Works by Yishu Wang

Results: 147

Influence of aging atmosphere on the thermal stability of low-temperature sintered Cu joints based on Cu nanoparticles.

Published in:

Journal of Materials Science: Materials in Electronics, 2025, v. 36, n. 16, p. 1, doi. 10.1007/s10854-025-15039-9

By:

Cui, Ze;
Jia, Qiang;
Gao, Xu;
Lu, Ziyi;
Wang, Yishu;
Li, Dan;
Zhang, Hongqiang;
Ma, Limin;
Zou, Guisheng;
Guo, Fu

Publication type:

Article

LncRNA MIR17HG Suppresses Breast Cancer Proliferation and Migration as ceRNA to Target FAM135A by Sponging miR-454-3p.

Published in:

Molecular Biotechnology, 2023, v. 65, n. 12, p. 2071, doi. 10.1007/s12033-023-00706-1

By:

Xu, Jingjing;
Hu, Meishun;
Gao, Yang;
Wang, Yishu;
Yuan, Xiaoning;
Yang, Yan;
Song, Wenjing;
Yin, Weinan;
Gong, Pengju;
Wei, Lei;
Zhang, Jingwei

Publication type:

Article

Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 6, p. 2988, doi. 10.1007/s11664-024-11021-z

By:

Ma, Limin;
Lu, Ziyi;
Jia, Qiang;
Cui, Ze;
Wang, Yishu;
Li, Dan;
Zhang, Hongqiang;
Zou, Guisheng;
Guo, Fu

Publication type:

Article

Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 6, p. 2703, doi. 10.1007/s11664-024-10970-9

By:

Cui, Ze;
Jia, Qiang;
Zhang, Hongqiang;
Wang, Yishu;
Ma, Limin;
Zou, Guisheng;
Guo, Fu

Publication type:

Article

Effects of twin boundaries on the void formation in Cu-filled through silicon vias under thermal process.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 6, p. 5845, doi. 10.1007/s10854-019-00882-4

By:

Zhao, Xuewei;
Ma, Limin;
Wang, Yishu;
Guo, Fu

Publication type:

Article

IMC growth behavior along c-axis of Sn grain under current stressing.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 15, p. 13180, doi. 10.1007/s10854-018-9442-0

By:

Wang, Yan;
Wang, Yishu;
Ma, Limin;
Han, Jing;
Guo, Fu

Publication type:

Article

Effects of Sn grain <italic>c-</italic>axis on electromigration in Cu reinforced composite solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 7, p. 5954, doi. 10.1007/s10854-018-8568-4

By:

Wang, Yan;
Wang, Yishu;
Han, Jing;
Tan, Shihai;
Guo, Fu

Publication type:

Article

Graph simulation on large scale temporal graphs.

Published in:

GeoInformatica, 2020, v. 24, n. 1, p. 199, doi. 10.1007/s10707-019-00381-y

By:

Ma, Yuliang;
Yuan, Ye;
Liu, Meng;
Wang, Guoren;
Wang, Yishu

Publication type:

Article

Review on Power Cycling Reliability of SiC Power Device.

Published in:

Electronic Materials, 2024, v. 5, n. 2, p. 80, doi. 10.3390/electronicmat5020007

By:

Gao, Xu;
Jia, Qiang;
Wang, Yishu;
Zhang, Hongqiang;
Ma, Limin;
Zou, Guisheng;
Guo, Fu

Publication type:

Article

Autophagy Related 5 Promotes Mitochondrial Fission and Inflammation via HSP90‐HIF‐1α‐Mediated Glycolysis in Kidney Fibrosis.

Published in:

Advanced Science, 2025, v. 12, n. 17, p. 1, doi. 10.1002/advs.202414673

By:

Hu, Yan;
Li, Jinqing;
Chen, Hui;
Shi, Yingfeng;
Ma, Xiaoyan;
Wang, Yi;
Li, Xialin;
Zhong, Qin;
Wang, Yishu;
Jiang, Daofang;
Zhuang, Shougang;
Liu, Na

Publication type:

Article

Biological characteristics of side population cells in a self-established human ovarian cancer cell line.

