Found: 18
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Dipping Process Characteristics Based on Image Processing of Pictures Captured by High-speed Cameras.
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- Nano-Micro Letters, 2015, v. 7, n. 1, p. 1, doi. 10.1007/s40820-014-0012-6
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- Article
Thermo-compression bonding process characteristics and shape control of Cu-pillar microbump joints by optimizing of solder melting.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10471, doi. 10.1007/s10854-022-08034-x
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- Article
Graphene/Glycerin Solution-Based Multifunctional Stretchable Strain Sensor with Ultra-High Stretchability, Stability, and Sensitivity.
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- Nanomaterials (2079-4991), 2019, v. 9, n. 4, p. 617, doi. 10.3390/nano9040617
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- Article
A Case-Control Study on Factors of HPV Vaccination for Mother and Daughter in China.
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- Vaccines, 2023, v. 11, n. 5, p. 976, doi. 10.3390/vaccines11050976
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- Article
Fabrication of a Robust and Porous MnO<sub>2</sub> Electrode as the Cathode for High‐Performance Aqueous Zinc‐Ion Batteries.
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- Energy Technology, 2023, v. 11, n. 12, p. 1, doi. 10.1002/ente.202300605
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- Article
Comparison of Fundamental Frequency and Sweep Resistance of Different Wire Loops Using Finite Element Model.
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- International Journal of Structural Stability & Dynamics, 2015, v. 15, n. 1, p. -1, doi. 10.1142/S0219455414500321
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- Article
Reducing the Rebound Effect in Microscale Laser Dynamic Forming through Multi-Pulse Laser Shock Loading.
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- Metals (2075-4701), 2024, v. 14, n. 8, p. 945, doi. 10.3390/met14080945
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- Article
Re-Os Geochronology of the Liuchapo Formation across the Ediacaran-Cambrian Boundary of the Yangtze Block (South China).
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- Journal of Earth Science, 2022, v. 33, n. 1, p. 25, doi. 10.1007/s12583-021-1473-4
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- Article
Fabrication of microcopper arcs using localized electrochemical deposition.
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- Journal of Solid State Electrochemistry, 2023, v. 27, n. 8, p. 1983, doi. 10.1007/s10008-023-05440-x
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- Article
Fabrication of micro-sized-copper column array through localized electrochemical deposition using 20-μm-diameter micro-anode.
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- Journal of Solid State Electrochemistry, 2022, v. 26, n. 3, p. 799, doi. 10.1007/s10008-021-05095-6
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- Article
Experiment and simulation of single inhibitor SH110 for void-free TSV copper filling.
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- Scientific Reports, 2021, v. 11, n. 1, p. 1, doi. 10.1038/s41598-021-91318-9
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- Article
Combined effects of Choquard and singular nonlinearities in fractional Kirchhoff problems.
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- Advances in Nonlinear Analysis, 2021, v. 10, n. 1, p. 636, doi. 10.1515/anona-2020-0150
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- Article
CTAB-Modulated Electroplating of Copper Micropillar Arrays for Non-Enzymatic Glucose Sensing with Improved Sensitivity.
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- Sensors (14248220), 2024, v. 24, n. 5, p. 1603, doi. 10.3390/s24051603
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- Article
Dynamic through-silicon-via filling process using copper electrochemical deposition at different current densities.
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- Scientific Reports, 2017, p. 46639, doi. 10.1038/srep46639
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- Article
Effects of applied potential and the initial gap between electrodes on localized electrochemical deposition of micrometer copper columns.
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- Scientific Reports, 2016, p. 26270, doi. 10.1038/srep26270
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- Article
Dispensing of high concentration Ag nano-particles ink for ultra-low resistivity paper-based writing electronics.
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- Scientific Reports, 2016, p. 21398, doi. 10.1038/srep21398
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- Article
Impact of Hydrogen Voiding in Chip-to-Chip Electroless All-Copper Interconnections.
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- Micromachines, 2024, v. 15, n. 5, p. 612, doi. 10.3390/mi15050612
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- Article
Hybrid low‐temperature sintering processes of electro‐ceramics.
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- Journal of the American Ceramic Society, 2024, v. 107, n. 3, p. 1996, doi. 10.1111/jace.19539
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- Article