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Microstructure, electrochemical and mechanical properties of novel Zn–Sn–Cu–Ni high-temperature solder containing a small amount of Al.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 23, p. 1, doi. 10.1007/s10854-023-11099-x
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Influence of Pulse Current Forward-Reverse Duty Cycle on Structure and Performance of Electroplated W–Cu Composite Coatings.
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- Materials (1996-1944), 2021, v. 14, n. 5, p. 1233, doi. 10.3390/ma14051233
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- Article