Published in:

Oncology Letters, 2016, v. 12, n. 1, p. 41, doi. 10.3892/ol.2016.4565

By:

ZHENTONG WEI;
SHUANG LV;
YISHU WANG;
MEIYU SUN;
GUANGFAN CHI;
JUN GUO;
PEIYE SONG;
XIAOYU FU;
SONGLING ZHANG;
YULIN LI

Publication type:

Article

Recent Findings in the Regulation of Programmed Death Ligand 1 Expression.

Published in:

Frontiers in Immunology, 2019, p. N.PAG, doi. 10.3389/fimmu.2019.01337

By:

Shen, Xiangfeng;
Zhang, Lihong;
Li, Jicheng;
Li, Yulin;
Wang, Yishu;
Xu, Zhi-Xiang

Publication type:

Article

Gut microbiome: a novel preventive and therapeutic target for prostatic disease.

Published in:

Frontiers in Cellular & Infection Microbiology, 2024, p. 01, doi. 10.3389/fcimb.2024.1431088

By:

Hongliang Cao;
Difei Zhang;
Pengyu Wang;
Yishu Wang;
Chengdong Shi;
Hao Wu;
Hao Du;
Wenqiang Zhang;
Zixuan Gou;
Honglan Zhou;
Song Wang

Publication type:

Article

A Sparse and Low-Rank Regression Model for Identifying the Relationships Between DNA Methylation and Gene Expression Levels in Gastric Cancer and the Prediction of Prognosis.

Published in:

Genes, 2021, v. 13, n. 6, p. 854, doi. 10.3390/genes12060854

By:

Wang, Yishu;
Xu, Lingyun;
Ai, Dongmei

Publication type:

Article

GPPR: Geo-distributed Personalized PageRank Algorithm.

Published in:

International Journal of Software & Informatics, 2024, v. 14, n. 1, p. 97, doi. 10.21655/ijsi.1673-7288.00320

By:

Zijun Chen;
Delong Ma;
Yishu Wang;
Ye Yuan

Publication type:

Article

Fenofibrate Improved Interstitial Fibrosis of Renal Allograft through Inhibited Epithelial-Mesenchymal Transition Induced by Oxidative Stress.

Published in:

Oxidative Medicine & Cellular Longevity, 2019, p. 1, doi. 10.1155/2019/8936856

By:

Wang, Yishu;
Pang, Lei;
Zhang, Yanghe;
Lin, Jiahui;
Zhou, Honglan

Publication type:

Article

Emerging Anesthetic Nanomedicines: Current State and Challenges.

Published in:

International Journal of Nanomedicine, 2023, v. 18, p. 3913, doi. 10.2147/IJN.S417855

By:

Zhang, Shuo;
Wang, Yishu;
Zhang, Shuai;
Huang, Chengqi;
Ding, Qiyang;
Xia, Ji;
Wu, Daocheng;
Gao, Wei

Publication type:

Article

Effects of acetazolamide combined with remote ischemic preconditioning on risk of acute mountain sickness: a randomized clinical trial.

Published in:

BMC Medicine, 2024, v. 22, n. 1, p. 1, doi. 10.1186/s12916-023-03209-7

By:

Liu, Moqi;
Jiao, Xueqiao;
Li, Rui;
Li, Jialu;
Wang, Lu;
Wang, Liyan;
Wang, Yishu;
Lv, Chunmei;
Huang, Dan;
Wei, Ran;
Wang, Liming;
Ji, Xunming;
Guo, Xiuhai

Publication type:

Article

Effects of acetazolamide combined with remote ischemic preconditioning on risk of acute mountain sickness: a randomized clinical trial.

Published in:

BMC Medicine, 2024, v. 22, n. 1, p. 1, doi. 10.1186/s12916-023-03209-7

By:

Liu, Moqi;
Jiao, Xueqiao;
Li, Rui;
Li, Jialu;
Wang, Lu;
Wang, Liyan;
Wang, Yishu;
Lv, Chunmei;
Huang, Dan;
Wei, Ran;
Wang, Liming;
Ji, Xunming;
Guo, Xiuhai

Publication type:

Article

Functional properties of skinned rabbit skeletal and cardiac muscle preparations containing α-cardiac myosin heavy chain.

