Found: 1
Select item for more details and to access through your institution.
High-Pressure-Assisted Large-Area (>2400 mm 2) Sintered-Silver Substrate Bonding for SiC Power Module Packaging.
- Published in:
- Materials (1996-1944), 2024, v. 17, n. 8, p. 1911, doi. 10.3390/ma17081911
- By:
- Publication type:
- Article