Works by Xiaowu Hu

Results: 82

The specific RIP1 inhibitor necrostatin-1 ameliorated degradation of ECM in human SW1353 cells.

Published in:

Artificial Cells, Nanomedicine & Biotechnology, 2018, v. 46, p. S1169, doi. 10.1080/21691401.2018.1533848

By:

Hu, Xiaowu;
Zhu, Yuke;
Wang, Junsheng;
Tang, Jinshan;
Yu, Huaixi;
Xie, Ye;
Dong, Qirong

Publication type:

Article

Finite Element Analysis to the Constitutive Behavior of Sintered Silver Nanoparticles Under Nanoindentation.

Published in:

International Journal of Applied Mechanics, 2018, v. 10, n. 10, p. N.PAG, doi. 10.1142/S1758825118501107

By:

Long, Xu;
Du, Chongyang;
Li, Zhen;
Guo, Hongcun;
Yao, Yao;
Lu, Xiuzhen;
Hu, Xiaowu;
Ye, Lilei;
Liu, Johan

Publication type:

Article

High expression of leptin receptor leads to temozolomide resistance with exhibiting stem/progenitor cell features in gliobalastoma.

Published in:

Cell Cycle, 2013, v. 12, n. 24, p. 3833, doi. 10.4161/cc.26809

By:

Guosheng Han;
Laixing Wang;
Wenyuan Zhao;
Zhijian Yue;
Rui Zhao;
Yanan Li;
Xiaoping Zhou;
Xiaowu Hu;
Jianmin Liu

Publication type:

Article

Mechanical response of reaction phases of the TiAl/steel brazed joint under a tensile load.

Published in:

Journal of Materials Science, 2014, v. 49, n. 3, p. 1114, doi. 10.1007/s10853-013-7789-4

By:

Li, Yulong;
Liu, Wen;
Zhao, Cheng;
Hu, Xiaowu;
Sekulic, Dusan P.

Publication type:

Article

Age- and Parkinson's disease-related evaluation of gait by General Tau Theory.

Published in:

Experimental Brain Research, 2016, v. 234, n. 10, p. 2829, doi. 10.1007/s00221-016-4685-6

By:

Zhang, Shutao;
Qian, Jinwu;
Zhang, Zhen;
Shen, Linyong;
Wu, Xi;
Hu, Xiaowu

Publication type:

Article

Chronic high-frequency stimulation therapy in hemiparkinsonian rhesus monkeys using an implanted human DBS system.

Published in:

Neurological Sciences, 2013, v. 34, n. 5, p. 707, doi. 10.1007/s10072-012-1117-7

By:

Cao, Yiqun;
Yin, Peihao;
Hu, Xiaowu;
Ge, Yiqin;
Zhou, Xiaoping

Publication type:

Article

The Nonlinear Relationship Between Urbanization and Ecological Environment in China Under the PSR (Pressure-State-Response) Model: Inflection Point Identification and Policy Pathways.

Published in:

Sustainability (2071-1050), 2025, v. 17, n. 10, p. 4450, doi. 10.3390/su17104450

By:

An, Ruofei;
Hu, Xiaowu;
Sun, Shucun

Publication type:

Article

Intracranial hemorrhage risk factors of deep brain stimulation for Parkinson's disease: a 2-year follow-up study.

Published in:

Journal of International Medical Research, 2020, v. 48, n. 5, p. 1, doi. 10.1177/0300060519856747

By:

Yang, Chunhui;
Qiu, Yiqing;
Wang, Jiali;
Wu, Yina;
Hu, Xiaowu;
Wu, Xi

Publication type:

Article

A synonymous variant contributes to a rare Wiedemann-Rautenstrauch syndrome complicated with mild anemia via affecting pre-mRNA splicing.