Published in:

Pflügers Archiv: European Journal of Physiology, 2004, v. 448, n. 1, p. 44, doi. 10.1007/s00424-003-1229-2

By:

Andruchov, Oleg;
Wang, Yishu;
Andruchova, Olena;
Galler, Stefan

Publication type:

Article

Functional differences in type-I fibres from two slow skeletal muscles of rabbit.

Published in:

Pflügers Archiv: European Journal of Physiology, 2003, v. 446, n. 6, p. 752, doi. 10.1007/s00424-003-1143-7

By:

Andruchov, Oleg;
Andruchova, Olena;
Wang, Yishu;
Galler, Stefan

Publication type:

Article

Credibility assessment of a mechanistic model of atherosclerosis to predict cardiovascular outcomes under lipid-lowering therapy.

Published in:

NPJ Digital Medicine, 2025, v. 8, n. 1, p. 1, doi. 10.1038/s41746-025-01557-7

By:

Wang, Yishu;
Courcelles, Eulalie;
Peyronnet, Emmanuel;
Porte, Solène;
Diatchenko, Alizée;
Jacob, Evgueni;
Angoulvant, Denis;
Amarenco, Pierre;
Boccara, Franck;
Cariou, Bertrand;
Mahé, Guillaume;
Steg, Philippe Gabriel;
Bastien, Alexandre;
Portal, Lolita;
Boissel, Jean-Pierre;
Granjeon-Noriot, Solène;
Bechet, Emmanuelle

Publication type:

Article

Impact of sea ice decline in the Arctic Ocean on the number of extreme low‐temperature days over China.

Published in:

International Journal of Climatology, 2020, v. 40, n. 3, p. 1421, doi. 10.1002/joc.6277

By:

Ge, Feifan;
Yan, Tao;
Zhou, Lu;
Jiang, Yuelin;
Li, Wei;
Fan, Yufen;
Wang, Yishu;
Mao, Kebiao;
Wu, Wenge

Publication type:

Article

Exploring the nexus between MYH9 and tumors: novel insights and new therapeutic opportunities.

Published in:

Frontiers in Cell & Developmental Biology, 2024, p. 01, doi. 10.3389/fcell.2024.1421763

By:

Zixuan Gou;
Difei Zhang;
Hongliang Cao;
Yao Li;
Yunkuo Li;
Zijian Zhao;
Ye Wang;
Yishu Wang;
Honglan Zhou

Publication type:

Article

Enhanced glycolysis in the myometrium with ectopic endometrium of patients with adenomyosis: a preliminary study.

Published in:

Gynecological Endocrinology, 2024, v. 40, n. 1, p. 1, doi. 10.1080/09513590.2024.2332411

By:

Huang, Shiya;
Huang, Xueqian;
Wen, Xiaohui;
Liu, Xuehong;
Ma, Hongxia;
Xie, Linling;
Wang, Yishu;
Liu, Shanjia;
Guan, Yongge;
Li, Kunyin

Publication type:

Article

Bone marrow derived mesenchymal stem cells transplantation rescues premature ovarian insufficiency induced by chemotherapy.

Published in:

Gynecological Endocrinology, 2018, v. 34, n. 4, p. 320, doi. 10.1080/09513590.2017.1393661

By:

Bao, Riqiang;
Xu, Ping;
Wang, Yishu;
Wang, Jing;
Xiao, Li;
Li, Gang;
Zhang, Chunping

Publication type:

Article

Low-Rank and Sparse Matrix Decomposition for Genetic Interaction Data.

Published in:

2015

By:

Wang, Yishu;
Yang, Dejie;
Deng, Minghua

Publication type:

journal article

A data calibration method for micro air quality detectors based on a LASSO regression and NARX neural network combined model.

Published in:

Scientific Reports, 2021, v. 11, n. 1, p. 1, doi. 10.1038/s41598-021-00804-7

By:

Liu, Bing;
Jin, Yueqiang;
Xu, Dezhi;
Wang, Yishu;
Li, Chaoyang

Publication type:

Article

Telomere-related DNA damage response pathways in cancer therapy: prospective targets.

Published in:

Frontiers in Pharmacology, 2024, p. 1, doi. 10.3389/fphar.2024.1379166

By:

Liting Gu;
Mingdi Liu;
Yuning Zhang;
Honglan Zhou;
Yishu Wang;
Zhi-Xiang Xu

Publication type:

Article

A real-world disproportionality analysis of mesalazine data mining of the public version of FDA adverse event reporting system.

