John R. J.

Publication type:

Article

Fusible Systems for Bonding.

Published in:

Textile Chemist & Colorist, 1969, v. 1, n. 27, p. 43

By:

Smith, Delmont K.

Publication type:

Article

OPTIMAL BONDING CONDITIONS FOR DIFFUSION BONDING OF ALUMINUM METAL MATRIX COMPOSITES USING TAGUCHI BASED RESPONSE SURFACE METHODOLOGY.

Published in:

Journal of the Balkan Tribological Association, 2016, v. 22, n. 3-I, p. 2437

By:

SITTARAMANE, A.;
MAHENDRAN, G.

Publication type:

Article

Role of Thin Sn Layer for Low Temperature Al‐Al Thermo‐compression Bonding of Wafer‐Level Hermetic Sealing.

Published in:

Electronics & Communications in Japan, 2018, v. 101, n. 5, p. 33, doi. 10.1002/ecj.12060

By:

SATOH, S. H. I. R. O.;
FUKUSHI, H. I. D. E. Y. U. K. I.;
ESASHI, M. A. S. A. Y. O. S. H. I.;
TANAKA, S. H. U. J. I.

Publication type:

Article

Effect of Si Concentration of a Brazing Precursor on the Bonding Strength of Aluminum Foam Bonded via Foaming Bonding.

Published in:

Materials Transactions, 2021, v. 62, n. 8, p. 1210, doi. 10.2320/matertrans.MT-M2020393

By:

Ryosuke Suzuki;
Yoshihiko Hangai;
Yusuke Asakawa;
Ikuo Shohji;
Hidetoshi Fujii;
Masaaki Matsubara

Publication type:

Article

Geometrical Effects on Ultrasonic Al Bump Direct Bonding for Microsystem Integration: Simulation and Experiments.

Published in:

Micromachines, 2021, v. 12, n. 7, p. 750, doi. 10.3390/mi12070750

By:

Lee, Jun-Hao;
Li, Pin-Kuan;
Hung, Hai-Wen;
Chuang, Wallace;
Schellkes, Eckart;
Yasuda, Kiyokazu;
Song, Jenn-Ming

Publication type:

Article

Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding.

Published in:

Micromachines, 2020, v. 11, n. 5, p. 454, doi. 10.3390/mi11050454

By:

Yamamoto, Michitaka;
Matsumae, Takashi;
Kurashima, Yuichi;
Takagi, Hideki;
Suga, Tadatomo;
Takamatsu, Seiichi;
Itoh, Toshihiro;
Higurashi, Eiji

Publication type:

Article

Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames.

Published in:

Micromachines, 2018, v. 9, n. 4, p. 181, doi. 10.3390/mi9040181

By:

Tanaka, Koki;
Tanaka, Shuji;
Hirano, Hideki;
Kumano, Masafumi;
Froemel, Joerg

Publication type:

Article

Interfacial Bonding and Fracture Behaviors of AZ63 Magnesium Alloy Sheet Processed by Accumulative Roll Bonding.

Published in:

Materials (1996-1944), 2023, v. 16, n. 14, p. 4981, doi. 10.3390/ma16144981

By:

Guo, Junqing;
Sun, Wanting;
Xiang, Nan;
Chen, Fuxiao

Publication type:

Article

Interfacial bonding mechanism and bonding strength of AlTiCrN coating by cathodic arc ion plating.

Published in:

Surface & Interface Analysis: SIA, 2015, v. 47, n. 2, p. 198, doi. 10.1002/sia.5688

By:

Dejun, Kong;
Guizhong, Fu;
Jinchun, Wang

Publication type:

Article

Non‐Symmetrical Tetradentate Mixed Halogen Bonding‐Hydrogen Bonding Macrocycles for Anion Recognition in Aqueous‐Organic Media.

Published in:

Chemistry - An Asian Journal, 2025, v. 20, n. 11, p. 1, doi. 10.1002/asia.202401833

By:

Opascharoenboon, Somjutar;
Vigromsitdet, Sutthipoj;
Cheevathanomsak, Norraset;
Atirojwanich, Inkarat;
Tantirungrotechai, Jonggol;
Sukwattanasinitt, Mongkol;
Surawatanawong, Panida;
Beer, Paul D.;
Bunchuay, Thanthapatra

Publication type:

Article

Comparative study on the nonadditivity of methyl group in lithium bonding and hydrogen bonding.

