Found: 9
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Stability of AuSn eutectic solder cap on Au socket during reflow.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 1, p. 55, doi. 10.1007/s10854-008-9606-4
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- Article
Direct robust bonding between Sn-based solder and Si substrate.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 1057, doi. 10.1007/s10854-006-9114-3
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- Article
Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 828, doi. 10.1007/s11664-008-0611-4
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- Article
Microstructure, Solderability, and Growth of Intermetallic Compounds of Sn-Ag-Cu-RE Lead-Free Solder Alloys.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 89, doi. 10.1007/s11664-006-0189-7
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- Article
Prediabetes and diabetes are both risk factors for adverse outcomes in infective endocarditis.
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- Diabetic Medicine, 2018, v. 35, n. 11, p. 1499, doi. 10.1111/dme.13761
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- Article
Fabrication and characteristics of N-doped β-Ga<sub>2</sub>O<sub>3</sub> nanowires.
- Published in:
- Applied Physics A: Materials Science & Processing, 2010, v. 98, n. 4, p. 831, doi. 10.1007/s00339-009-5538-y
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- Article
Estimation of dietary selenium requirement for Chinese egg-laying ducks.
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- Animal Production Science, 2015, v. 55, n. 8, p. 1056, doi. 10.1071/AN13447
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- Article
Age, creatinine and ejection fraction (ACEF) score: a simple risk-stratified method for infective endocarditis.
- Published in:
- QJM: An International Journal of Medicine, 2019, v. 112, n. 12, p. 900, doi. 10.1093/qjmed/hcz191
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- Publication type:
- Article
A Spectral Quality Evaluation Method for Ammonia Detection in Open Spaces.
- Published in:
- Lasers in Engineering (Old City Publishing), 2024, v. 57, n. 1-3, p. 105
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- Article