Published in:

Frontiers in Molecular Neuroscience, 2022, v. 15, p. 1, doi. 10.3389/fnmol.2022.1026530

By:

Qiongling Peng;
Yan Zhang;
Binqiang Xian;
Lianying Wu;
Jianying Ding;
Wuwu Ding;
Xin Zhang;
Bilan Ding;
Ding Li;
Jin Wu;
Xiaowu Hu;
Guanting Lu

Publication type:

Article

Effect of Bi Segregation on the Asymmetrical Growth of Cu-Sn Intermetallic Compounds in Cu/Sn-58Bi/Cu Sandwich Solder Joints During Isothermal Aging.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 12, p. 3567, doi. 10.1007/s11664-013-2749-y

By:

Hu, Xiaowu;
Li, Yulong;
Li, Ke;
Min, Zhixian

Publication type:

Article

Growth behavior and kinetics of interfacial IMC for ZnSnCuNiAl/Cu solder joints subjected to isothermal aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 25, p. 1, doi. 10.1007/s10854-024-13436-0

By:

Chen, Wenjing;
Hu, Xiaowu;
Tang, Jiancheng

Publication type:

Article

Role of bismuth in the mechanical and corrosion properties of Cu/Sn-3.0Ag-0.5Cu/Cu solder lap joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 2, p. 1, doi. 10.1007/s10854-024-11942-9

By:

Zhu, Langfeng;
Chen, Wenjing;
Hu, Xiaowu;
Zhang, Zezong;
Chen, Bin;
Wang, Jue;
Tan, Sifan;
Jiang, Xiongxin

Publication type:

Article

Effect of the ultrasonic-assisted soldering on the interfacial reaction and IMC growth behavior of SAC305 solder with Cu alloy substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 20, p. 1, doi. 10.1007/s10854-023-10959-w

By:

Wang, Jue;
Chen, Wenjing;
Liu, Dingjun;
Li, Chao;
Zhou, Jiatao;
Zhang, Zezong;
Chen, Bin;
Jiang, Xiongxin;
Hu, Xiaowu

Publication type:

Article

Effects of Cu foam on microstructure and mechanical properties of SAC305 solder joints bonded with solid–liquid electromigration.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 11, p. 1, doi. 10.1007/s10854-023-10284-2

By:

Hu, Xiaowu;
Zhang, Zezong;
Chen, Wenjing;
Mao, Xin;
Ma, Yan;
Xiao, Shikun;
Huang, Hai;
Wang, Jue;
Chen, Bin;
Li, Qinglin;
Jiang, Xiongxin

Publication type:

Article

Research on Bi contents addition into Sn–Cu-based lead-free solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 19, p. 15586, doi. 10.1007/s10854-022-08464-7

By:

Huang, Hai;
Chen, Bin;
Hu, Xiaowu;
Jiang, Xiongxin;
Li, Qinglin;
Che, Yinhui;
Zu, Shuai;
Liu, Dingjun

Publication type:

Article

Enhanced mechanical properties and corrosion behavior of Zn–30Sn–2Cu high-temperature lead-free solder alloy by adding Sm.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 9, p. 6469, doi. 10.1007/s10854-022-07821-w

By:

zhang, Huajin;
Hu, Xiaowu;
Liu, Yi;
zhang, Jiankang;
Jiang, Xiongxin;
Li, Qinglin

Publication type:

Article

Study on the performance of Cu foam with different porosity on SAC305 solder joints under ultrasonic-assisted soldering.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 24, p. 28108, doi. 10.1007/s10854-021-07186-6

By:

Mao, Xin;
Zhang, Ruhua;
Yi, Xiong;
Hu, Xiaowu;
Li, Yulong;
Jiang, Xiongxin

Publication type:

Article

Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 19, p. 24507, doi. 10.1007/s10854-021-06929-9

By:

Gui, Zixiao;
Hu, Xiaowu;
Jiang, Xiongxin;
Li, Yulong;
Wang, Haozhong

Publication type:

Article

Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 13, p. 17336, doi. 10.1007/s10854-021-06256-z

By:

Qiu, Hongyu;
Xu, Han;
Zhang, Chuge;
Hu, Xiaowu;
Jiang, Xiongxin;
Li, Qinglin

Publication type:

Article

Effect of ultrasonic treatment on interfacial reactions and microstructure of SnCr/CuFeNiCoCr solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 11, p. 15352, doi. 10.1007/s10854-021-06085-0

By:

Yang, Qing;
Hu, Xiaowu

Publication type:

Article

Effects of accelerator in a copper plating bath on interfacial microstructure and mechanical properties of SAC305/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 24, p. 22810, doi. 10.1007/s10854-020-04806-5

By:

Xu, Han;
Zhang, Xudong;
Chen, Wenjing;
Zou, Minming;
Hu, Xiaowu

Publication type:

