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  • Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy.

    Published in:
    Materials (1996-1944), 2023, v. 16, n. 1, p. 96, doi. 10.3390/ma16010096
    By:
    • Roduan, Siti Faqihah;
    • Wahab, Juyana A.;
    • Salleh, Mohd Arif Anuar Mohd;
    • Mahayuddin, Nurul Aida Husna Mohd;
    • Abdullah, Mohd Mustafa Al Bakri;
    • Halil, Aiman Bin Mohd;
    • Zaifuddin, Amira Qistina Syamimi;
    • Muhammad, Mahadzir Ishak;
    • Sandu, Andrei Victor;
    • Baltatu, Mădălina Simona;
    • Vizureanu, Petrica
    Publication type:
    Article