Found: 17
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Interfacial microstructure and brittle fracture behavior of Sn-based solder on novel nickel-less DEG and EPIG surface finishes.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 2, p. 1, doi. 10.1007/s10854-022-09510-0
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- Article
Microstructure and mechanical properties of Ag nanoparticles-modified Sn–58Bi/Cu solder joints during liquid-state reaction.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 24, p. 28346, doi. 10.1007/s10854-021-07210-9
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- Article
Growth of intermetallic compounds and brittle fracture behavior of Sn-Ag-Cu/ENIG joint with columnar Ni-P layer.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 1, p. 1042, doi. 10.1007/s10854-020-04879-2
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- Article
Epoxy/silane pre-synthesis improving thermal properties and adhesion strength of silica-filled non-conductive adhesive for fine-pitch thermocompression bonding.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 2, p. 1227, doi. 10.1007/s10854-019-02634-w
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- Article
Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 15889, doi. 10.1007/s10854-019-01935-4
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- Article
Effects of flux formulation temperature on printing and wetting properties of Sn–3.0Ag–0.5Cu solder.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 9, p. 8493, doi. 10.1007/s10854-019-01169-4
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- Article
Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder joints.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 8, p. 7645, doi. 10.1007/s10854-019-01080-y
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- Article
Conceptual design of high-speed semi-low-floor bogie for train-tram.
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- International Journal of Automotive Technology, 2017, v. 18, n. 3, p. 523, doi. 10.1007/s12239-017-0052-2
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- Article
Facile Design of Conductive Ag-PDMS Electrodes for Stretchable Electrodes.
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- Journal of Electronic Materials, 2019, v. 48, n. 1, p. 79, doi. 10.1007/s11664-018-6731-6
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- Article
Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 110, doi. 10.1007/s11664-017-5821-1
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- Article
Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints.
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- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6184, doi. 10.1007/s11664-016-4908-4
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- Article
Effect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4457, doi. 10.1007/s11664-014-3395-8
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- Article
Effects of Surface Finishes and Current Stressing on Interfacial Reaction Characteristics of Sn-3.0Ag-0.5Cu Solder Bumps.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 791, doi. 10.1007/s11664-011-1888-2
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- Article
Syntheses of Porous Self-Supporting Metal-Nanoparticle Assemblies with 3D Morphologies Inherited from Biosilica Templates (Diatom Frustules).
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- Advanced Materials, 2009, v. 21, n. 4, p. 474, doi. 10.1002/adma.200801499
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- Article
Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding.
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- Materials (1996-1944), 2024, v. 17, n. 14, p. 3619, doi. 10.3390/ma17143619
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- Article
Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish.
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- Materials (1996-1944), 2023, v. 16, n. 4, p. 1739, doi. 10.3390/ma16041739
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- Article
SiC-NANOPARTICLE DISPERSED COMPOSITE SOLDER BUMPS FABRICATED BY ELECTROPLATING.
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- Surface Review & Letters, 2010, v. 17, n. 2, p. 201, doi. 10.1142/S0218625X10013795
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- Article