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Coefficient Extraction of SAC305 Solder Constitutive Equations Using Equation-Informed Neural Networks.
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- Materials (1996-1944), 2023, v. 16, n. 14, p. 4922, doi. 10.3390/ma16144922
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- Article
An AI-Based Adaptive Surrogate Modeling Method for the In-Service Response of UVLED Modules.
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- Electronics (2079-9292), 2022, v. 11, n. 18, p. N.PAG, doi. 10.3390/electronics11182861
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- Article
Investigation of the mechanical characteristics of the Cu/low-k BEOL under wire bonding process loading.
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- Journal of Mechanics, 2022, v. 38, p. 539, doi. 10.1093/jom/ufac044
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- Article
Using a Flexible IoT Architecture and Sequential AI Model to Recognize and Predict the Production Activities in the Labor-Intensive Manufacturing Site.
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- Electronics (2079-9292), 2021, v. 10, n. 20, p. 2540, doi. 10.3390/electronics10202540
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- Article
Solder Joint Reliability Risk Estimation by AI-Assisted Simulation Framework with Genetic Algorithm to Optimize the Initial Parameters for AI Models.
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- Materials (1996-1944), 2021, v. 14, n. 17, p. 4835, doi. 10.3390/ma14174835
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- Article
Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2450, doi. 10.1007/s11664-015-3774-9
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- Article
Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 11, p. 4954, doi. 10.1007/s10854-014-2257-8
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- Article
Molecular modeling of temperature dependence of solubility parameters for amorphous polymers.
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- Journal of Molecular Modeling, 2012, v. 18, n. 6, p. 2333, doi. 10.1007/s00894-011-1249-3
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- Article
A Robust Thin-Film Wafer-Level Packaging Approach for MEMS Devices.
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- Journal of Microelectronic & Electronic Packaging, 2010, v. 7, n. 3, p. 175, doi. 10.4071/imaps.270
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- Article