Published in:

Frontiers in Pharmacology, 2024, p. 1, doi. 10.3389/fphar.2024.1290975

By:

Mingdi Liu;
Liting Gu;
Yuning Zhang;
Honglan Zhou;
Yishu Wang;
Zhi-Xiang Xu

Publication type:

Article

Mapping the tumor microenvironment in clear cell renal carcinoma by single-cell transcriptome analysis.

Published in:

Frontiers in Genetics, 2023, p. 1, doi. 10.3389/fgene.2023.1207233

By:

Yuxiong Wang;
Yishu Wang;
Bin Liu;
Xin Gao;
Yunkuo Li;
Faping Li;
Honglan Zhou

Publication type:

Article

The regulations of telomerase reverse transcriptase (TERT) in cancer.

Published in:

Cell Death & Disease, 2024, v. 15, n. 1, p. 1, doi. 10.1038/s41419-024-06454-7

By:

Liu, Mingdi;
Zhang, Yuning;
Jian, Yongping;
Gu, Liting;
Zhang, Dan;
Zhou, Honglan;
Wang, Yishu;
Xu, Zhi-Xiang

Publication type:

Article

Profiles of immune cell infiltration and immune-related genes in the tumor microenvironment of esophageal squamous cell carcinoma.

Published in:

BMC Medical Genomics, 2021, v. 14, n. 1, p. 1, doi. 10.1186/s12920-021-00928-9

By:

Liu, Mingdi;
Li, Faping;
Liu, Bin;
Jian, Yongping;
Zhang, Dan;
Zhou, Honglan;
Wang, Yishu;
Xu, Zhixiang

Publication type:

Article

The role of liver kinase B1 in tumor progression through regulation of lipid metabolism.

Published in:

Clinical & Translational Oncology, 2022, v. 24, n. 11, p. 2045, doi. 10.1007/s12094-022-02863-2

By:

Geng, Jialu;
Zhang, Yanghe;
Meng, Qingfei;
Yan, Hang;
Wang, Yishu

Publication type:

Article

Low-Temperature-Sintered Nano-Ag Film for Power Electronics Packaging.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 1, p. 228, doi. 10.1007/s11664-023-10763-6

By:

Ma, Limin;
Wang, Yuchen;
Jia, Qiang;
Zhang, Hongqiang;
Wang, Yishu;
Li, Dan;
Zou, Guisheng;
Guo, Fu

Publication type:

Article

Study on Thermal Shock and Annealing Behavior of Sn3Ag0.5Cu-TSV Prepared by Modified Molten Metal Infiltration Method.

Published in:

Journal of Electronic Materials, 2022, v. 51, n. 7, p. 4054, doi. 10.1007/s11664-022-09600-z

By:

Wang, Jiaojiao;
Ma, Limin;
Feng, Jianyu;
Wang, Yishu;
Guo, Fu

Publication type:

Article

Electromigration Behavior of Low-Silver Sn-0.3Ag-0.7Cu-1.6Bi-0.2In Solder Joints.

Published in:

Journal of Electronic Materials, 2020, v. 49, n. 7, p. 4237, doi. 10.1007/s11664-020-08147-1

By:

Li, Mengyuan;
Han, Jing;
Guo, Fu;
Ma, Limin;
Wang, Yishu;
Zhou, Wei

Publication type:

Article

Effect of Sn Grain c-Axis on Cu Atomic Motion in Cu Reinforced Composite Solder Joints Under Electromigration.

Published in:

Journal of Electronic Materials, 2020, v. 49, n. 3, p. 2159, doi. 10.1007/s11664-019-07897-x

By:

Wang, Yan;
Wang, Yishu;
Ma, Limin;
Han, Jing;
Guo, Fu

Publication type:

Article

The Growth of Interfacial IMC Layer in SAC0307 Solder Joints with Specific Grain Orientation Under Electrical and Thermal Coupling Fields.

Published in:

Journal of Electronic Materials, 2020, v. 49, n. 1, p. 202, doi. 10.1007/s11664-019-07669-7

By:

Tian, Yu;
Ma, Limin;
Wang, Yishu;
Guo, Fu;
Sun, Zhijie

Publication type:

Article

The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing.