Published in:

International Journal of Quantum Chemistry, 2009, v. 109, n. 5, p. 1127, doi. 10.1002/qua.21929

By:

Li, Qingzhong;
Cheng, Jianbo;
Li, Wenzuo;
Gong, Baoan;
Sun, Jiazhong

Publication type:

Article

σ-Hole bonding and hydrogen bonding: Competitive interactions.

Published in:

International Journal of Quantum Chemistry, 2007, v. 107, n. 15, p. 3046, doi. 10.1002/qua.21419

By:

Politzer, Peter;
Murray, Jane S.;
Lane, Pat

Publication type:

Article

Stress-enhanced Cu-to-Cu Bonding for MEMS Packaging.

Published in:

Sensors & Materials, 2018, v. 30, n. 12, Part 2, p. 2889, doi. 10.18494/SAM.2018.1948

By:

Jenn-Ming Song;
Sin-Yong Liang;
Zong-Yu Xie;
Po-Hao Chiang;
Shang-Kun Huang;
Ying-Ta Chiu;
David Tarng;
Chih-Pin Hung;
Jing-Yuan Lin

Publication type:

Article

Room-temperature Hermetic Packaging Using Ultrasonic Cu-Cu Bonding with Compliant Rim.

Published in:

Sensors & Materials, 2018, v. 30, n. 12, Part 2, p. 2897, doi. 10.18494/SAM.2018.1967

By:

Ryo Takigawa;
Keiichiro Iwanabe;
Akihiro Ikeda;
Takayuki Takao;
Tanemasa Asano

Publication type:

Article

Halogen and Hydrogen Bonding Benzothiophene Diol Derivatives: A Study Using ab initio Calculations and X-Ray Crystal Structure Measurements.

Published in:

ChemistryOpen, 2015, v. 4, n. 2, p. 161, doi. 10.1002/open.201402087

By:

Cadoni, Enzo;
Ferino, Giulio;
Pitzanti, Patrizia;
Secci, Francesco;
Fattuoni, Claudia;
Nicolò, Francesco;
Bruno, Giuseppe

Publication type:

Article

Effect of simplified ethanol-wet bonding on dentin bonding durability of etchand-rinse adhesives.

Published in:

Dental Materials Journal, 2015, v. 34, n. 4, p. 441, doi. 10.4012/dmj.2014-335

By:

YESILYURT, Cemal;
AYAR, Muhammet Kerim;
YILDIRIM, Tahsin;
AKDAG, Mustafa Sadik

Publication type:

Article

Effect of Polymerization Accelerator on Dentin Bonding of One-step Bonding Agent.

Published in:

Dental Materials Journal, 2007, v. 26, n. 1, p. 7, doi. 10.4012/dmj.26.7

By:

WAKAMATSU, Shogo;
IKEMP, Takuji

Publication type:

Article

Direct bonding of Ni nanoparticles to a semiconductor Al electrode in air and its form.

Published in:

Welding International, 2023, v. 37, n. 11, p. 666, doi. 10.1080/09507116.2023.2230657

By:

Tanaka, Yasunori;
Koshiba, Keiko;
Iizuka, Tomonori;
Ito, Mayumi;
Higashimine, Koichi;
Tatsumi, Kohei

Publication type:

Article

Interconnection reliability and interfacial structure between Au alloy bump and Al pad using ultrasonic bonding.

Published in:

Welding International, 2016, v. 30, n. 9, p. 653, doi. 10.1080/09507116.2016.1142186

By:

Fujiwara, Shinichi;
Harada, Masahide;
Fujita, Yuji

Publication type:

Article

Effects of post heat treatment on 5052Al and 6063 aluminium joints during pulsed electric current bonding.

Published in:

Welding International, 2011, v. 25, n. 3, p. 159, doi. 10.1080/09507111003655473

By:

Matsui, Minefumi;
Kondou, Katsuya;
Wada, Kouji;
Ohashi, Osamu

Publication type:

Article

Does clinical experience affect the bracket bonding accuracy of guided bonding devices in vitro?

Published in:

Angle Orthodontist, 2024, v. 94, n. 1, p. 59, doi. 10.2319/020623-88.1

By:

Li, Bin;
Wang, Peiqi;
Zheng, Qinghua;
Huang, Lixuan;
Hu, Siyuan;
Han, Xianglong;
Bai, Ding;
Xue, Chaoran

Publication type:

Article

Influence of clinical experience on accuracy of virtual orthodontic attachment bonding in comparison with the direct procedure.