Article

Interfacial microstructure evolution of solder joints by doping Cu nanoparticles into Ni(P) electroless plating.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 22, p. 20232, doi. 10.1007/s10854-020-04543-9

By:

Cheng, Jinxuan;
Zhang, Jiankang;
Liu, Yi;
Hu, Xiaowu;
Zhang, Zhe;
Jiang, Xiongxin

Publication type:

Article

Effect of rare earth Ce on the thermal behavior, microstructure and mechanical properties of Zn–30Sn–2Cu high temperature lead-free solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 19, p. 16437, doi. 10.1007/s10854-020-04196-8

By:

Zeng, Xianwei;
Liu, Yichi;
Zhang, Jiankang;
Liu, Yi;
Hu, Xiaowu;
Jiang, Xiongxin

Publication type:

Article

Effects of the surface roughness on wetting properties and interfacial reactions between SAC305 solder and Cu substrate with Ni–W–P coating.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 18, p. 15086, doi. 10.1007/s10854-020-04072-5

By:

Cheng, Jinxuan;
Hu, Xiaowu;
Li, Shuang

Publication type:

Article

Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 17, p. 14714, doi. 10.1007/s10854-020-04035-w

By:

Cheng, Jinxuan;
Hu, Xiaowu;
Li, Qinglin

Publication type:

Article

Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 14, p. 11470, doi. 10.1007/s10854-020-03695-y

By:

Cheng, Jinxuan;
Hu, Xiaowu;
Zhang, Zhe;
Li, Qinglin

Publication type:

Article

Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 5, p. 3876, doi. 10.1007/s10854-020-02933-7

By:

Xu, Tao;
Hu, Xiaowu;
Li, Jiayin;
Li, Qinglin

Publication type:

Article

Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 3, p. 2320, doi. 10.1007/s10854-019-02764-1

By:

Zhang, Xudong;
Hu, Xiaowu;
Jiang, Xiongxin;
Zhou, Liuru;
Li, Qinglin

Publication type:

Article

Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 24, p. 21126, doi. 10.1007/s10854-019-02483-7

By:

Yi, Xiong;
Yi, Guangbin;
Hu, Xiaowu;
Li, Qinglin;
Zhang, Ruhua

Publication type:

Article

Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 14791, doi. 10.1007/s10854-019-01852-6

By:

Cheng, Jinxuan;
Hu, Xiaowu;
Li, Qinglin

Publication type:

Article

Effect of Cu6Sn5 nanoparticles size on the properties of Sn0.3Ag0.7Cu nano-composite solders and joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 14726, doi. 10.1007/s10854-019-01844-6

By:

Min, Zhixian;
Qiu, Yu;
Hu, Xiaowu;
Wang, Haozhong

Publication type:

Article

Effect of flux doped with Cu6Sn5 nanoparticles on the interfacial reaction of lead-free solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11552, doi. 10.1007/s10854-019-01512-9

By:

Wang, Haozhong;
Hu, Xiaowu;
Li, Qinglin;
Qu, Min

Publication type:

Article

Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 10, p. 9410, doi. 10.1007/s10854-019-01271-7

By:

Zhang, Xudong;
Hu, Xiaowu;
Jiang, Xiongxin;
Li, Qinglin;
Zhou, Liuru

Publication type:

Article

Effects of co-activator species and transition metal ions doping on structure and fluorescence properties of strontium aluminate phosphors.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 4, p. 3804, doi. 10.1007/s10854-019-00664-y

By:

Hu, Xiaowu;
Wu, Limin;
Yin, Hao;
Li, Guizhi;
Guo, Dongcai

Publication type:

Article

Effect of Ni addition into the Cu substrate on the interfacial IMC growth during the liquid-state reaction with Sn-58Bi solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 2, p. 1907, doi. 10.1007/s10854-018-0464-4

By:

Hu, Xiaowu;
Qiu, Hongyu;
Jiang, Xiongxin

Publication type:

Article

Growth behavior of IMCs layer of the Sn-35Bi-1Ag on Cu, Ni-P/Cu and Ni-Co-P/Cu substrates during aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 2, p. 1519, doi. 10.1007/s10854-018-0423-0

By:

Li, Yulong;
Wang, Zhiliang;
Li, Xuewen;
Hu, Xiaowu;
Lei, Min

Publication type:

