Found: 26
Select item for more details and to access through your institution.
Effects of Minor Ga Addition on Interfacial Reactions Between Sn-Ga Solders and Cu.
- Published in:
- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2024, v. 76, n. 6, p. 2731, doi. 10.1007/s11837-024-06453-1
- By:
- Publication type:
- Article
Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder.
- Published in:
- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2024, v. 76, n. 6, p. 2754, doi. 10.1007/s11837-024-06426-4
- By:
- Publication type:
- Article
Solid/Solid State Interfacial Reactions in the Sn-9Zn/Cu-Based Alloys (C1990 HP, Alloy 25, and C194) Couples.
- Published in:
- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2023, v. 75, n. 6, p. 1889, doi. 10.1007/s11837-023-05827-1
- By:
- Publication type:
- Article
Interfacial Reactions Between Lead-Free Solders and Ni-Pd-Co Alloys.
- Published in:
- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2019, v. 71, n. 9, p. 3031, doi. 10.1007/s11837-019-03625-2
- By:
- Publication type:
- Article
Impurity-induced unusual microstructural evolution and mechanical property in Sn/Cu solder joints.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 15, p. 12842, doi. 10.1007/s10854-018-9403-7
- By:
- Publication type:
- Article
Nickel and copper deposition on fine alumina particles by using the chemical vapor deposition-circulation fluidized bed reactor technique.
- Published in:
- Journal of Materials Science, 2000, v. 35, n. 6, p. 1439, doi. 10.1023/A:1004739720570
- By:
- Publication type:
- Article
Interfacial Reactions in Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples.
- Published in:
- Journal of Electronic Materials, 2021, v. 50, n. 3, p. 903, doi. 10.1007/s11664-020-08693-8
- By:
- Publication type:
- Article
Effect of Multiple Reflowing Processes on Interfacial Reactions and Mechanical Properties between Sn-9.0 wt.%Zn, Sn-3.0 wt.%Ag-0.5 wt.%Cu Solders and Ag Substrate.
- Published in:
- Journal of Electronic Materials, 2020, v. 49, n. 1, p. 257, doi. 10.1007/s11664-019-07752-z
- By:
- Publication type:
- Article
Study of Interfacial Reactions Between Lead-Free Solders and Cu-xZn Alloys.
- Published in:
- Journal of Electronic Materials, 2019, v. 48, n. 1, p. 170, doi. 10.1007/s11664-018-6577-y
- By:
- Publication type:
- Article
Phase Equilibria of the Fe-Ni-Sn Ternary System at 270°C.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6208, doi. 10.1007/s11664-016-4787-8
- By:
- Publication type:
- Article
A Novel Electronic Packaging Method to Replace High-Temperature Sn-Pb Solders.
- Published in:
- Journal of Electronic Materials, 2015, v. 44, n. 10, p. 3914, doi. 10.1007/s11664-015-3879-1
- By:
- Publication type:
- Article
Interfacial Reactions in Sn/Ni- xW Couples.
- Published in:
- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 909, doi. 10.1007/s11664-014-3573-8
- By:
- Publication type:
- Article
Interfacial Reactions of High-Bi Alloys on Various Substrates.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 155, doi. 10.1007/s11664-013-2703-z
- By:
- Publication type:
- Article
Interfacial Reactions of Sn, Sn-3.0Ag-0.5Cu, and Sn-9Zn Lead-Free Solders with Fe-42Ni Substrates.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 187, doi. 10.1007/s11664-013-2727-4
- By:
- Publication type:
- Article
Interfacial Reactions Between Sn-Zn Alloys and Au Substrate.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3284, doi. 10.1007/s11664-012-2208-1
- By:
- Publication type:
- Article
Interfacial Reactions in Sn/Fe- xNi Couples.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 144, doi. 10.1007/s11664-011-1727-5
- By:
- Publication type:
- Article
Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2412, doi. 10.1007/s11664-010-1336-8
- By:
- Publication type:
- Article
Interfacial Reactions of Sn-9Zn- xCu ( x = 1, 4, 7, 10) Solders with Ni Substrates.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2222, doi. 10.1007/s11664-009-0880-6
- By:
- Publication type:
- Article
Foreword.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2211, doi. 10.1007/s11664-009-0935-8
- By:
- Publication type:
- Article
Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2257, doi. 10.1007/s11664-009-0920-2
- By:
- Publication type:
- Article
Interfacial Reactions Between Pb-Free Solders and In/Ni/Cu Multilayer Substrates.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 93, doi. 10.1007/s11664-008-0575-4
- By:
- Publication type:
- Article
The Effect of Increasing Nickel Content on the Microstructure, Hardness, and Corrosion Resistance of the CuFeTiZrNi x High-Entropy Alloys.
- Published in:
- Materials (1996-1944), 2022, v. 15, n. 9, p. 3098, doi. 10.3390/ma15093098
- By:
- Publication type:
- Article
Investigation of the Interfacial Reactions between the CoCuFeNi High Entropy Alloy and Sn Solder.
- Published in:
- Metals (2075-4701), 2023, v. 13, n. 4, p. 710, doi. 10.3390/met13040710
- By:
- Publication type:
- Article
Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates.
- Published in:
- Metals (2075-4701), 2023, v. 13, n. 1, p. 12, doi. 10.3390/met13010012
- By:
- Publication type:
- Article
Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu.
- Published in:
- Materials (1996-1944), 2024, v. 17, n. 9, p. 2149, doi. 10.3390/ma17092149
- By:
- Publication type:
- Article
Phase Equilibria of the Ag-Al-Au Ternary System and Interfacial Reactions in the Au- x Ag/Al Couples at 450 °C.
- Published in:
- Materials (1996-1944), 2023, v. 16, n. 22, p. 7196, doi. 10.3390/ma16227196
- By:
- Publication type:
- Article