Published in:

Angle Orthodontist, 2019, v. 89, n. 5, p. 734, doi. 10.2319/100618-724.1

By:

De Oliveira, Natalice S.;
Rossouw, Emile;
Lages, Elizabeth M. B.;
Macari, Soraia;
Pretti, Henrique

Publication type:

Article

Force and amount of resin composite paste used in direct and indirect bonding.

Published in:

Angle Orthodontist, 2010, v. 80, n. 6, p. 1089, doi. 10.2319/031910-41.1

By:

Muguruma, Takeshi;
Yasuda, Yoshitaka;
Iijima, Masahiro;
Kohda, Naohisa;
Mizoguchi, Itaru

Publication type:

Article

Study on the Ultrasonic Bonding Process Using Molecular Dynamics Simulation: Study on the Ultrasonic Bonding Process Using Molecular Dynamics Simulation: Y. Sasajima et al.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 3, p. 2423, doi. 10.1007/s11664-024-11712-7

By:

Sasajima, Yasushi;
Hatakeyama, Shingo;
Iwamoto, Chihiro

Publication type:

Article

Selective Self‐Assembly of Supramolecular Helices and Macrocycles Directed by Halogen Bonding.

Published in:

Chemistry - A European Journal, 2025, v. 31, n. 7, p. 1, doi. 10.1002/chem.202403821

By:

Hu, Zhi‐Yuan;
Du, Mengxin;
Li, Wenhao;
Huang, Xin;
Ma, Ruijie;
Li, Yunhan;
Shen, Ren‐Zeng;
Wang, Tao;
Liu, Chuan‐Zhi;
Li, Zhan‐Ting

Publication type:

Article

Redox‐Active Triazole‐Derived Mesoionic Imines with Ferrocenyl Substituents and their Metal Complexes: Directed Hydrogen‐Bonding, Unusual C−H Activation and Ion‐Pair Formation.

Published in:

Chemistry - A European Journal, 2024, v. 30, n. 35, p. 1, doi. 10.1002/chem.202400730

By:

Rudolf, Richard;
Batman, Derman;
Mehner, Niklas;
Walter, Robert R. M.;
Sarkar, Biprajit

Publication type:

Article

Halogen Bonding Tripodal Metallo‐Receptors for Phosphate Recognition and Sensing in Aqueous‐Containing Organic Media.

Published in:

Chemistry - A European Journal, 2024, v. 30, n. 2, p. 1, doi. 10.1002/chem.202302775

By:

Bagha, Hena;
Hein, Robert;
Lim, Jason Y. C.;
Durr, Christopher B.;
Sambrook, Mark R.;
Beer, Paul D.

Publication type:

Article

Chalcogen Bonding Ion‐Pair Cryptand Host Discrimination of Potassium Halide Salts.

Published in:

Chemistry - A European Journal, 2021, v. 27, n. 29, p. 7837, doi. 10.1002/chem.202100579

By:

Docker, Andrew;
Bunchuay, Thanthapatra;
Ahrens, Michael;
Martinez‐Martinez, Antonio J.;
Beer, Paul D.

Publication type:

Article

Anion Sensing through Redox‐Modulated Fluorescent Halogen Bonding and Hydrogen Bonding Hosts**.

Published in:

Angewandte Chemie, 2024, v. 136, n. 6, p. 1, doi. 10.1002/ange.202315959

By:

Taylor, Andrew J.;
Hein, Robert;
Patrick, Sophie C.;
Davis, Jason J.;
Beer, Paul D.

Publication type:

Article

Deciphering the Primary Role of Au⋅⋅⋅H−X Hydrogen Bonding in Gold Catalysis.

Published in:

Angewandte Chemie, 2023, v. 135, n. 41, p. 1, doi. 10.1002/ange.202310314

By:

Sorroche, Alba;
Moreno, Sonia;
Elena Olmos, M.;
Monge, Miguel;
López‐de‐Luzuriaga, José M.

Publication type:

Article

Halogen Bonding in Dithiane/Iodofluorobenzene Mixtures: A New Class of Hydrophobic Deep Eutectic Solvents.

Published in:

Angewandte Chemie, 2021, v. 133, n. 42, p. 23165, doi. 10.1002/ange.202110520

By:

Peloquin, Andrew J.;
McCollum, Jena M.;
McMillen, Colin D.;
Pennington, William T.

Publication type:

Article