Article

Synergetic effect of strain rate and electroplated Cu film for shear strength of solder/Kovar joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 2, p. 1434, doi. 10.1007/s10854-018-0413-2

By:

Hu, Xiaowu;
Bao, Nifa;
Min, Zhixian

Publication type:

Article

Effects of In addition on the wettability, interfacial characterization and properties of ternary Sn-Cu-Ni solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 21, p. 18840, doi. 10.1007/s10854-018-0009-x

By:

Hu, Xiaowu;
Lai, Yanqing;
Jiang, Xiongxin;
Li, Yulong

Publication type:

Article

Effect of Cu6Sn5 nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3.0Ag0.5Cu solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 18, p. 15983, doi. 10.1007/s10854-018-9684-x

By:

Hu, Xiaowu;
Qiu, Yu;
Jiang, Xiongxin;
Li, Yulong

Publication type:

Article

Wetting kinetics and spreading phenomena of Sn-35Bi-1Ag solder on different substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 16, p. 13914, doi. 10.1007/s10854-018-9524-z

By:

Li, Yulong;
Wang, Zhiliang;
Long, Weifeng;
Lei, Min;
Hu, Xiaowu

Publication type:

Article

Interfacial microstructure evolution and shear strength of Sn0.7Cu-xNi/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 13, p. 11314, doi. 10.1007/s10854-018-9219-5

By:

Lai, Yanqing;
Hu, Xiaowu;
Li, Yulong;
Jiang, Xiongxin

Publication type:

Article

Interfacial reaction between liquid-state Sn-xBi solder and Co substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 11, p. 9155, doi. 10.1007/s10854-018-8943-1

By:

Qiu, Yu;
Hu, Xiaowu;
Li, Yulong;
Jiang, Xiongxin

Publication type:

Article

Effects of thermal aging on growth behavior of interfacial intermetallic compound of dip soldered Sn/Cu joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 10, p. 8863, doi. 10.1007/s10854-018-8904-8

By:

Bao, Nifa;
Hu, Xiaowu;
Li, Yulong;
Jiang, Xiongxin

Publication type:

Article

The growth behavior of interfacial intermetallic compound between Sn-3.5Ag-0.5Cu solder and Cu substrate under different thermal-aged conditions.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 24, p. 18515, doi. 10.1007/s10854-017-7799-0

By:

Xu, Tao;
Hu, Xiaowu;
Li, Yulong;
Jiang, Xiongxin

Publication type:

Article

Interfacial reaction and IMCs growth behavior of Sn3Ag0.5Cu/Ni solder bump during aging at various temperatures.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4245, doi. 10.1007/s10854-016-4288-9

By:

Hu, Xiaowu;
Xu, Tao;
Jiang, Xiongxin;
Li, Yulong

Publication type:

Article

A study on the interfacial reaction of Sn58Bi/Cu soldered joints under various cooling and aging conditions.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 7, p. 5140, doi. 10.1007/s10854-015-3042-z

By:

Hu, Xiaowu;
Huang, Qiang;
Li, Yulong;
Liu, Yi;
Min, Zhixian

Publication type:

Article

Effect of alloying Cu substrate on microstructure and coarsening behavior of CuSn grains of soldered joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 5, p. 2782, doi. 10.1007/s10854-015-2759-z

By:

Yu, Xiao;
Hu, Xiaowu;
Li, Yulong;
Zhang, Ruhua

Publication type:

Article

Tensile properties of Cu/Sn-58Bi/Cu soldered joints subjected to isothermal aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 6, p. 2416, doi. 10.1007/s10854-014-1883-5

By:

Yu, Xiao;
Hu, Xiaowu;
Li, Yulong;
Liu, Teng;
Zhang, Ruhua;
Min, Zhixian

Publication type:

Article

Growth behavior of interfacial Cu-Sn intermetallic compounds of Sn/Cu reaction couples during dip soldering and aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 936, doi. 10.1007/s10854-013-1667-3

By:

Hu, Xiaowu;
Ke, Zunrong

Publication type:

Article

Effect of strain rate on interfacial fracture behaviors of Sn-58Bi/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 57, doi. 10.1007/s10854-013-1548-9

By:

Hu, Xiaowu;
Yu, Xiao;
Li, Yulong;
Huang, Qiang;
Liu, Yi;
Min, Zhixian

Publication type:

Article