Published in:

Journal of Electronic Materials, 2019, v. 48, n. 5, p. 2770, doi. 10.1007/s11664-018-06907-8

By:

Tian, Yu;
Wang, Yishu;
Guo, Fu;
Ma, Limin;
Han, Jing

Publication type:

Article

Mechanism of the Local Cu Protrusion in Cu-Filled Through Silicon Vias Under Heat Treatment.

Published in:

Journal of Electronic Materials, 2019, v. 48, n. 1, p. 152, doi. 10.1007/s11664-018-6803-7

By:

Zhao, Xuewei;
Ma, Limin;
Wang, Yishu;
Guo, Fu

Publication type:

Article

Effect of the Angle Between Sn Grain c-Axis and Electron Flow Direction on Cu-Reinforced Composite Solder Joints Under Current Stressing.

Published in:

Journal of Electronic Materials, 2018, v. 47, n. 1, p. 96, doi. 10.1007/s11664-017-5774-4

By:

Wang, Yan;
Han, Jing;
Wang, Yishu;
Ma, Limin;
Guo, Fu

Publication type:

Article

Effect of Thermal Mechanical Behaviors of Cu on Stress Distribution in Cu-Filled Through-Silicon Vias Under Heat Treatment.

Published in:

Journal of Electronic Materials, 2018, v. 47, n. 1, p. 142, doi. 10.1007/s11664-017-5885-y

By:

Zhao, Xuewei;
Ma, Limin;
Wang, Yishu;
Guo, Fu

Publication type:

Article

Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles.

Published in:

Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 11, p. 1, doi. 10.1007/s10854-024-12492-w

By:

Cui, Ze;
Jia, Qiang;
Wang, Yishu;
Li, Dan;
Wang, Chien-Ping;
Zhang, Hongqiang;
Lu, Ziyi;
Ma, Limin;
Zou, Guisheng;
Guo, Fu

Publication type:

Article

Effect of electric pulse incubation melt on solidified microstructures and mechanical properties of Sn58Bi alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 30, p. 1, doi. 10.1007/s10854-023-11506-3

By:

Zhao, Jin;
Ji, Xiaoliang;
Jia, Qiang;
Wang, Yuxiang;
Ma, Limin;
Wang, Yishu;
Guo, Fu

Publication type:

Article

Investigation of ethylene glycol, α-terpineol, and polyethylene glycol 400 on the sintering properties of Cu–Ag core–shell micro/nano-mixed paste.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 21, p. 1, doi. 10.1007/s10854-023-10965-y

By:

Gao, Qian;
Zhou, Wei;
Xia, Zhidong;
Wang, Xiaobo;
Wang, Yishu;
Yue, Ziwei;
Guo, Fu

Publication type:

Article

Study of early-stage thermal fatigue behavior of Sn-based Cu-cored BGA solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 17, p. 1, doi. 10.1007/s10854-023-10734-x

By:

Han, Jing;
Meng, Zhou;
Jin, Xuelun;
Li, Teng;
Guo, Fu;
Ma, Limin;
Jia, Qiang;
Wang, Yishu

Publication type:

Article

Effect of P content on diffusion resistance and interfacial mechanical properties of crystalline Co–P coatings in solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 5, p. 1, doi. 10.1007/s10854-022-09732-2

By:

Zhen, Cheng;
Ma, Limin;
Liu, Shuang;
Wang, Yishu;
Li, Dan;
Guo, Fu

Publication type:

Article

Effect of different IMCs on the crystal orientation of IMCs/solder joint/Cu.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09502-0

By:

Han, Jing;
Meng, Zhou;
Jin, Xuelun;
Ma, Limin;
Guo, Fu;
Wang, Yishu;
Zhou, Wei;
An, Tong

Publication type:

Article

Effect of grain boundary on failure behavior of SABI333 solder joints during creep.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 6, p. 5017, doi. 10.1007/s10854-020-03068-5

By:

Zhai, Guangtao;
Wang, Yishu;
Ma, Limin;
Guo, Fu;
Tian, Yu;
Zhou, Wei;
Hu, Qiang;
Zhang, Fuwen

Publication type:

Article