Works matching AU Zhou, M. B.

Results: 10

Current density dependent shear performance and fracture behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 16, p. 15184, doi. 10.1007/s10854-019-01891-z

By:

Le, W. K.;
Ning, X.;
Ke, C. B.;
Zhou, M. B.;
Zhang, X. P.

Publication type:

Article

Unique interfacial reaction and so-induced change in mechanical performance of Sn-3.0Ag-0.5Cu/Cu solder joints formed during undercooled and eutectic liquid soldering processes.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 5, p. 4770, doi. 10.1007/s10854-019-00771-w

By:

Zhou, M. B.;
Zhao, X. F.;
Yue, W.;
Zhang, X. P.

Publication type:

Article

Size effects on the interfacial reaction and microstructural evolution of Sn-ball/Sn3.0Ag0.5Cu-paste/Cu joints in board-level hybrid BGA interconnection at critical reflowing temperature.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 9, p. 7651, doi. 10.1007/s10854-018-8758-0

By:

Huang, J. Q.;
Zhou, M. B.;
Liang, S. B.;
Zhang, X. P.

Publication type:

Article

THERMAL STRESS-FOCUSING IN A TRANSVERSELY ISOTROPIC SPHERE AND AN ISOTROPIC SPHERE.

Published in:

Journal of Thermal Stresses, 2002, v. 25, n. 1, p. 31, doi. 10.1080/014957302753305853

By:

Wang, X.;
Wang, C.;
Lu, G.;
Zhou, B. M.

Publication type:

Article

The Effects of Core–Shell-Structured SiO<sub>2</sub>@Ag Spheres in Enhancing the Performance of Ag-Flake-Filled Electrically Conductive Adhesive and Insight into the Conduction Mechanism.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1272, doi. 10.1007/s11664-023-10864-2

By:

Jiang, H.;
Zhou, M. B.;
Zhang, X. P.

Publication type:

Article

A comprehensive and in-depth study of pressureless and low-temperature in-air sintering performance of bimodal-sized Cu nanoparticle pastes for die attachment and the joint strengthening mechanism.

Published in:

Journal of Materials Science: Materials in Electronics, 2025, v. 36, n. 5, p. 1, doi. 10.1007/s10854-025-14323-y

By:

Hou, B.;
Zhou, M. B.;
Zhang, X. P.

Publication type:

Article

The effects of the decreasing joint size on interfacial microstructure and shear behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 3, p. 1464, doi. 10.1007/s10854-021-07638-z

By:

Le, W. K.;
Zhou, M. B.;
Zhang, X. P.

Publication type:

Article

Superior strength and strengthening mechanism of die attachment joints by using bimodal-sized Cu nanoparticle paste capable of low-temperature pressureless sintering.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 3, p. 3391, doi. 10.1007/s10854-020-05086-9

By:

Huang, H. J.;
Wu, X.;
Zhou, M. B.;
Zhang, X. P.

Publication type:

Article

Study of accelerated shear creep behavior and fracture process of micro-scale ball grid array (BGA) structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electro-thermo-mechanical loads.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 18, p. 15575, doi. 10.1007/s10854-020-04121-z

By:

Le, W. K.;
Zhou, J. Y.;
Ke, C. B.;
Zhou, M. B.;
Zhang, X. P.

Publication type:

Article

Preparation and in vitro evaluation of polyurethane composite scaffolds based on glycerol esterified castor oil and hydroxyapatite.

Published in:

Materials Research Innovations, 2014, v. 18, n. 3, p. 160, doi. 10.1179/1433075X13Y.0000000180

By:

Du, J. J.;
Zuo, Y.;
Zou, Q.;
Sun, B.;
Zhou, M. B.;
Li, L. M.;
Man, Y.;
Li, Y. B.

Publication type:

Article